Stress engineering using AlN/GaN superlattices for epitaxy of GaN on 200 mm Si wafers
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ABSTRACTStress control using AlN/GaN superlattices (SLs) for epitaxy of GaN on 200 mm Si (111) substrates is reported. Crack-free 2 μm GaN layers were grown over structures containing 50 to 100 pairs of 3-5 nm AlN/10-30 nm GaN SLs. Compressive and tensile stress can be precisely adjusted by changing the thickness of the AlN and GaN layers in the SLs. For a constant period thickness, the effects of growth conditions, such as growth rate of GaN, V/III ratio during AlN growth, and growth temperature, on wafer stress were investigated.
2018 ◽
Vol 924
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pp. 35-38
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1998 ◽
Vol 13
(7)
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pp. 2003-2014
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2008 ◽
Vol 600-603
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pp. 207-210
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