Copper Oxide Edge-Termination for GaN Schottky Barrier Diodes with Low Turn-on Voltage

2012 ◽  
Vol 1396 ◽  
Author(s):  
Yuichi Minoura ◽  
Naoya Okamoto ◽  
Masahito Kanamura ◽  
Tadahiro Imada ◽  
Toshihiro Ohki ◽  
...  

ABSTRACTIn this study, we propose copper oxide (CuOx) edge-termination for GaN-based Schottky barrier diodes (SBDs) with low turn-on voltage. CuOx fabricated by thermal oxidization of sputtered Cu film at 275°C consisted mainly of Cu2O which is known as a p-type semiconductor. We applied CuOx edge-termination to GaN SBDs with tantalum (Ta) Schottky electrode which has low work function of 4.25 eV. The experimental results of current-voltage characteristics insisted that CuOx edge-termination structure was effective to increase breakdown voltage of GaN SBDs with keeping low turn-on voltage of 0.29 V at 10 A/cm2.

1999 ◽  
Vol 572 ◽  
Author(s):  
Q. Zhang ◽  
V. Madangarli ◽  
S. Soloviev ◽  
T. S. Sudarshan

ABSTRACTP-type 6H SiC Schottky barrier diodes with good rectifying characteristics upto breakdown voltage as high as 1000V have been successfully fabricated using metal-overlap over a thick oxide layer (∼ 6000 Å) as edge termination and Al as the barrier metal. The influence of the oxide layer edge termination in improving the reverse breakdown voltage as well as the forward current – voltage characteristics is presented. The terminated Schottky diodes indicate a factor of two higher breakdown voltage and 2–3 times larger forward current densities than those without edge termination. The specific series resistance of the unterminated diodes was ∼228 mΩ-cm2, while that of the terminated diodes was ∼84 mΩ-cm2.


1992 ◽  
Vol 28 (3) ◽  
pp. 296 ◽  
Author(s):  
R.S. Spraggs ◽  
G. Pananakakis ◽  
D. Bauza ◽  
K.J. Reeson ◽  
B.J. Sealy

2009 ◽  
Vol 615-617 ◽  
pp. 963-966 ◽  
Author(s):  
Taku Horii ◽  
Tomihito Miyazaki ◽  
Yu Saito ◽  
Shin Hashimoto ◽  
Tatsuya Tanabe ◽  
...  

Gallium nitride (GaN) vertical Schottky barrier diodes (SBDs) with a SiNx field plate (FP) structure on low-dislocation-density GaN substrates have been designed and fabricated. We have successfully achieved the SBD breakdown voltage (Vb) of 680V with the FP structure, in contrast to that of 400V without the FP structure. There was no difference in the forward current-voltage characteristics with a specific on-resistance (Ron) of 1.1mcm2. The figure of merit V2b/Ron of the SBD with the FP structure was 420MWcm-2. The FP structure and the high quality drift layers grown on the GaN substrates with low dislocation densities have greatly contributed to the obtained results.


1997 ◽  
Vol 41 (5) ◽  
pp. 802-805 ◽  
Author(s):  
S Arulkumaran ◽  
J Arokiaraj ◽  
N Dharmarasu ◽  
J Kumar ◽  
P Magudapathy ◽  
...  

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