A Detailed Study of a Novel Wafer Separation Method for Surface Sensitive MEMS Wafers

2012 ◽  
Vol 1415 ◽  
Author(s):  
K. Malachowski ◽  
S. Severi ◽  
R. Van Hoof ◽  
S. Sangameswaran ◽  
S. Genda ◽  
...  
Keyword(s):  
Process Integration ◽  
Separation Method ◽  
Work Design ◽  
Back Side ◽  
Design Rules ◽  
Micro Electro Mechanical Systems ◽  
Particle Contamination ◽  
Before And After ◽  
Common Technique ◽  
Process Speed

ABSTRACTAbrasive blade dicing is the most common technique for die separation. In this work an alternative dry and non-abrasive die separation method, which is known as "Stealth dicing", is assessed for surface-sensitive MEMS (Micro Electro Mechanical Systems) wafers. The dicing performance and capability of the system is investigated on 200mm full thickness wafers with and without MEMS structures. The diced wafers are analyzed with respect to the silicon cutting quality, possible particle contamination, the condition of functional structures and their mechanical and electrical functionality. In addition the performance and limitations of two different Stealth Dicing Engine (SDE) types, SDE01 and SDE03, are compared to each other with respect to their performance on MEMS wafer dicing.From this work design rules and proper dimensions of the scribe line can be determined. Process integration solutions, describing steps before and after the Stealth dicing process, including the contact-less dicing tape application to the wafer back side and the final die separation method by tape stretching, are presented. It was also found that the SDE03 laser with its outstanding performance in terms of process speed and separation quality can bring a breakthrough for applying this technology for MEMS wafers.

scholarly journals A new dynamic model to optimize the reliability of the series-parallel systems under warm standby components

2021 ◽  
Vol 0 (0) ◽  
pp. 0
Author(s):  
Amir Mohammad Fakoor Saghih ◽  
Azam Modares
Keyword(s):  
Dynamic Models ◽  
Failure Time ◽  
Recursive Formula ◽  
Reliability Function ◽  
Mode Analysis ◽  
Redundancy Allocation ◽  
Failure Time Distribution ◽  
Before And After ◽  
Common Technique ◽  
Warm Standby

<p style='text-indent:20px;'>Redundancy allocation problem (RAP) is a common technique for increasing the reliability of systems. In this paper, a new model for the RAP is introduced that takes into account the warm standby and mixed strategy, the model dynamics, and the type of the strategy in redundancy allocation problems. A recursive formula is first obtained for the reliability function in the dynamic warm standby and mixed redundancy strategies that leverages the success mode analysis and works for any arbitrary failure-time distribution. Failure rates for warm standby units change before and after their replacement with a damaged unit, and, therefore, the reliability function in warm standby varies with time (i.e., the model is dynamic). Although dynamic models are commonplace in practice, they are more challenging to assess than static models, which have been mainly considered in the literature. An optimization problem is then formulated to select the best redundancy strategy and redundancy levels. Genetic algorithm and particle swarm optimization are leveraged to solve the problem. Finally, the efficiency of the presented method is verified through a numerical example. The experimental results verify that the proposed model for RAP significantly improves the system reliability, which can be of vital importance for system designers.</p>

Reliability Study of Reference Semiconductor Encapsulation Materials for Biocompatible Packaging

2012 ◽  
Vol 2012 (1) ◽  
pp. 000148-000153
Author(s):  
Karl Malachowski ◽  
Karen Qian ◽  
Maaike Op de Beeck ◽  
Rita Verbeeck ◽  
George Bryce ◽  
...  
Keyword(s):  
Elevated Temperatures ◽  
Process Integration ◽  
Material Selection ◽  
Semiconductor Industry ◽  
Electrical Performance ◽  
Integration Scheme ◽  
Back Side ◽  
Wafer Level ◽  
Nitride Layers

Material selection is the key issue when developing a biocompatible packaging process for implantable electronic systems. To secure a reliable performance of the chip in such a package, its encapsulation has to be considered up-front in the wafer-level integration scheme. A differentiation of two main material types can be made:1) Insulating or passive materials functioning as a bi-directional diffusion barrier preventing body fluids leaking into the package causing systems malfunction due to possible materials corrosion and also avoiding a leakage of built-in materials to the in-vivo environment and2) Conductive or active materials as diffusion barriers, e.g. against copper diffusion or as direct external contacts responsible for electrical performance of the system. This study investigates the properties of two widely used insulating materials in the semiconductor industry, the nitride and the oxide. Both material types are deposited in a PECVD system using different temperatures; 400 ° C for CMOS compatibility and 200 ° C for wafer back side process integration when a temporary carrier system is used. The biocompatibility investigations of these materials (evaluated using cell lines and primary cells) show promising results. However, for the long term application, the stability results for the oxide layers show hydration effects resulting in material degradation where the nitride layers clearly show corrosion and are even etched when elevated temperatures are applied. This fact is surprising since nitride layers are widely used as a humidity barrier for various chip types but obviously not suitable for a direct contact with liquids. Various analysis methods using e.g. Fourier Transformed IR Spectroscopy or mass measurements substantiate this thesis.

Template Calibration Parameter Optimization of Fuzzy Vault Method

2019 ◽  
Vol 34 (07) ◽  
pp. 2059020
Author(s):  
Yifan Liao
Keyword(s):  
Hash Table ◽  
Rejection Rate ◽  
Base Point ◽  
Matching Accuracy ◽  
Fuzzy Vault ◽  
Fuzzy Point ◽  
Before And After ◽  
Common Technique ◽  
Point Distance ◽  
Fingerprint Database

In the concrete implementation of the fuzzy vault algorithm, the geometric hash method is a common technique for automatic calibration of biometric templates. For the fuzzy problem of parameter acquisition, the matching accuracy of fuzzy vault template is affected in the three parameters: the pixel size, hash table and hash table quantization parameters ([Formula: see text] and [Formula: see text]). The single factor experiment method obtains the optimal range of these three parameters, and the extraction range of the fuzzy point and the selection rule of the base point distance are improved for the fuzzy vault algorithm. Finally, based on the FVC fingerprint database, their matching precision is compared for the algorithm before and after optimization. The experimental results show that the false rejection rate (FRR) of the optimized algorithm is reduced by at least 9.84%, and the false acceptance rate (FAR) is reduced by at least 7.12%, indicating that the optimization scheme improves the matching accuracy of the algorithm. The algorithm has certain robustness and practicability.

Design and Fabrication of Microfluidics Paper-Based Devices for Contaminant Detection Using aWax Printer

2021 ◽  
Vol 2021 (16) ◽  
pp. 339-1-339-8
Author(s):  
Qiyue Liang ◽  
Min Zhao ◽  
George T. C. Chiu ◽  
Jan P. Allebach
Keyword(s):  
Image Processing ◽  
Microfluidic Device ◽  
Low Cost ◽  
Cost Effective ◽  
Back Side ◽  
Minimum Width ◽  
Before And After ◽  
Wax Printing ◽  
Multiple Devices ◽  
Processing Techniques

In this paper, we introduce an eight-channel paper-based microfluidic device that aims to detect multiple chemicals at once. The microfluidic device we propose is fabricated by wax printing on filter paper, which is trouble-free to handle, low cost, and easy to fabricate. As a hydrophobic material, wax (solid ink) defines the hydrophilic channels for testing. By using image processing techniques, we analyze the width change caused by heating of wax strokes and wax channels, which is a necessary step in the wax printing fabrications. In the same way, we test the minimum width of a channel that allows solutions to cross through and the minimum width of a barrier that is hydrophobic and blocks liquid flow. We also compare two different heating methods, the heat gun and the hot plate, by checking the wax channel width before and after heating based on our image processing pipeline. We conclude that a heat gun will be better for heating channels with relatively large widths. Using high resolution wax printing, we integrate multiple devices on a single paper, which makes this method very cost-effective. Lamination of wax-printed paper based devices is also analyzed, as leakage on the back side of paper is sometimes worth attention.

scholarly journals Wet-Treated MSWI Fly Ash Used as Supplementary Cementitious Material

2015 ◽  
Vol 2015 ◽  
pp. 1-8 ◽  
Author(s):  
Martin Keppert ◽  
Jamal Akhter Siddique ◽  
Zbyšek Pavlík ◽  
Robert Černý
Keyword(s):  
Fly Ash ◽  
Waste Incineration ◽  
Cementitious Material ◽  
Mswi Fly Ash ◽  
Supplementary Cementitious Material ◽  
Before And After ◽  
Heavy Metal Immobilization ◽  
Common Technique ◽  
Strength And Durability ◽  
The Impact

Municipal solid waste incineration (MSWI) is a common technique in treatment of domestic waste. This technique annually produces approximately 25 Mt solid residues (i.e., bottom and fly ash) worldwide which is also a major issue in current research. In this research we are concerned with reusing the fly ash (FA) as supplementary cementitious material (SCM) in concrete. Such application solves the problem with heavy metal immobilization as well. To remove the high content of undesired soluble salts, number of washing treatments has been applied. Chemical composition of FA has been examined before and after treatments. The impact of cement substitution by FA in concrete was evaluated by measurement of its compressive strength and durability.

scholarly journals The Analysis of Micro-Scale Deformation and Fracture of Carbonized Elastomer-Based Composites by In Situ SEM

Molecules ◽  
2021 ◽  
Vol 26 (3) ◽  
pp. 587
Author(s):  
Eugene S. Statnik ◽  
Semen D. Ignatyev ◽  
Andrey A. Stepashkin ◽  
Alexey I. Salimon ◽  
Dilyus Chukov ◽  
...  
Keyword(s):  
Structural Engineering ◽  
Elastic Moduli ◽  
Carbon Composite ◽  
Image Correlation ◽  
Butadiene Rubber ◽  
Sem Images ◽  
Micro Electro Mechanical Systems ◽  
Strength Limit ◽  
Before And After

Carbonized elastomer-based composites (CECs) possess a number of attractive features in terms of thermomechanical and electromechanical performance, durability in aggressive media and facile net-shape formability, but their relatively low ductility and strength limit their suitability for structural engineering applications. Prospective applications such as structural elements of micro-electro-mechanical systems MEMS can be envisaged since smaller principal dimensions reduce the susceptibility of components to residual stress accumulation during carbonization and to brittle fracture in general. We report the results of in situ in-SEM study of microdeformation and fracture behavior of CECs based on nitrile butadiene rubber (NBR) elastomeric matrices filled with carbon and silicon carbide. Nanostructured carbon composite materials were manufactured via compounding of elastomeric substance with carbon and SiC fillers using mixing rolling mill, vulcanization, and low-temperature carbonization. Double-edge notched tensile (DENT) specimens of vulcanized and carbonized elastomeric composites were subjected to in situ tensile testing in the chamber of the scanning electron microscope (SEM) Tescan Vega 3 using a Deben microtest 1 kN tensile stage. The series of acquired SEM images were analyzed by means of digital image correlation (DIC) using Ncorr open-source software to map the spatial distribution of strain. These maps were correlated with finite element modeling (FEM) simulations to refine the values of elastic moduli. Moreover, the elastic moduli were derived from unloading curve nanoindentation hardness measurements carried out using a NanoScan-4D tester and interpreted using the Oliver–Pharr method. Carbonization causes a significant increase of elastic moduli from 0.86 ± 0.07 GPa to 14.12 ± 1.20 GPa for the composite with graphite and carbon black fillers. Nanoindentation measurements yield somewhat lower values, namely, 0.25 ± 0.02 GPa and 9.83 ± 1.10 GPa before and after carbonization, respectively. The analysis of fractography images suggests that crack initiation, growth and propagation may occur both at the notch stress concentrator or relatively far from the notch. Possible causes of such response are discussed, namely, (1) residual stresses introduced by processing; (2) shape and size of fillers; and (3) the emanation and accumulation of gases in composites during carbonization.

Investigation of Different Techniques to Evaluate the FLC from Experiments and FE Simulations

2014 ◽  
Vol 611-612 ◽  
pp. 41-48 ◽  
Author(s):  
Anders Groth ◽  
Erik Schedin ◽  
Ramin Moshfegh
Keyword(s):  
Interpolation Method ◽  
Research Centre ◽  
Forming Limit ◽  
Fe Model ◽  
Forming Limit Curve ◽  
Punch Force ◽  
Before And After ◽  
Common Technique ◽  
Further Development ◽  
Principal Strains

The formability of sheet metal is highly related to the materials resistance to strain localisation and fracture. The Forming Limit Curve (FLC) is one way to evaluate the tendency to instabilities during the forming operation of a material for different strain states. The Nakazima test is a common technique used to experimentally determine the limiting strains. In this paper a slightly modified version of the proposed ISO-standard used at Outokumpu/Avesta Research Centre (ARC) is presented. The method considers the limiting principal strains before and after failure has occurred. The obtained results from the present approach are compared with previous internal methods used at the company. The previous internal methods consisted of evaluating the limiting principal strains at the maximum punch force before fracture or at a set punch distance before fracture. An austenitic stainless steel grade (254 SMO®) is used in the study. The method will in this work be called the Interpolation Method (IM). A Finite Element (FE) model of the Nakazima test is modelled in LS-DYNA® with the goal to be able to simulate the experimental test. In order to compare the FLC between the experimental and the numerical results, one instability indicator is proposed based on the onset of fracture in the FE model.The Barlat YLD2000 model [1] using 6 parameters based on proof stresses and anisotropic values for different material directions is applied as a constitutive model. The Interpolation Method is promising and will be used during a trial period at Outokumpu ARC in the future testing. Further development is needed for the simulation model.

scholarly journals Newly Designed Electrostatic Wafer Chuck Resulting in Less Particle Contamination on Back Side of Wafers.

Shinku ◽  
1998 ◽  
Vol 41 (3) ◽  
pp. 139-142
Author(s):  
Azusa SIMAMURA ◽  
Nobuo TSUMAKI ◽  
Hiroyuki KITSUNAI ◽  
Tadashi OTAKA
Keyword(s):  
Back Side ◽  
Particle Contamination

Residual Stress of Silicon Films Deposited by Lpcvd From Silane

1998 ◽  
Vol 518 ◽  
Author(s):  
P. Temple-Boyer ◽  
E. Imbernon ◽  
B. Rousset ◽  
E. Scheid
Keyword(s):  
Residual Stress ◽  
Polycrystalline Silicon ◽  
Chemical Vapour ◽  
Silicon Films ◽  
Back Side ◽  
Deposition Parameters ◽  
Before And After ◽  
Pressure Chemical ◽  
Polycrystalline Silicon Films ◽  
Stress Variations

AbstractIn this paper, amorphous, semi-crystalline and polycrystalline silicon films have been deposited by low pressure chemical vapour deposition (LPCVD) from silane SiH4 by ranging the deposition temperature from 555 to 635°C and the total pressure from 100 to 300 millitorrs. Films residual stresses have been determined thanks to the formula of Stoney by measurements of the wafer curvature before and after removal of the back side deposition. The influences of the different deposition parameters are reported and major stress variations are evidenced. By studying the effects of a 600°C crystallisation anneal and by comparing them to those observed for amorphous silicon films deposited from disilane Si2H6, compressive and tensile stresses are respectively related to “surface” and “volume” crystallisation phenomena. The different stress values of amorphous and polycrystalline silicon have been estimated and, according to these results, solutions are finally proposed in order to have a real control of residual stress into silicon depositions and to obtain low stress (σ ≈ 0) polysilicon films.

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