Grating Coupled Waveguide Biosensor Based on Porous Silicon

2011 ◽  
Vol 1301 ◽  
Author(s):  
Xing Wei ◽  
Sharon M. Weiss

ABSTRACTPorous silicon waveguides with integrated porous silicon grating couplers are demonstrated as small molecule biosensors. Two fabrication methods are presented for the grating couplers: standard electron beam lithography with reactive ion etching and a new technique based on direct imprinting of porous substrates. Although the gratings fabricated using standard lithographic techniques have steeper sidewalls and enable a larger available sensing surface area inside the waveguide, the imprinted gratings have the advantage of rapid and low-cost fabrication. Both the lithographically and imprinted sensors are shown to have waveguide losses on the order of 10 dB/cm, and both are demonstrated for detection of 16mer nucleic acids.

2017 ◽  
Vol 28 (46) ◽  
pp. 465301 ◽  
Author(s):  
M Salvato ◽  
R Baghdadi ◽  
C Cirillo ◽  
S L Prischepa ◽  
A L Dolgiy ◽  
...  

2014 ◽  
Vol 123 ◽  
pp. 1-3
Author(s):  
Jens Bolten ◽  
Christel Manecke ◽  
Thorsten Wahlbrink ◽  
Michael Waldow ◽  
Heinrich Kurz

2003 ◽  
Vol 74 (7) ◽  
pp. 3579-3582 ◽  
Author(s):  
G. Pennelli ◽  
F. D’ Angelo ◽  
M. Piotto ◽  
G. Barillaro ◽  
B. Pellegrini

2003 ◽  
Vol 15 (17) ◽  
pp. 1465-1469 ◽  
Author(s):  
M. Rocchia ◽  
S. Borini ◽  
A.M. Rossi ◽  
L. Boarino ◽  
G. Amato

2009 ◽  
Vol 60-61 ◽  
pp. 228-231
Author(s):  
Mei Liu ◽  
Jian Zhu ◽  
Shi Xing Jia ◽  
Min Zhuo ◽  
Le Lu ◽  
...  

We report our efforts towards fabricating nanomechanical resonators patterned by optical lithography in silicon nitride. Optical lithography has advantages of low cost and high efficiency over electron-beam lithography. Double clamped beam resonators with thickness 150nm, length and lateral dimensions 20um, 800nm have been designed. Through utilizing reactive ion etching and controlling gas flow, reaction time of CF4 and O2 plasma and power of the upper and lower electrode, nanomechanical resonators with lateral dimensions within 200nm are demonstrated.


2019 ◽  
Vol 8 (3-4) ◽  
pp. 253-266
Author(s):  
Noriyuki Unno ◽  
Jun Taniguchi

Abstract Nanostructures have unique characteristics, such as large specific surface areas, that provide a wide range of engineering applications, such as electronics, optics, biotics, and thermal and fluid dynamics. They can be used to downsize many engineering products; therefore, new nanofabrication techniques are strongly needed to meet this demand. A simple fabrication process with high throughput is necessary for low-cost nanostructures. In recent years, three-dimensional (3D) nanostructures have attracted much attention because they dramatically opened up new fields for applications. However, conventional techniques for fabricating 3D nanostructures contain many complex processes, such as multiple patterning lithography, metal deposition, lift-off, etching, and chemical-mechanical polishing. This paper focuses on controlled-acceleration-voltage electron beam lithography (CAV-EBL), which can fabricate 3D nanostructures in one shot. The applications of 3D nanostructures are introduced, and the conventional 3D patterning technique is compared with CAV-EBL and various 3D patterning techniques using CAV-EBL with nanoimprinting technology. Finally, the outlook for next-generation devices that can be fabricated by CAV-EBL is presented.


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