Diameter Dependent Current-Voltage Characteristics of InSb Nanowires

2011 ◽  
Vol 1350 ◽  
Author(s):  
Miroslav Penchev ◽  
Jiebin Zhong ◽  
Jian Lin ◽  
Cengiz S. Ozkan ◽  
Mihrimah Ozkan
Keyword(s):  
Electron Microscopy ◽  
Indium Antimonide ◽  
Field Effect Transistors ◽  
Chemical Vapor ◽  
Gate Insulator ◽  
Nanowire Diameter ◽  
Back Gate ◽  
Transmission Electron ◽  
Current Voltage ◽  
Insb Nanowires

ABSTRACTSingle crystalline Indium Antimonide (InSb) nanowires were synthesized by chemical vapor deposition (CVD) technique, using gold (Au) nanoparticles as catalyst, via a vapor liquid solid mechanism. Structural properties of the as-grown InSb nanowires were investigated by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Nanowire field effect transistors (NWFETs) were fabricated in back-gate configuration, on Si/SO2 substrates, using SiO2 as gate insulator. The diameter of InSb nanowires used in the fabricated devices varied from 15-80 nm. Current-voltage measurements were conducted to determine the dependence of NWFETs parameters on the InSb nanowire diameter. Carrier mobility was shown to decrease with decrease of nanowire diameter. Temperature dependen current-voltage measurements were conducted to determine the effect of operating temperature on the InSb NWFET device performance.

A study of Al2O3:C films on Si(100) grown by low pressure MOCVD

2002 ◽  
Vol 747 ◽  
Author(s):  
M. P. Singh ◽  
C. S. Thakur ◽  
N. Bhat ◽  
S. A. Shivashankar
Keyword(s):  
Electron Microscopy ◽  
Photoelectron Spectroscopy ◽  
High Frequency ◽  
Aluminium Oxide ◽  
Chemical Vapor ◽  
Charge Trapping ◽  
X Ray ◽  
Transmission Electron ◽  
Current Voltage ◽  
Low Pressure Mocvd

ABSTRACTWe report the characterization of carbonaceous aluminium oxide, Al2O3:C, films grown on Si(100) by metalorganic chemical vapor deposition. The focus is on the study of the effects of carbon on the dielectric properties of aluminium oxide in a qualitative manner. The carbon present in the aluminium oxide film derives from aluminium acetylacetonate used as the source of aluminium. As-grown films comprise nanometer-sized grains of alumina (∼ 20–50 nm) in an amorphous carbonaceous matrix, as examined by X-ray diffractometry (XRD) and transmission electron microscopy (TEM). The films are shiny; they are smooth as observed by scanning electron microscopy (SEM). An attempt has been made to explore the defects (viz., oxide charge density) in the aluminium oxide films using room temperature high frequency capacitance – voltage (C-V) and current–voltage (I-V) measurements. The hysteresis and stretch-out in the high frequency C-V plots is indicative of charge trapping. The role of heteroatoms, as characterized by X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FTIR) spectroscopy, in the transport of charge in Al2O3:C films is discussed.

A study of Al2O3:C films on Si(100) grown by low pressure MOCVD

2002 ◽  
Vol 745 ◽  
Author(s):  
M. P. Singh ◽  
C. S. Thakur ◽  
N. Bhat ◽  
S. A. Shivashankar
Keyword(s):  
Electron Microscopy ◽  
Photoelectron Spectroscopy ◽  
High Frequency ◽  
Aluminium Oxide ◽  
Chemical Vapor ◽  
Charge Trapping ◽  
X Ray ◽  
Transmission Electron ◽  
Current Voltage ◽  
Low Pressure Mocvd

ABSTRACTWe report the characterization of carbonaceous aluminium oxide, Al2O3:C, films grown on Si(100) by metalorganic chemical vapor deposition. The focus is on the study of the effects of carbon on the dielectric properties of aluminium oxide in a qualitative manner. The carbon present in the aluminium oxide film derives from aluminium acetylacetonate used as the source of aluminium. As-grown films comprise nanometer-sized grains of alumina (∼ 20–50 nm) in an amorphous carbonaceous matrix, as examined by X-ray diffractometry (XRD) and transmission electron microscopy (TEM). The films are shiny; they are smooth as observed by scanning electron microscopy (SEM). An attempt has been made to explore the defects (viz., oxide charge density) in the aluminium oxide films using room temperature high frequency capacitance – voltage (C-V) and current–voltage (I-V) measurements. The hysteresis and stretch-out in the high frequency C-V plots is indicative of charge trapping. The role of heteroatoms, as characterized by X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FTIR) spectroscopy, in the transport of charge in Al2O3:C films is discussed.

Transmission Electron Microscopy Study of an Epitaxial Gate Oxide on III-N Semiconductor Structures

2004 ◽  
Vol 831 ◽  
Author(s):  
Yoga. N. Saripalli ◽  
X-Q Liu ◽  
D.W. Barlage ◽  
M.A.L. Johnson ◽  
D. Braddock ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Field Effect Transistors ◽  
Gate Oxide ◽  
Gate Insulator ◽  
Oxide Semiconductor ◽  
Organic Chemical ◽  
High Electron ◽  
Semiconductor Interface ◽  
Transmission Electron

ABSTRACTAn effective gate insulator for compound semiconductors has been a challenging goal for the materials research community for nearly 40 years. Recent developments on the epitaxial deposition of complex gate oxides as gate insulators have shown promise with the demonstration of enhancement mode high electron mobility transistors (e-mode HEMTs). In this work, gate oxide epilayers deposited on III-V semiconductors for field effect transistors (III-V MOSFETs) are examined using transmission electron microscopy (TEM) to identify the structure of the oxide/semiconductor interface. The high resolution images of the cross-sectional structures for the first time reveal a crystalline nature of the interface between the oxide and the III-V semiconductor. The composition of the oxide layers are determined by Z-contrast Electron Energy Loss Spectroscopy (EELS). The surface morphology of the FET structures is investigated by atomic force microscopy (AFM) both before and after gate oxide deposition, and the structural results are related to device DC electrical characteristics. With an underlying GaN/InGaN heterojunction grown by metal-organic chemical vapor deposition (MOCVD) on sapphire, the MOSFET devices exhibit the characteristics of a substantially unpinned interface, including the capacity for significant charge accumulation and transconductance at positive gate voltages.

Au-assisted Growth of Indium Antimonide Nanowires by Chemical Vapor Deposition: Temperature and Growth Duration Effects

2011 ◽  
Vol 1350 ◽  
Author(s):  
Jiebin Zhong ◽  
Jian Lin ◽  
Miroslav Penchev ◽  
Mihrimah Ozkan ◽  
Cengiz S. Ozkan
Keyword(s):  
Chemical Vapor Deposition ◽  
Growth Temperature ◽  
Indium Antimonide ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Growth Direction ◽  
Growth Duration ◽  
Transmission Electron ◽  
Temperature And Growth ◽  
Insb Nanowires

ABSTRACTIn this paper, we investigate the morphology variation of Au-assisted epitaxial InSb nanowires (NWs) dependence on growth temperature and growth duration by chemical vapor deposition (CVD). The NW length and tapering factor correlated to the NW morphology are determined as a function of growth temperature (300°C-480°C). Higher density and longer NWs were observed on the substrate as proportional to the growth duration. The growth direction of the NWs is <110> by Transmission Electron Microscopy (TEM) studies. The aim of this study is to gain better understanding of the III-V NWs growth mechanism and achieve control over the growth of InSb NWs.

TEM evaluation of graded SixGe1-x heterolayers

1991 ◽  
Vol 49 ◽  
pp. 894-895
Author(s):  
N. David Theodore ◽  
Mamoru Tomozane ◽  
Ming Liaw
Keyword(s):  
Heterojunction Bipolar Transistors ◽  
Gas Flow ◽  
Field Effect Transistors ◽  
Chemical Vapor ◽  
Dark Field ◽  
Bipolar Transistors ◽  
Structural Quality ◽  
Weak Beam ◽  
Transmission Electron ◽  
And Behavior

There is extensive interest in SiGe for use in heterojunction bipolar transistors. SiGe/Si superlattices are also of interest because of their potential for use in infrared detectors and field-effect transistors. The processing required for these materials is quite compatible with existing silicon technology. However, before SiGe can be used extensively for devices, there is a need to understand and then control the origin and behavior of defects in the materials. The present study was aimed at investigating the structural quality of, and the behavior of defects in, graded SiGe layers grown by chemical vapor deposition (CVD).The structures investigated in this study consisted of Si1-xGex[x=0.16]/Si1-xGex[x= 0.14, 0.13, 0.12, 0.10, 0.09, 0.07, 0.05, 0.04, 0.005, 0]/epi-Si/substrate heterolayers grown by CVD. The Si1-xGex layers were isochronally grown [t = 0.4 minutes per layer], with gas-flow rates being adjusted to control composition. Cross-section TEM specimens were prepared in the 110 geometry. These were then analyzed using two-beam bright-field, dark-field and weak-beam images. A JEOL JEM 200CX transmission electron microscope was used, operating at 200 kV.

Transmission Electron Microscopy (TEM) Specimen Preparation Technique using Focused Ion Beam (FIB): Application to Material Characterization of Chemical Vapor Deposition of Tungsten (W) and Tungsten Silicides (WSix)

1997 ◽  
Author(s):  
K. Doong ◽  
J.-M. Fu ◽  
Y.-C. Huang
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Chemical Vapor ◽  
Specimen Preparation ◽  
Preparation Technique ◽  
Transmission Electron

Abstract The specimen preparation technique using focused ion beam (FIB) to generate cross-sectional transmission electron microscopy (XTEM) samples of chemical vapor deposition (CVD) of Tungsten-plug (W-plug) and Tungsten Silicides (WSix) was studied. Using the combination method including two axes tilting[l], gas enhanced focused ion beam milling[2] and sacrificial metal coating on both sides of electron transmission membrane[3], it was possible to prepare a sample with minimal thickness (less than 1000 A) to get high spatial resolution in TEM observation. Based on this novel thinning technique, some applications such as XTEM observation of W-plug with different aspect ratio (I - 6), and the grain structure of CVD W-plug and CVD WSix were done. Also the problems and artifacts of XTEM sample preparation of high Z-factor material such as CVD W-plug and CVD WSix were given and the ways to avoid or minimize them were suggested.

Low Temperature Large Scale CVD Synthesis of Nano Onion-Like Fullerenes

2012 ◽  
Vol 490-495 ◽  
pp. 3211-3214 ◽  
Author(s):  
Lei Shan Chen ◽  
Cun Jing Wang
Keyword(s):  
Electron Microscopy ◽  
Low Temperature ◽  
Aluminum Hydroxide ◽  
Large Scale ◽  
Iron Catalyst ◽  
Chemical Vapor ◽  
X Ray Diffraction ◽  
Transmission Electron ◽  
Naoh Solution ◽  
Synthesis Reactions

Synthesis reactions were carried out by chemical vapor deposition using iron catalyst supported on aluminum hydroxide at 400 °C and 420 °C, in the presence of argon as carrier gas and acetylene as carbon source. The aluminum hydroxide support was separated by refluxing the samples in 40% NaOH solution for 2 h and 36% HCl solution for 24 h, respectively. The samples were characterized by field-emission scanning electron microscopy, energy dispersive spectroscopy, high-resolution transmission electron microscopy and X-ray diffraction. The results show that carbon nanotubes were the main products at 420 °C, while large scale high purity nano onion-like fullerenes encapsulating Fe3C, with almost uniform sizes ranging from 10-50 nm, were obtained at the low temperature of 400 °C.

scholarly journals Fabrication and Physical Properties of Single-Crystalline Βeta-FeSi2 Nanowires

2020 ◽  
Vol 15 (1) ◽  
Author(s):  
Chih-Yung Yang ◽  
Shu-Meng Yang ◽  
Yu-Yang Chen ◽  
Kuo-Chang Lu
Keyword(s):  
Electron Microscopy ◽  
Physical Properties ◽  
Chemical Vapor ◽  
Chemical Vapor Deposition Method ◽  
Ferromagnetic Behavior ◽  
X Ray Diffraction ◽  
Field Emitters ◽  
Transmission Electron ◽  
Single Source Precursor ◽  
Carrier Gases

Abstract In this study, self-catalyzed β-FeSi2 nanowires, having been wanted but seldom achieved in a furnace, were synthesized via chemical vapor deposition method where the fabrication of β-FeSi2 nanowires occurred on Si (100) substrates through the decomposition of the single-source precursor of anhydrous FeCl3 powders at 750–950 °C. We carefully varied temperatures, duration time, and the flow rates of carrier gases to control and investigate the growth of the nanowires. The morphology of the β-FeSi2 nanowires was observed with scanning electron microscopy (SEM), while the structure of them was analyzed with X-ray diffraction (XRD) and transmission electron microscopy (TEM). The growth mechanism has been proposed and the physical properties of the iron disilicide nanowires were measured as well. In terms of the magnetization of β-FeSi2, nanowires were found to be different from bulk and thin film; additionally, longer β-FeSi2 nanowires possessed better magnetic properties, showing the room-temperature ferromagnetic behavior. Field emission measurements demonstrate that β-FeSi2 nanowires can be applied in field emitters.

Effectiveness and Reliability of Metal Diffusion Barriers for Copper Interconnects

1995 ◽  
Vol 403 ◽  
Author(s):  
G. Bai ◽  
S. Wittenbrock ◽  
V. Ochoa ◽  
R. Villasol ◽  
C. Chiang ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Diffusion Barriers ◽  
Copper Interconnects ◽  
Time To Failure ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron

AbstractCu has two advantages over Al for sub-quarter micron interconnect application: (1) higher conductivity and (2) improved electromigration reliability. However, Cu diffuses quickly in SiO2and Si, and must be encapsulated. Polycrystalline films of Physical Vapor Deposition (PVD) Ta, W, Mo, TiN, and Metal-Organo Chemical Vapor Deposition (MOCVD) TiN and Ti-Si-N have been evaluated as Cu diffusion barriers using electrically biased-thermal-stressing tests. Barrier effectiveness of these thin films were correlated with their physical properties from Atomic Force Microscopy (AFM), Transmission Electron Microscopy (TEM), Secondary Electron Microscopy (SEM), and Auger Electron Spectroscopy (AES) analysis. The barrier failure is dominated by “micro-defects” in the barrier film that serve as easy pathways for Cu diffusion. An ideal barrier system should be free of such micro-defects (e.g., amorphous Ti-Si-N and annealed Ta). The median-time-to-failure (MTTF) of a Ta barrier (30 nm) has been measured at different bias electrical fields and stressing temperatures, and the extrapolated MTTF of such a barrier is > 100 year at an operating condition of 200C and 0.1 MV/cm.

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