Transmission Electron Microscopy Study of an Epitaxial Gate Oxide on III-N Semiconductor Structures

2004 ◽  
Vol 831 ◽  
Author(s):  
Yoga. N. Saripalli ◽  
X-Q Liu ◽  
D.W. Barlage ◽  
M.A.L. Johnson ◽  
D. Braddock ◽  
...  

ABSTRACTAn effective gate insulator for compound semiconductors has been a challenging goal for the materials research community for nearly 40 years. Recent developments on the epitaxial deposition of complex gate oxides as gate insulators have shown promise with the demonstration of enhancement mode high electron mobility transistors (e-mode HEMTs). In this work, gate oxide epilayers deposited on III-V semiconductors for field effect transistors (III-V MOSFETs) are examined using transmission electron microscopy (TEM) to identify the structure of the oxide/semiconductor interface. The high resolution images of the cross-sectional structures for the first time reveal a crystalline nature of the interface between the oxide and the III-V semiconductor. The composition of the oxide layers are determined by Z-contrast Electron Energy Loss Spectroscopy (EELS). The surface morphology of the FET structures is investigated by atomic force microscopy (AFM) both before and after gate oxide deposition, and the structural results are related to device DC electrical characteristics. With an underlying GaN/InGaN heterojunction grown by metal-organic chemical vapor deposition (MOCVD) on sapphire, the MOSFET devices exhibit the characteristics of a substantially unpinned interface, including the capacity for significant charge accumulation and transconductance at positive gate voltages.

2002 ◽  
Vol 745 ◽  
Author(s):  
Patrick S. Lysaght ◽  
Brendan Foran ◽  
Gennadi Bersuker ◽  
Larry Larson ◽  
Robert W. Murto ◽  
...  

ABSTRACTEvaluation of physically thicker gate insulator materials with significantly higher dielectric constants (k = 10 – 25) as potential replacements for silicon dioxide, SiO2 (k = 3.9), and silicon oxynitride continues to be a focus of the semiconductor industry. The challenge is to provide a film with lower leakage current and with capacitance equivalent to < 1.0 nm SiO2 [1–4]. One such candidate material; metal-organic chemical vapor deposited (MOCVD) hafnium silicate, has been physically characterized by high resolution transmission electron microscopy (HRTEM) in plan view, as a blanket, uncapped film and high angle annular dark field scanning transmission electron microscopy (HAADF-STEM) in cross section following integration into capacitors and complementary metal oxide semiconductor (CMOS) transistors. Changes in the material microstructure associated with phase segregation and crystallization as a function of Hf silicate composition and rapid thermal anneal (RTA) temperature have been observed and a discussion of the segregation mechanisms is presented [5–8]. Also, various methods of incorporating nitrogen into bulk hafnium silicate films have been investigated and resultant transistor electrical performance data has been correlated with physical characterization for NH3 post deposition anneal (PDA) treatments at various temperatures.


2002 ◽  
Vol 747 ◽  
Author(s):  
Patrick S. Lysaght ◽  
Brendan Foran ◽  
Gennadi Bersuker ◽  
Larry Larson ◽  
Robert W. Murto ◽  
...  

ABSTRACTEvaluation of physically thicker gate insulator materials with significantly higher dielectric constants (k = 10 – 25) as potential replacements for silicon dioxide, SiO2 (k = 3.9), and silicon oxynitride continues to be a focus of the semiconductor industry. The challenge is to provide a film with lower leakage current and with capacitance equivalent to < 1.0 nm SiO2 [1–4]. One such candidate material; metal-organic chemical vapor deposited (MOCVD) hafnium silicate, has been physically characterized by high resolution transmission electron microscopy (HRTEM) in plan view, as a blanket, uncapped film and high angle annular dark field scanning transmission electron microscopy (HAADF-STEM) in cross section following integration into capacitors and complementary metal oxide semiconductor (CMOS) transistors. Changes in the material microstructure associated with phase segregation and crystallization as a function of Hf silicate composition and rapid thermal anneal (RTA) temperature have been observed and a discussion of the segregation mechanisms is presented [5–8]. Also, various methods of incorporating nitrogen into bulk hafnium silicate films have been investigated and resultant transistor electrical performance data has been correlated with physical characterization for NH3 post deposition anneal (PDA) treatments at various temperatures.


2018 ◽  
Vol 66 ◽  
pp. 151-165
Author(s):  
Morten Leth Hjuler ◽  
Vidar Folke Hansen ◽  
Ida Lykke Fabricius

Scanning and transmission electron microscopy (SEM and TEM) are capable of characterising the morphology and structure of sub-micron size substances attached to chalk particle surfaces. Some characteristics, however, may originate from sample preparation or reflect interaction between sample and the electron beam. Misinterpretation of surface features may lead to wrong conclusions regarding grain surface properties and cementation level and thus to erroneous characterisation of hydrocarbon reservoirs with respect to e.g. wettability, mechanical strength and maximum burial depth. In SEM, conductive coatings may mask surface details or generate artificial ornamentations, and carbon adhesive discs may cause the chalk surface to be covered with a thin carbon film. Electron beam acceleration voltage controls the degree of detail revealed by the electron beam, but in SEM a high electron beam acceleration voltage may provoke bending or curling of ultrathin particles. Recent organic filaments may be confused with clay flakes, and authigenic non-carbonate minerals may have formed in the pore fluid and settled during fluid removal. In TEM, the high acceleration voltage may cause beam damage to calcite and transform the outermost atomic layers into Ca oxide. Thin graphite membranes observed by TEM may be contamination from the carbon film supporting the sample, and overlapping chalk particles in samples formed by drying of a suspension may give the impression of being cemented together. In TEM residual adhesive from the ion-milling process can be confused with cementation features.


Author(s):  
L. F. Fu ◽  
Y. C. Wang ◽  
B. Jiang ◽  
F. Shen ◽  
M. Strauss ◽  
...  

Abstract Recent developments in aberration-corrected transmission electron microscopy have drawn much attention from the semiconductor characterization community. Two new developments in transmission electron microscopy, image aberration correctors and probe aberration correctors, are discussed in term of their applications in characterizing gate oxide dielectrics for the IC industry.


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