On the bending strength of single-crystal silicon theta-like specimens

2013 ◽  
Vol 3 (2) ◽  
pp. 113-117 ◽  
Author(s):  
Rebecca Kirkpatrick ◽  
William A. Osborn ◽  
Michael S. Gaither ◽  
Richard S. Gates ◽  
Frank W. DelRio ◽  
...  

Abstract

2013 ◽  
Vol 8 (10) ◽  
pp. 726-730 ◽  
Author(s):  
Bin Liu ◽  
Jun Yong Tao ◽  
Yun An Zhang ◽  
Xun Chen ◽  
Xiao Jing Wang

2011 ◽  
Vol 26 (20) ◽  
pp. 2575-2589 ◽  
Author(s):  
Michael S. Gaither ◽  
Frank W. DelRio ◽  
Richard S. Gates ◽  
Robert F. Cook

Abstract


Author(s):  
N. Lewis ◽  
E. L. Hall ◽  
A. Mogro-Campero ◽  
R. P. Love

The formation of buried oxide structures in single crystal silicon by high-dose oxygen ion implantation has received considerable attention recently for applications in advanced electronic device fabrication. This process is performed in a vacuum, and under the proper implantation conditions results in a silicon-on-insulator (SOI) structure with a top single crystal silicon layer on an amorphous silicon dioxide layer. The top Si layer has the same orientation as the silicon substrate. The quality of the outermost portion of the Si top layer is important in device fabrication since it either can be used directly to build devices, or epitaxial Si may be grown on this layer. Therefore, careful characterization of the results of the ion implantation process is essential.


Sign in / Sign up

Export Citation Format

Share Document