Lead-free solders: Enthalpies of mixing of liquid Ag–Cu–Ni–Sn alloys

2007 ◽  
Vol 22 (11) ◽  
pp. 3218-3225 ◽  
Author(s):  
U. Saeed ◽  
H. Flandorfer ◽  
H. Ipser
Keyword(s):  
Experimental Data ◽  
Binary Data ◽  
Quaternary System ◽  
Enthalpy Of Mixing ◽  
Integral Enthalpy ◽  
Lead Free ◽  
Enthalpies Of Mixing ◽  
Polynomial Fit ◽  
Calorimetric Technique ◽  
Lead Free Solders

Partial and integral enthalpies of mixing of liquid Ag–Cu–Ni–Sn alloys were determined at 1000 °C by a drop calorimetric technique using a Calvet type microcalorimeter. They were obtained by adding Ni to the ternary Ag–Cu–Sn alloys with different composition. The data were evaluated by means of an extended Redlich–Kister–Muggianu polynomial fit for substitutional solutions. The minimum and maximum in the quaternary system were also calculated. It was found that the maximum integral enthalpy of mixing (13,310 J/mol at 41 at.% Ag) occurs in the binary Ag–Ni system while the minimum integral enthalpy of mixing (−21,390 J/mol at 61 at.% Ni) occurs in the binary Ni–Sn system. Moreover the experimental data were compared to values calculated by different extrapolation models based on binary data.

Lead-free solders: Enthalpies of mixing of liquid alloys in the Ag–Ni and Ag–Ni–Sn systems

2006 ◽  
Vol 21 (5) ◽  
pp. 1294-1304 ◽  
Author(s):  
Usman Saeed ◽  
Hans Flandorfer ◽  
Herbert Ipser
Keyword(s):  
Binary Data ◽  
Miscibility Gap ◽  
Drop Calorimetry ◽  
Enthalpies Of Mixing ◽  
Polynomial Fit ◽  
Different Temperatures ◽  
Significant Temperature ◽  
Ternary Data ◽  
Lead Free Solders ◽  
Liquid Miscibility Gap

Partial and integral enthalpies of mixing of liquid Ag–Ni and Ag–Ni–Sn alloys were determined at different temperatures, i.e., at 1500 °C for binary Ag–Ni alloys and at 1000, 1220, and 1400 °C for ternary Ag–Ni–Sn alloys. Two different Calvet-type micro-calorimeters were used for the measurements employing drop calorimetry techniques. The binary data were evaluated by means of a standard Redlich–Kister polynomial fit whereas ternary data were fitted on the basis of an extended Redlich–Kister–Muggianu model for substitutional solutions. No significant temperature dependence could be detected for the ternary enthalpies of mixing. From the experimental ternary data, it was possible to deduce the liquidus isotherm at 1000 °C as well as the extension of the liquid miscibility gap at 1220 and 1400 °C.

Enthalpies of mixing in binary Cu–Eu and ternary Al–Cu–Eu liquid alloys

2020 ◽  
Vol 111 (4) ◽  
pp. 273-282
Author(s):  
Natalia Usenko ◽  
Michael Ivanov ◽  
Natalia Kotova
Keyword(s):  
Ternary System ◽  
Enthalpy Of Mixing ◽  
Integral Enthalpy ◽  
Liquid Alloys ◽  
Temperature Range ◽  
Enthalpies Of Mixing ◽  
Minimum Value ◽  
Isoperibolic Calorimetry ◽  
Wide Range ◽  
Binary Constituent

Abstract The enthalpies of mixing in liquid alloys of the binary Cu-Eu and ternary Al-Cu-Eu systems were determined over a wide range of compositions by means of isoperibolic calorimetry in the temperature range 1 300 - 1450 K. The enthalpies of mixing in the Cu-Eu system demonstrate small exothermic effects (ΔHmin = -4.1 ± 0.5 kJ · mol-1at xCu = 0.70). The measurements for the liquid ternary Al- Cu-Eu alloys were performed along five sections (xCu/ xEu = 0.70/0.30; 0.50/0.50 and 0.27/0.73 for xAl changed from 0 up to 0.30 and xAl/xEu = 0.20/0.80 and 0.47/0.53 for xCu changed from 0 up to 0.30). The enthalpies of mixing in the ternary system were found to be exothermic and increasing in absolute values from the Al corner towards the Al0.40Cu0.60-Al0.60Eu0.40section and from the constituent binary Cu-Eu system towards the same section. The minimum value of the integral enthalpy of mixing is expected in the vicinity of the Al0.6Eu0.4composition of the binary constituent Al-Eu system (about -23.00 kJ · mol-1).

scholarly journals The enthalpies of mixing of ternary liquid Ag-Ca-Ge alloys

2021 ◽  
Vol 9 (1) ◽  
pp. 51-62
Author(s):  
Natalia Kotova ◽  
Michael Ivanov ◽  
Natalia Usenko
Keyword(s):  
Molar Fraction ◽  
Enthalpy Of Mixing ◽  
Integral Enthalpy ◽  
Constant Ratio ◽  
Concentration Triangle ◽  
Ternary Interaction ◽  
Absolute Value ◽  
Enthalpies Of Mixing ◽  
Isoperibolic Calorimetry ◽  
First Time

Partial and integral enthalpies of mixing of the ternary Ag–Ca–Ge melts were determined for the first time by the high-temperature isoperibolic calorimetry at 1300–1550 K. The experiments were performed for six sections with a constant ratio of two components up to the molar fraction of the third component equal to 0.3. The enthalpies of mixing in this ternary system are exothermic values which increase in absolute value from the Ag corner of the concentration triangle towards the constituent binary Ca–Ge system. The minimum value of the integral enthalpy of mixing was obtained for Ca0.6Ge0.4 composition of the Ca–Ge binary system (about –58.00 kJ mol–1). The enthalpies of mixing of the ternary Ag–Ca–Ge melts are calculated for the whole concentration triangle by the Redlich-Kister-Muggianu method, taking into account the term of specific ternary interaction defined from our experimental data. The topology of the isoenthalpies of mixing is determined.

High-temperature Calorimetry of Liquid Gd–Si and Y–Si Alloys

2005 ◽  
Vol 60 (8-9) ◽  
pp. 649-654 ◽  
Author(s):  
Dmitry S. Kanibolotsky ◽  
Olena A. Bieloborodovaa ◽  
Vladyslav V. Lisnyak
Keyword(s):  
High Temperature ◽  
Mole Fraction ◽  
Thermodynamic Data ◽  
Enthalpy Of Mixing ◽  
Integral Enthalpy ◽  
Enthalpies Of Mixing

Molten Gd-Si and Y-Si alloys were examined calorimetrically at 1760 and 1770 K, respectively. The partial enthalpies of mixing of gadolinium (Δmix H̅Gd), yttrium (Δmix H̅Y) and silicon (Δmix H̅Si) were measured. The integral enthalpy of mixing (ΔmixH) was calculated by Darken’s method. The available thermodynamic data of liquid (Gd,Y)-Si alloys were compared. The partial enthalpies of mixing of Gd and Y, and appropriate integral enthalpies of mixing, were described by polynomial dependencies versus mole fraction of Gd or Y.

scholarly journals Surdat: Database of physical properties of lead-free solders

2007 ◽  
Vol 43 (2) ◽  
pp. 125-130 ◽  
Author(s):  
Z. Moser ◽  
W. Gasior ◽  
A. Debski ◽  
J. Pstrus
Keyword(s):  
Experimental Data ◽  
Surface Tension ◽  
Physical Properties ◽  
Lead Free ◽  
Experimental Investigations ◽  
Multicomponent Systems ◽  
Electronic Database ◽  
Pressure Method ◽  
Pure Metals ◽  
Lead Free Solders

The results of investigations, carried out since 1998, of surface tension by the maximum bubble pressure method, and of density by the dilatometric method for pure metals, binary and multicomponent systems have been used to create an electronic database SURDAT of materials for lead-free solders. The database enables also to compare the experimental data of surface tension with the values calculated from Butler's relation and with the literature data of other authors. The base was published at the beginning of the year 2007 as a monograph including the installation program and may by obtained free from the website www.imim.pl. The present version of the SURDAT database will be introduced on the website of the National Institute of Standards and Technology (NIST) together with the new version of Lead-Free Solders base elaborated by NIST. The work on the database is continued. The SURDAT database will be supplemented with new data of surface tension and density for systems already available in the base as well as for new systems and it will be extended by including the results of meniscographic investigations. In the paper there has been offered the instruction for preparing the data for the authors of studies who would like to present the results of their experimental investigations in the SURDAT database.

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

Shear Strength and Dsc Analysis of High-Temperature Solders

2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Dsc Analysis ◽  
Ultrasonic Activation ◽  
Metallic Substrates ◽  
Cu Substrate ◽  
Lead Free Solders

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

scholarly journals Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9zn Lead-Free Solders Al-Loy

Materials ◽  
2021 ◽  
Vol 14 (10) ◽  
pp. 2549
Author(s):  
Wenchao Yang ◽  
Jun Mao ◽  
Yueyuan Ma ◽  
Shuyuan Yu ◽  
Hongping He ◽  
...  
Keyword(s):  
Corrosion Resistance ◽  
Microstructure Evolution ◽  
Electrochemical Corrosion ◽  
Lead Free ◽  
Nacl Solution ◽  
Rich Phase ◽  
Yttrium Addition ◽  
Electrochemical Corrosion Behavior ◽  
Lead Free Solders ◽  
Addition Amount

Electrochemical corrosion behavior of ternary tin-zinc-yttrium (Sn-9Zn-xY) solder alloys were investigated in aerated 3.5 wt.% NaCl solution using potentiodynamic polarization techniques, and the microstructure evolution was obtained by scanning electron microscope (SEM). Eight different compositions of Sn-9Zn-xY (x = 0, 0.02, 0.04, 0.06, 0.08, 0.10, 0.20, and 0.30 wt.%) were compared by melting. The experimental results show that when the content of Y reached 0.06 wt.%, the grain size of Zn-rich phase became the smallest and the effect of grain refinement was the best, but there was no significant effect on the melting point. With the increases of Y content, the spreading ratio first increased and then decreased. When the content of Y was 0.06 wt.%, the Sn-9Zn-0.06Y solder alloy had the best wettability on the Cu substrate, which was increased by approximately 20% compared with Sn-9Zn. Besides, the electrochemical corrosion experimental shows that the Y can improve the corrosion resistance of Sn-9Zn system in 3.5 wt.% NaCl solution, and the corrosion resistance of the alloy is better when the amount of Y added is larger within 0.02–0.30 wt.%. Overall considering all performances, the optimal performance can be obtained when the addition amount of Y is 0.06.

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