Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging

2007 ◽  
Vol 22 (10) ◽  
pp. 2817-2824 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Hyun-Suk Chun ◽  
Hoo-Jeong Lee ◽  
Seung-Boo Jung
Keyword(s):  
High Temperature ◽  
Solid State ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Microstructural Evolution ◽  
Surface Finish ◽  
Solder Matrix ◽  
Interfacial Reactions ◽  
Cu Substrate ◽  
Study Results

The microstructural evolution and interfacial reactions of fluxless-bonded, Au-20wt%Sn/Cu solder joint were investigated during reflow and aging. After reflowing at 310 °C, only one thick and irregularly shaped ζ(Cu) layer was formed at the interface. After the prolonged reflow reaction, the AuCu layer was formed between the ζ(Cu) layer and the Cu substrate. During reflowing, the Cu substrate reacted primarily with the ζ-phase in the solder matrix. The solid-state interfacial reaction was much faster at 250 °C than at 150 °C. After aging at 250 °C for 100 h, thick ζ(Cu), AuCu and AuCu3 IMC layers were formed at the interface. The formation of the AuCu3 intermetallic compound (IMC) was caused by Cu enrichment at the AuCu/Cu layer interface. After aging for 500 h, cracks were observed inside the interfacial AuCu layer. The study results clearly demonstrate the need for an alternative surface finish on Cu, to ensure the high temperature reliability of the Au-20Sn/Cu solder joint.

Interfacial Reactions between Sn-Ag-Cu-Fe Composite Solder and Cu Substrate

2013 ◽  
Vol 706-708 ◽  
pp. 138-141
Author(s):  
Xiao Ying Liu ◽  
Ming Liang Huang ◽  
Ning Zhao
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Growth Kinetics ◽  
Liquid State ◽  
Composite Solder ◽  
Interfacial Reactions ◽  
The Other ◽  
Cu Substrate ◽  
Soldering Process ◽  
Small Cracks

The growth kinetics and morphology of intermetallic compound (IMC) between Sn-3Ag-0.5Cu -xFe (x= 0, 0.5wt.%, 1wt.%) composite solders and Cu substrate were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250°C. During soldering process, Fe particles quickly deposited in the vicinity of IMC, resulting in the formation of Fe-rich area. It was shown that Fe could effectively retard the growth of interfacial Cu6Sn5 and Cu3Sn layers during liquid-state reaction and reduce the size of Cu6Sn5 grains. Small cracks were observed in the Cu6Sn5 grains of Sn-Ag-Cu/Cu interface after reflowing for 30 min while they were not found in the other composite solders.

Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses

2015 ◽  
Vol 830-831 ◽  
pp. 265-269
Author(s):  
Satyanarayan ◽  
K.N. Prabhu
Keyword(s):  
Solder Joint ◽  
Solder Matrix ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Cu Substrate ◽  
Cu Substrates ◽  
Free Solder ◽  
Substrate Surfaces ◽  
Lead Free Solders

In the present work, the bond strength of Sn-0.7Cu, Sn-0.3Ag-0.7Cu, Sn-2.5Ag-0.5Cu and Sn-3Ag-0.5Cu lead free solders solidified on Cu substrates was experimentally determined. The bond shear test was used to assess the integrity of Sn–Cu and Sn–Ag–Cu lead-free solder alloy drops solidified on smooth and rough Cu substrate surfaces. The increase in the surface roughness of Cu substrates improved the wettability of solders. The wettability was not affected by the Ag content of solders. Solder bonds on smooth surfaces yielded higher shear strength compared to rough surfaces. Fractured surfaces revealed the occurrence of ductile mode of failure on smooth Cu surfaces and a transition ridge on rough Cu surfaces. Though rough Cu substrate improved the wettability of solder alloys, solder bonds were sheared at a lower force leading to decreased shear energy density compared to the smooth Cu surface. A smooth surface finish and the presence of minor amounts of Ag in the alloy improved the integrity of the solder joint. Smoother surface is preferable as it favors failure in the solder matrix.

Study of interfacial reactions in Sn–3.5Ag–3.0Bi and Sn–8.0Zn–3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

2007 ◽  
Vol 437 (1-2) ◽  
pp. 169-179 ◽  
Author(s):  
Peng Sun ◽  
Cristina Andersson ◽  
Xicheng Wei ◽  
Zhaonian Cheng ◽  
Dongkai Shangguan ◽  
...  
Keyword(s):  
Solder Joint ◽  
Sandwich Structure ◽  
Interfacial Reactions ◽  
Cu Substrate ◽  
Cu Metallization

Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C

2006 ◽  
Vol 21 (12) ◽  
pp. 3196-3204 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Jun Hyung Lim ◽  
Hoo-Jeong Lee ◽  
Jinho Joo ◽  
Seung-Boo Jung ◽  
...  
Keyword(s):  
Solder Joint ◽  
Eutectic Reaction ◽  
Bulk Solder ◽  
Interfacial Reactions ◽  
Test Results ◽  
Mechanical Reliability ◽  
Viable Option ◽  
Reaction Behavior ◽  
Cu Substrate ◽  
Joint Reliability

Joint reliability of immersion Ag with two different solders, Sn–37Pb and Sn–3.5Ag, were evaluated. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn–Pb solder produced a Pb-rich phase along the interface between the solder and the Cu substrate during aging. In contrast, the Sn–Ag solder exhibits an off-eutectic reaction to produce the eutectic phase and Ag3Sn precipitate. The shear test results show that the Sn–Pb solder joint fractured along the interface showing brittle failure indications possibly due to the brittle Pb-rich layer. In contrast, the failure of Sn–Ag solder joint was only through the bulk solder, providing evidence that the interface is mechanically reliable. The results from this study confirm that the immersion Ag/Sn–Ag solder joint is mechanically robust, and thus the combination is a viable option for a Pb-free package system.

Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste

2016 ◽  
Vol 700 ◽  
pp. 123-131 ◽  
Author(s):  
Rita Mohd Said ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
Norhayanti Mohd Nasir ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Aging Time ◽  
Isothermal Aging ◽  
Composite Solder ◽  
Solder Paste ◽  
Cu Substrate ◽  
Interfacial Imcs ◽  
Planar Shape ◽  
Interfacial Intermetallic Compound

This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste with TiO2 particles were mechanically mixed to fabricate the composite solder paste. The composite solder paste then reflowed in the reflow oven to form solder joint. The reflowed samples were then isothermally aged 75, 125 and 150 ° C for 24 and 240 h. It was found that the morphology of IMCs changed from scallop-shape to a more uniform planar shape in both Sn-Cu-Ni/Cu joints and Sn-Cu-Ni-TiO2 /Cu joint. Cu6Sn5 and Cu3Sn IMC were identified and grew after prolong aging time and temperature. The IMCs thickness and scallop diameter of composite solder paste were reduced and the growth of IMCs thickness after isothermal aging become slower as compared to unreinforced Sn-Cu-Ni solder paste. It is suggested that TiO2 particles have influenced the evolution and retarded the growth of interfacial IMCs.

scholarly journals Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate

2006 ◽  
Vol 504 (1-2) ◽  
pp. 410-415 ◽  
Author(s):  
Aditya Kumar ◽  
Zhong Chen ◽  
S.G. Mhaisalkar ◽  
C.C. Wong ◽  
Poi Siong Teo ◽  
...  
Keyword(s):  
Solid State ◽  
Interfacial Reactions ◽  
Cu Substrate ◽  
Electroless Ni

Effect of the Crystallographic Orientation of Underlying Poly-Si on the Thermal Stability of the TiSi2 Film

1992 ◽  
Vol 280 ◽  
Author(s):  
Y. W. Kim ◽  
I. K. Kim ◽  
N. I. Lee ◽  
J. W. Ko ◽  
S. T. Ahn ◽  
...  
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Solid State ◽  
Surface Energy ◽  
Microstructural Evolution ◽  
Solid State Reaction ◽  
Crystallographic Orientation ◽  
Amorphous Si ◽  
Si Films ◽  
Thermal Stability Of

ABSTRACTThe effect of the crystallographic orientation of underlying poly-Si film on the thermal stability of the TiSi2 film was studied. Different preferred orientations of the poly-Si film were obtained by annealing poly-Si or amorphous Si films at various temperatures. The TiSi2 film was formed by the solid-state reaction of the Ti film sputtered on the poly-Si film. The thermal stability of the TiSi2 film was evaluated by changes in the sheet resistance and microstructural evolution during furnace anneals. The TiSi2 film on poly-Si with the <110> preferred orientation shows more stable conductivity during high temperature anneals than with the <111> orientation. The surface energy of underlying poly-Si is expected to influence the thermal stability of the TiSi2/poly-Si structure significantly. Better thermal stability of the TiSi2 film can be obtained by the higher surface energy of underlying poly-Si.

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