Interfacial reactions in the Sn–20 at.% In/Cu and Sn–20 at.% In/Ni couples at 160 °C

2006 ◽  
Vol 21 (7) ◽  
pp. 1712-1717 ◽  
Author(s):  
Shih-kang Lin ◽  
Sinn-wen Chen
Keyword(s):  
Melting Point ◽  
Liquid Phase ◽  
Reaction Rate ◽  
Reaction Path ◽  
Interfacial Reactions ◽  
Phase Layer ◽  
Electronic Products ◽  
Ni Substrate ◽  
Consumption Rates ◽  
Peculiar Phenomenon

Sn–In alloys are promising low-melting-point Pb-free solders. Cu and Ni are common substrates in the electronic products. This study examines the interfacial reactions in the Sn–20 at.% In(γ–InSn4)/Cu and Sn–20 at.% In/Ni couples at 160 °C. Only the η–Cu6Sn5 phase layer is formed in the Sn–20 at.% In/Cu couple, and the layer grows thicker with longer reaction time. The reaction path is γ–InSn4/η–Cu6Sn5/Cu. A peculiar phenomenon with the bulging of the couple near the Ni substrate is found in the Sn–20 at.% In/Ni couple. A liquid phase is formed by interfacial reaction in the solid/solid Sn–20 at.% In/Ni couple at 160 °C, and the reaction path is γ–InSn4/liquid/δ–Ni3Sn4 + liquid/(δ–Ni3Sn4)/Ni. Usually Ni has a slower reaction rate with solders; however, the consumption rates of Ni substrate are much higher than those of Cu substrate in this study when they are in contact with the Sn–20 at.% In alloy at 160 °C due to the formation of the liquid phase in the Sn–20 at.% In/Ni couple.

Effects of temperature on interfacial reactions in γ–InSn4/Ni couples

2006 ◽  
Vol 21 (5) ◽  
pp. 1161-1166 ◽  
Author(s):  
Sinn-wen Chen ◽  
Shih-kang Lin
Keyword(s):  
Liquid Phase ◽  
Reaction Layer ◽  
Reaction Path ◽  
Interfacial Reactions ◽  
Phase Layer ◽  
Homogeneous Phase ◽  
Nickel Substrates ◽  
Solid Phases ◽  
Effects Of Temperature

Interfacial reactions in γ–InSn4(Sn–20 at.% In)/Ni couples at 130, 140, 150, and 160 °C were investigated. Ni3Sn4phase with significant indium solubility was formed in the couple reacted at 130 and 140 °C, and the reaction path was γ–InSn4/Ni3Sn4/Ni. For the couples reacted at 150 and 160 °C, even though both γ–InSn4and Ni were solid phases, the liquid phase was formed in the couples. A distinguished feature was the nickel substrates becoming nonplanar with spikes at various locations and the Ni3Sn4phase layer on top of the nickel spikes. Except at regions near the nickel spikes, the reaction layer consisted of precipitates and was not a homogeneous phase. The reaction path is γ–InSn4/Ni3Sn4/Ni at the location with Ni3Sn4phase growing on Ni. However, if the Ni3Sn4phase does not nucleate, the liquid phase forms at the interface with accumulation of indium atoms, and the reaction path is γ–InSn4/ liquid/liquid + Ni3Sn4/Ni.

Electric current-induced abnormal Cu/γ-InSn4 interfacial reactions

2006 ◽  
Vol 21 (12) ◽  
pp. 3065-3071 ◽  
Author(s):  
Sinn-wen Chen ◽  
Shih-kang Lin
Keyword(s):  
Liquid Phase ◽  
Grain Boundaries ◽  
Electric Current ◽  
Reaction Path ◽  
Interfacial Reactions ◽  
Melting Points ◽  
Transport Enhancement ◽  
Current Stressing ◽  
Phase Layers ◽  
Electromigration Effect

The electromigration effect upon the γ-InSn4/Cu interfacial reactions have been studied by examining the γ-InSn4/Cu/γ-InSn4 couples annealed at 160 °C with and without current stressing. Scallop-type η-Cu6(Sn,In)5 phase layers are formed in the couples without current stressing and at the γ-InSn4/Cu interface where electrons are flowing from the γ-InSn4 to the Cu. The reaction path is Cu/η-Cu6(Sn,In)5/γ-InSn4. However, very large η-Cu6(Sn,In)5 compounds are found at the Cu/γ-InSn4 interface where electrons are from Cu to the γ-InSn4. Although the melting points of both γ-InSn4 and Cu are higher than 160 °C, the liquid phase is formed at 160 °C in the electrified couple at the downstream γ-InSn4 phase near the Cu/γ-InSn4 interface. The reaction path is Cu/η-Cu6(Sn,In)5/liquid/γ-InSn4. The liquid phase propagates along the grain boundaries of the γ-InSn4 matrix. The very large η-Cu6(Sn,In)5 compounds are the coupling results of the liquid phase penetration and the Cu transport enhancement due to electromigration.

Interfacial reactions in the Sn–9Zn–(xCu)/Cu and Sn–9Zn–(xCu)/Ni couples

2006 ◽  
Vol 21 (7) ◽  
pp. 1849-1856 ◽  
Author(s):  
Chin-yi Chou ◽  
Sinn-wen Chen ◽  
Yee-shyi Chang
Keyword(s):  
Reaction Time ◽  
Melting Point ◽  
Oxidation Resistance ◽  
Interfacial Reaction ◽  
Interfacial Reactions ◽  
Reaction Products ◽  
Phase Layer ◽  
Cu Content ◽  
Wetting Properties ◽  
Interfacial Reaction Product

Sn–Zn-based alloys are promising low melting-point Pb-free solders, and it has been reported that their wetting properties and oxidation resistance can be improved with the addition of Cu. The interfacial reactions in the Sn–9 wt% Zn–xCu/Cu couples at 250 °C and Sn–9 wt% Zn–xCu/Ni at 280 °C were examined in this study. A thick γ–Cu5Zn8 phase layer and a very thin β′–CuZn phase layer were formed in both the Sn–9 wt% Zn/Cu and the Sn–9 wt% Zn–1 wt% Cu/Cu couples. The γ–Ni5Zn21 phase layer was formed in both the Sn–9 wt% Zn/Ni and Sn–9 wt% Zn–1 wt% Cu/Ni couples. With longer reaction time, the δ–Ni3Sn4 phase were formed in the Sn–9 wt% Zn/Ni couple as well. In both the Cu and Ni couples, the Zn-containing γ phases were uniform and planar and were the dominant reaction products. However, when the Cu content of the Sn–9 wt% Zn–xCu solders was 10 wt%, the interfacial reaction product becomes the η–Cu6Sn5 phase in both the Cu and Ni couples.

scholarly journals Interfacial reactions between solid Ni and liquid Sn-Zn alloys

2015 ◽  
Vol 51 (2) ◽  
pp. 179-184 ◽  
Author(s):  
V. Gandova
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Interfacial Reactions ◽  
Diffusion Couples ◽  
Zn Diffusion ◽  
Ni Substrate ◽  
Industry Applications ◽  
Zn Alloys ◽  
Scanning Electron ◽  
Intermetallic Layers

The limitation of the harmful lead-containing solders used in the electronics and other industry applications change lead with another metals. Interfacial reactions between Sn-Zn alloys and Ni substrate after annealing at 400 and 450?C were studied. Three intermetallic compounds Ni3Sn4, T1, ?-Ni5Zn21 and liquid Sn were observed in the Ni/Sn-Zn diffusion couples. Scanning electron microscope was used for the investigation of the microstructure. The microhardness measurement of the intermetallic layers was also performed.

Dicyclopentadiene dissociation in a chromatographic reactor. Effect of the liquid phase polarity on the reaction rate

1989 ◽  
Vol 28 (5-6) ◽  
pp. 300-302 ◽  
Author(s):  
J. Coca ◽  
M. Bravo ◽  
E. Abascal ◽  
G. Adrio
Keyword(s):  
Liquid Phase ◽  
Reaction Rate ◽  
Chromatographic Reactor

Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate

2007 ◽  
Vol 22 (10) ◽  
pp. 2663-2667 ◽  
Author(s):  
Yee-wen Yen ◽  
Wei-kai Liou
Keyword(s):  
Intermetallic Compounds ◽  
Interfacial Reactions ◽  
Experimental Results ◽  
Lead Free ◽  
Lead Free Solder ◽  
Ni Substrate ◽  
Free Solder

This study investigates interfacial reactions of (Sn–9Zn) + xCu/Ni systems. Ni5Zn21, Cu5Zn8, (Ni,Zn,Cu)3Sn4, (Cu,Ni,Zn)6Sn5, and Cu6Sn5 phases were formed on the Sn–9Zn/Ni interface at 240–270 °C, when 0–10 wt% Cu was added to the Sn–9Zn solder. Experimental results indicate that changing the concentration of Cu in the Sn–9Zn solder dramatically changes the formation of intermetallic compounds (IMCs) in the (Sn–9Zn) + xCu/Ni system. Different diffusion and segregation rates of elements are the main reasons for a change in the IMC evolution.

ABSORBSI H2S MENGGUNAKAN LARUTAN Fe-EDTA DALAM PACKED COLUMN

EKUILIBIUM ◽  
2011 ◽  
Vol 10 (2) ◽  
Author(s):  
Endang Kwartiningsih ◽  
Arif Jumari
Keyword(s):  
Mass Transfer ◽  
Liquid Phase ◽  
Transfer Coefficient ◽  
Mass Transfer Coefficient ◽  
Gas Phase ◽  
Reaction Rate ◽  
Packed Column ◽  
Reaction Rate Constant ◽  
Absorption Process ◽  
Edta Solution

<p><strong><em>Abstract:</em></strong><strong><em> </em></strong><em>Gas purification from the content of H<sub>2</sub>S using  Fe-EDTA (Iron Chelated Solution) gave  several advantages. The advantages were  the absorbent solution can be regenerated that means  a cheap operation cost,  the separated sulfur was a solid that is easy to handle and is save to be disposal to environment. This research was done by simulation and experimental. The simulation step was done by mathematical model arrangement representing the absorption process in packed column through mass transfer arrangement such as mass transfer equations and chemical reaction. The experimental step was done with the making of Fe-EDTA solution from FeCl<sub>2</sub> and EDTA. Then Fe-EDTA solution was flown in counter current packed column that was contacted with H<sub>2</sub>S in the methane gas. By comparing gas composition result of experiment and simulation, the value of mass transfer coefficient in gas phase ( k<sub>Ag</sub>a), mass transfer coefficient in liquid phase (k<sub>Al</sub>a) and the reaction rate constant ( k) were found. The values of mass transfer coefficient in liquid phase (k<sub>Al</sub>a) were lower than values of mass transfer coefficient in gas phase (k<sub>Ag</sub>a) and the reaction rate constant (k). It meant that H<sub>2</sub>S absorption  process using Fe-EDTA absorbent solution was determined by mass transfer process in liquid phase. The higher flow rate of absorbent, the higher value of mass transfer coefficient in liquid phase. </em><em>The smaller packing diameter, the higher value of mass transfer coefficient in liquid phase.From analysis of dimension, the relation of dimensionless number between Sherwood number and flow rate of absorbent, packing diameter was</em><strong></strong></p><p> <strong><em>Keywords:</em></strong><strong><em> </em></strong><em>chemical reaction, Fe-EDTA, H<sub>2</sub>S absorption, mass transfer</em></p>

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