Effect of SiO2 and Y2O3 additives on the anisotropic grain growth of dense mullite

2000 ◽  
Vol 15 (3) ◽  
pp. 718-726 ◽  
Author(s):  
T. Huang ◽  
M. N. Rahaman ◽  
T-I Mah ◽  
T. A. Parthasarathay

Mullite powder with a nearly stoichiometric composition was doped with 1.5–5 wt% SiO2 or 0.5–1.0 wt% Y2O3 and hot pressed at 1525–1550 °C to produce almost fully dense materials. The effect of the additives on the grain growth of the dense systems was investigated during subsequent annealing at temperatures above that of the eutectic (∼1590 °C) for the SiO2–Al2O3 system. The average length and width of the grains were measured by image analysis of polished and etched sections. At 1750 °C, anisotropic grain growth was relatively rapid, leading to the formation of rodlike grains. Compared to the undoped mullite, the addition of SiO2 and Y2O3 produced a small reduction in the grain growth kinetics. Transmission electron microscopy revealed that the glassy second phase was concentrated at the three-grain junctions or distributed inhomogeneously at the grain boundaries. For the materials annealed at 1750 °C, the indentation fracture toughness at room temperature increased from 2.0 to 2.5 MPa m1/2 for the undoped mullite to values as high as 4.0–4.5 MPa m1/2 for the doped mullite. The implications of the data for enhancing the fracture toughness of mullite by the in situ development of a microstructure of elongated grains are considered.

2002 ◽  
Vol 17 (8) ◽  
pp. 2085-2094 ◽  
Author(s):  
H. P. Ng ◽  
A. H. W. Ngan

The grain growth kinetics and ordering behavior of direct-current magnetron sputter-deposited Ni75at.%Al25at.% alloy films were investigated using in situ isothermal annealing in a transmission electron microscope. Both normal and abnormal grain growth modes were observed. The normal grain growth kinetics under isothermal heating from 300 to 700 °C were found to comply with the Burke law d = K/dn−1, where d is grain size and K and n are constants with respect to time. The grain boundary mobility parameter K was found to obey an Arrehnius rate law with an apparent activation energy of 1.6 eV, and n was found to increase gradually from 5.2 at 300 °C to 8.7 at 700 °C. Abnormal grain growth occurred at 500 °C or higher, and grain coalescence was identified as an important operative mechanism. It was also observed that the initially as-deposited state of the films was crystalline with a disordered face-centered-cubic structure, but ordering into the equilibrium L12 intermetallic structure followed from annealing at temperatures above approximately 500 °C.


Author(s):  
D. A. Smith ◽  
S. C. Mehta ◽  
U. Erb

Nanocrystalline (nc) materials, owing to their ultrafine grain sizes, exhibit several physical and mechanical properties which are significantly different from, and in many cases, superior to those of their polycrystalline counterparts and therefore promise their usage in a number of applications. However, very poor resistance of nc pure metals against thermal grain growth severely limits the application of these novel materials. Several attempts are being made to improve the thermal stability of nc materials. The conventional approaches of grain boundary pinning by second phase precipitates and solute drag effects are commonly being employed. However, the kinetics of grain growth and the roles of solute atoms and second phase precipitates in affecting grain growth inhibition in these nanolength scale materials are still not well understood.A transmission electron microscope study has been made of the microstructural evolution of electrodeposited nanocrystalline Ni-1.2wt.%P alloy and pure nickel during heating experiments performed in-situ.


1999 ◽  
Vol 564 ◽  
Author(s):  
P. W. DeHaven ◽  
K. P. Rodbell ◽  
L. Gignac

AbstractThe effectiveness of a TiN capping layer to prevent the conversion of α-titantium to titanium nitride when annealed in a nitrogen ambient has been studied over the temperature range 300–700°C using in-situ high temperature diffraction and transmission electron microscopy. Over the time range of interest (four hours), no evidence of Ti reaction was observed at 300°C. At 450°C. nitrogen was found to diffuse into the Ti to form a Ti(N) solid solution. Above 500°C the titanium is transformed to a second phase: however this reaction follows two different kinetic paths, depending on the annealing temperature. Below 600°C. the reaction proceeds in two stages, with the first stage consisting of Ti(N) formation, and the second stage consisting of the conversion of the Ti(N) with a transformation mechanism characteristic of short range diffusion (grain edge nucleation). Above 600°C, a simple linear transformation rate is observed.


2005 ◽  
Vol 907 ◽  
Author(s):  
J. A. Gregg ◽  
K Hattar ◽  
C H Lei ◽  
I M Robertson

AbstractRetention of the enhanced properties reported for nanograined metallic systems requires that the nanostructure be insensitive to temperature and deformation. In situ transmission electron microscopy annealing experiments were employed to investigate the structural changes associated with the formation of micron-sized grains in nanograined evaporated gold thin films. This abnormal grain growth occurs randomly throughout the film. Twinning but not dislocation slip occurs in the growing grains until the grain size is in the hundreds of nanometer range. The twins appear to hinder growth and for grain growth to continue the twins must either be annihilated or be able to grow with the grain concurrently.


1982 ◽  
Vol 21 ◽  
Author(s):  
M. P. Anderson ◽  
D. J. Srolovitz ◽  
G. S. Grest ◽  
P. S. Sahni

The physical and chemical properties of materials are determined in part by microstructure. Grain orientation and size in polycrystalline aggregates affect, for example, yield strength, catalytic efficiency, chemisorption, physisorption, fracture and a host of other properties. The final grain morphology is often determined by thermal processing, addition of a second phase, deformation, etc. However, in order to effectively tailor the microstructure for specific applications, the mechanism and kinetics of grain growth must be known. Unfortunately, present theories predict grain growth kinetics (1–3) which often differ from experimental observation, have little predictive ability with respect to microstructure and are not easily generalized to account for experimentally controllable factors.


1996 ◽  
Vol 436 ◽  
Author(s):  
R.-M. Keller ◽  
W. Sigle ◽  
S. P. Baker ◽  
O. Kraft ◽  
E. Arzt

AbstractIn-situ transmission electron microscopy (TEM) was performed to study grain growth and dislocation motion during temperature cycles of Cu films with and without a cap layer. In addition, the substrate curvature method was employed to determine the corresponding stresstemperature curves from room temperature up to 600°C. The results of the in-situ TEM investigations provide insight into the microstructural evolution which occurs during the stress measurements. Grain growth occurred continuously throughout the first heating cycle in both cases. The evolution of dislocation structure observed in TEM supports an explanation of the stress evolution in both capped and uncapped films in terms of dislocation effects.


2000 ◽  
Vol 104 (11) ◽  
pp. 2467-2476 ◽  
Author(s):  
H. Natter ◽  
M. Schmelzer ◽  
M.-S Löffler ◽  
C. E. Krill ◽  
A. Fitch ◽  
...  

2010 ◽  
Vol 105-106 ◽  
pp. 844-847
Author(s):  
Yong Chang Zhu ◽  
Shou Fan Rong ◽  
Ji Wei Guo ◽  
Jun Gang Li

The elongated grain evolution of alumina ceramics doping with Al2O3-CaO-SiO2(CAS), Nb2O5, and 3Y-TZP was studied under pressureless sintering. From in-situ growth elongated grain cooperating with second phase to toughen the alumina ceramics, microstructure and sintering properties were firstly studied systematically. The effect of additives on the alumina ceramics with columnar grain were analyzed by means of TEM, SEM, XRD, etc. Basing on the analyzed sintering process by the principle of dynamics, the elongated grain growth mechanism was further studied.


2012 ◽  
Vol 715-716 ◽  
pp. 611-616 ◽  
Author(s):  
M. Candic ◽  
Bao Hui Tian ◽  
Christof Sommitsch

In the present work, for the description of grain coarsening, a probabilistic and a deterministic 2D cellular automaton simulation setup were developed. The results of the simulation have been validated by solution annealing experiments of austenitic stainless steel 304L (Fe-18Cr-8Ni) at different temperatures and times. Both cellular automata models show an excellent correlation between the experimental determined data and grain growth kinetics based upon considerations of temperature and second phase particles. Additionally, a two parameter approach of the probabilistic model was implemented, resulting in determining the grain sizes limiting normal and abnormal grains and accurate description of grain growth.


1999 ◽  
Vol 14 (8) ◽  
pp. 3263-3270 ◽  
Author(s):  
R. A. Ristau ◽  
K. Barmak ◽  
K. R. Coffey ◽  
J. K. Howard

The microstructure of sputtered 10-nm thin films of equiatomic binary alloys of CoPt and FePt was characterized using transmission electron microscopy (TEM). Grain growth kinetics was examined using manual and digital analysis of bright-field TEM images and was seen to take two stages during annealing in these films. A rapid growth stage concurrent with the formation of a [111] fiber texture was observed to occur within the first 5–10 min of annealing, followed by a much slower growth stage after the fiber texturing was well advanced. Differences in grain growth rate and ultimate grain size were also observed to depend on heating rate.


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