Ball Grid Array Lead-Free Solder Joint Strength under Monotonic Flexural Load

2011 ◽  
pp. 139-139-19
Author(s):  
Phil Geng
Keyword(s):  
Solder Joint ◽  
Joint Strength ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation

Crystals ◽  
2017 ◽  
Vol 7 (8) ◽  
pp. 255 ◽  
Author(s):  
Naoya Tada ◽  
Takuhiro Tanaka ◽  
Takeshi Uemori ◽  
Toshiya Nakata
Keyword(s):  
Solder Joint ◽  
Joint Strength ◽  
Copper Wire ◽  
Lead Free ◽  
Lead Free Solder ◽  
Wire Surface ◽  
Surface Observation ◽  
Pullout Tests ◽  
Free Solder

Effect of Added Elements on Microstructures and Joint Strength of Lead-Free Sn-Based Solder Joint Dispersed IMC Pillar

2016 ◽  
Vol 879 ◽  
pp. 2216-2221 ◽  
Author(s):  
Yawara Hayashi ◽  
Ikuo Shohji ◽  
Yusuke Nakata ◽  
Tomihito Hashimoto
Keyword(s):  
Solder Joint ◽  
Shear Force ◽  
Joint Strength ◽  
High Reliability ◽  
Bonding Time ◽  
Lead Free ◽  
Joint Interface ◽  
Lead Free Solder ◽  
Uniform Dispersion ◽  
Free Solder

To create a high reliability solder joint using IMCs dispersed in the joint, the joints with four types of lead-free solder were investigated. The joint with Sn-3.0Ag-0.7Cu-5.0In (mass%) has high die shear force compared to other joints investigated, and the joint with the Ni-electroplated Cu bonded at 300 oC for 30 min showed the maximum die shear force due to formation of a large number of fine IMCs. In the joint with Sn-0.7Cu-0.05Ni (mass%), uniform dispersion of a large number of IMCs was achieved, although the die shear force of the joint is lower than that of the joint with Sn-3.0Ag-0.7Cu-5.0In. In the joint with Sn-5.0Sb (mass%), a solder area was remained in the center of the joint although a large number of columnar IMCs form at the joint interface. The die shear force of the joint with Sn-5.0Sb increased with increasing the bonding time due to formation and growth of IMCs. In the joint with Sn-3.0Ag-0.5Cu (mass%), IMCs formed at the joint interface and did not disperse in the entire joint.

scholarly journals Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

2014 ◽  
Vol 2014 ◽  
pp. 1-11 ◽  
Author(s):  
Jinhua Mi ◽  
Yan-Feng Li ◽  
Yuan-Jian Yang ◽  
Weiwen Peng ◽  
Hong-Zhong Huang
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Censored Data ◽  
Life Prediction ◽  
Ball Grid Array ◽  
Lead Free ◽  
Microelectronic Packaging ◽  
Type I ◽  
Lead Free Solder ◽  
Free Solder

Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA) and fine-pitch ball grid array (FBGA) interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.

Impact reliability estimation of lead free solder joint with IMC layer

2009 ◽  
Vol 517 (14) ◽  
pp. 4255-4259 ◽  
Author(s):  
Jong-Min Kim ◽  
Seung-Wan Woo ◽  
Yoon-Suk Chang ◽  
Young-Jin Kim ◽  
Jae-Boong Choi ◽  
...  
Keyword(s):  
Solder Joint ◽  
Reliability Estimation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
Impact Reliability

Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows

2016 ◽  
Vol 46 (3) ◽  
pp. 1674-1682 ◽  
Author(s):  
Yan Li ◽  
Olen Hatch ◽  
Pilin Liu ◽  
Deepak Goyal
Keyword(s):  
Solder Joint ◽  
Lead Free ◽  
Lead Free Solder ◽  
Root Cause ◽  
Free Solder
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