Analysis of Failures Associated with Intergranular Fracture

2008 ◽  
pp. 209-209-25 ◽  
Author(s):  
JV Pellegrino ◽  
RF McCartney
Keyword(s):  
Intergranular Fracture ◽  
Analysis Of Failures

Some applications of electron beam microanalysis techniques in VLSI process evaluation

1983 ◽  
Vol 41 ◽  
pp. 160-161
Author(s):  
Simon Thomas
Keyword(s):  
Integrated Circuits ◽  
Process Evaluation ◽  
Large Scale ◽  
Technology Development ◽  
Analytical Techniques ◽  
Successful Implementation ◽  
Analysis Of Failures ◽  
Characterization Of Materials ◽  
Circuits Vlsi

Trends in the technology development of very large scale integrated circuits (VLSI) have been in the direction of higher density of components with smaller dimensions. The scaling down of device dimensions has been not only laterally but also in depth. Such efforts in miniaturization bring with them new developments in materials and processing. Successful implementation of these efforts is, to a large extent, dependent on the proper understanding of the material properties, process technologies and reliability issues, through adequate analytical studies. The analytical instrumentation technology has, fortunately, kept pace with the basic requirements of devices with lateral dimensions in the micron/ submicron range and depths of the order of nonometers. Often, newer analytical techniques have emerged or the more conventional techniques have been adapted to meet the more stringent requirements. As such, a variety of analytical techniques are available today to aid an analyst in the efforts of VLSI process evaluation. Generally such analytical efforts are divided into the characterization of materials, evaluation of processing steps and the analysis of failures.

Morphology and atomic structure of segregated grain boundaries in Cu-Sb

1992 ◽  
Vol 50 (1) ◽  
pp. 254-255
Author(s):  
R. W. Fonda ◽  
D. E. Luzzi
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Intergranular Fracture ◽  
Atomic Structure ◽  
Copper Alloys ◽  
Polycrystalline Materials ◽  
Grain Boundary Embrittlement ◽  
Boundary Embrittlement

The properties of polycrystalline materials are strongly dependant upon the strength of internal boundaries. Segregation of solute to the grain boundaries can adversely affect this strength. In copper alloys, segregation of either bismuth or antimony to the grain boundary will embrittle the alloy by facilitating intergranular fracture. Very small quantities of bismuth in copper have long been known to cause severe grain boundary embrittlement of the alloy. The effect of antimony is much less pronounced and is observed primarily at lower temperatures. Even though moderate amounts of antimony are fully soluble in copper, concentrations down to 0.14% can cause grain boundary embrittlement.

Effect of grain boundary migration on intergranular fracture in the weld metal of steels

2021 ◽  
pp. 1-9
Author(s):  
Suo Saruwatari ◽  
Takahiro Kamo ◽  
Yuki Nakata ◽  
Kota Kadoi ◽  
Hiroshige Inoue
Keyword(s):  
Grain Boundary ◽  
Weld Metal ◽  
Intergranular Fracture ◽  
Boundary Migration ◽  
Grain Boundary Migration

Models of Intergranular Fracture-Decohered Boundaries

1998 ◽  
Vol 294-296 ◽  
pp. 673-676 ◽  
Author(s):  
A.G. Crocker ◽  
Gillian E. Smith ◽  
Peter E.J. Flewitt ◽  
Robert Moskovic
Keyword(s):  
Intergranular Fracture

Fracture Morphology and Residual Stresses of TiAl-Based Alloys Sheet Fabricated by EB-PVD

2006 ◽  
Vol 324-325 ◽  
pp. 307-310
Author(s):  
De Ming Zhang ◽  
Gui Qing Chen ◽  
Chun Mei Zhang ◽  
Jie Cai Han
Keyword(s):  
Free Surface ◽  
Numerical Calculation ◽  
Tensile Stress ◽  
Residual Stresses ◽  
Intergranular Fracture ◽  
Cleavage Fracture ◽  
Vacuum Annealing ◽  
Fracture Morphology ◽  
Columnar Crystal ◽  
X Ray

The TiAl-based alloys sheet with 150 mm × 100 mm × 0.4 mm was fabricated successfully by using EB-PVD method. The fracture morphology and residual stresses of the sheet were analyzed by SEM, numerical calculation and X-ray stress analyzer. The results indicate that before stripping, the depositional layers have a higher compressive stress, and the substrate has a very lower tensile stress. For the isolated TiAl-based alloys sheet, the microstructure of as-deposited sheet is columnar crystal, and the residual stresses distribution on the free surface has a trend that its magnitude decreased gradually from center to edges. After vacuum annealing at 1273 K for 16 h, the columnar crystal transforms into the equiaxed, the residual stresses on the free surface are eliminated ultimately, and the fracture of the material is diverted from the manner of intergranular fracture to the mixed manner of intergranular fracture with cleavage fracture.

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