Thermomechanical and Fatigue Behavior of High-Temperature Lead and Lead-Free Solder Joints

2009 ◽  
pp. 60-60-22 ◽  
Author(s):  
Y-H Pao ◽  
S Badgley ◽  
R Govila ◽  
E Jih
Keyword(s):  
High Temperature ◽  
Solder Joints ◽  
Fatigue Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Formation and Mechanical Properties of Intermetallic Compounds in Sn-Cu High-Temperature Lead-Free Solder Joints

2010 ◽  
Vol 654-656 ◽  
pp. 2450-2454 ◽  
Author(s):  
De Kui Mu ◽  
Hideaki Tsukamoto ◽  
Han Huang ◽  
Kazuhiro Nogita
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Intermetallic Compounds ◽  
Solder Joints ◽  
Nickel Content ◽  
Lead Free ◽  
Lead Free Solder ◽  
Nickel Addition ◽  
Free Solder ◽  
Lead Free Solders

High-temperature lead-free solders are important materials for electrical and electronic devices due to increasing legislative requirements that aim at reducing the use of traditional lead-based solders. For the successful use of lead-free solders, a comprehensive understanding of the formation and mechanical properties of Intermetallic Compounds (IMCs) that form in the vicinity of the solder-substrate interface is essential. In this work, the effect of nickel addition on the formation and mechanical properties of Cu6Sn5 IMCs in Sn-Cu high-temperature lead-free solder joints was investigated using Scanning Electron Microscopy (SEM) and nanoindentation. It was found that the nickel addition increased the elastic modulus and hardness of the (Cu, Ni)6Sn5. The relationship between the nickel content and the mechanical properties of the IMCs was also established.

A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints

2005 ◽  
Vol 297-300 ◽  
pp. 831-836 ◽  
Author(s):  
Il Ho Kim ◽  
Tae Sang Park ◽  
Se Young Yang ◽  
Soon Bok Lee
Keyword(s):  
Solder Joints ◽  
Large Strain ◽  
Fatigue Behavior ◽  
Fatigue Property ◽  
Element Model ◽  
Lead Free ◽  
Strain Effect ◽  
Lead Free Solder ◽  
Power Cycling ◽  
Free Solder

Fatigue behaviors of 63Sn37Pb and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling to solder joints than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluate the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder joint in BGA packages. The results revealed that lead free solder joints have a good fatigue property in the low temperature condition, where a small strain was induced. In the high temperature condition where a large strain was induced, however, lead contained solder joints have a longer fatigue life.

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