A Comparative Study on Thermal and Mechanical Fatigue Behavior for Lead-Free Solder Joints

2006 ◽  
Author(s):  
Ilho Kim ◽  
Soon-Bok Lee
Keyword(s):  
Comparative Study ◽  
Solder Joints ◽  
Fatigue Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Mechanical Fatigue ◽  
Free Solder

A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints

2005 ◽  
Vol 297-300 ◽  
pp. 831-836 ◽  
Author(s):  
Il Ho Kim ◽  
Tae Sang Park ◽  
Se Young Yang ◽  
Soon Bok Lee
Keyword(s):  
Solder Joints ◽  
Large Strain ◽  
Fatigue Behavior ◽  
Fatigue Property ◽  
Element Model ◽  
Lead Free ◽  
Strain Effect ◽  
Lead Free Solder ◽  
Power Cycling ◽  
Free Solder

Fatigue behaviors of 63Sn37Pb and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling to solder joints than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluate the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder joint in BGA packages. The results revealed that lead free solder joints have a good fatigue property in the low temperature condition, where a small strain was induced. In the high temperature condition where a large strain was induced, however, lead contained solder joints have a longer fatigue life.

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