High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height

2012 ◽  
Vol 52 (12) ◽  
pp. 2982-2994 ◽  
Author(s):  
Emeka H. Amalu ◽  
N.N. Ekere
Keyword(s):  
High Temperature ◽  
Fatigue Life ◽  
Flip Chip ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
High Temperature Fatigue ◽  
Free Solder

Application of Finite Element Method in Optimal Design of Flip-Chip Package

2011 ◽  
Vol 264-265 ◽  
pp. 1660-1665
Author(s):  
Yong Cheng Lin ◽  
Yu Chi Xia
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Flip Chip ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

More and more solder joints in circuit boards and electronic products are changing to lead free solder, placing an emphasis on lead free solder joint reliability. Solder joint fatigue failure is a serious reliability concern in area array technologies. In this study, the effects of substrate materials on the solder joint thermal fatigue life were investigated by finite element model. Accelerated temperature cycling loading was imposed to evaluate the reliability of solder joints. The thermal strain/stress in solder joints of flip chip assemblies with different substrates was compared, and the fatigue life of solder joints were evaluated by Darveaux’s crack initiation and growth model. The results show the mechanisms of substrate flexibility on improving solder joint thermal fatigue.

Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints

2011 ◽  
Author(s):  
Takahiro Akutsu ◽  
Qiang Yu
Keyword(s):  
Grain Size ◽  
Fatigue Crack ◽  
Fatigue Life ◽  
Solder Joint ◽  
Crack Propagation ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Micro Structure ◽  
Free Solder

This paper presents the influence of the micro structure on the crack propagation in lead free solder joint. The author’s group have studied the Manson-Coffin’s law for lead free solder joint by using the isothermal fatigue test and FEM analytical approaches to establish the practicable evaluation of thermal fatigue life of solder joints, for example, for the Sn-Cu-Ni solder, because this solder is attracted from the aspect of the decrease of solder leach in the flow process and material cost. However, even if the same loading is given to the solder joints of BGA test piece, there was a large dispersion in the fatigue life. Even though the effect of the shape difference has been considered, the range of the dispersion could not been explained sufficiently. In the study, the fatigue crack propagation modes in the solder joints were investigated, and an internal fatigue crack mode and an interfacial fatigue crack mode were confirmed. And the tendency of a shorter on fatigue life in the interfacial fatigue mode was confirmed. To clarify the mechanism of these fatigue crack modes, the crystal grain size in the solder joints was investigated before the fatigue test and also after the test. Furthermore, the verification of the mechanism using FEM models considering the crystal grain size was carried out. First of all, each element in FEM models matching to the average crystal grain size was made. Second, the inelastic strain ranges in each FEM models were studied. As a result, it was shown that the influence of the crude density of the crystal grain to the fatigue crack progress can be evaluated. In addition, the micro structure of the solder joint of large-scale electronic devices is observed, and FEM model was made based on the observation result. As a result, it was shown that the influence of the directionality with the crystal grain to the fatigue crack progress can be evaluated.

Effect of Void on Fatigue Life of Lead-Free Solder Joints

2002 ◽  
Vol 2002 (0) ◽  
pp. 9-10
Author(s):  
Ken KAMINISHI ◽  
Yukihiro KAWAMURA ◽  
Motoharu TANEDA ◽  
Hirohide KAIDA
Keyword(s):  
Fatigue Life ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life

2015 ◽  
Author(s):  
Takashi Kawakami ◽  
Takahiro Kinoshita ◽  
Hirokazu Oriyama
Keyword(s):  
Fatigue Life ◽  
Solder Joints ◽  
Low Cycle Fatigue ◽  
Lead Free ◽  
Design Rule ◽  
Lead Free Solder ◽  
Cycle Fatigue ◽  
Stress Strain ◽  
Test Pieces ◽  
Free Solder

Solder joints are sometimes opened under thermal cyclic loads as low cycle fatigue phenomena. The fatigue crack is usually initiated around the edge of the interface where stress and strain very severely concentrate, having stress strain singularity. In this study, Sn-3.0Ag-0.5Cu test pieces with V shape notch were supplied to low cycle fatigue tests at 100°C. And inelastic stress strain simulations, which were based on time-dependent non-unified material model, were carried out under several cyclic load levels to obtain strain distributions around the bottom of the V notch. By results of fatigue test and inelastic simulation, the depth from the bottom of the V notch, where the strain range agrees with the prediction of the fatigue life based on smooth test pieces on Coffin-Manson rule, was investigated as the mechanical design rule for lead free solder joints.

scholarly journals Fatigue Life Estimation of Lead-Free Solder Joints Using Viscoplastic-Creep Separate Constitutive Model

2014 ◽  
Vol 3 (4) ◽  
pp. 218-224
Author(s):  
Takeharu HAYASHI ◽  
Hirohiko WATANABE ◽  
Yoshinori EBIHARA ◽  
Tatsuhiko ASAI
Keyword(s):  
Fatigue Life ◽  
Constitutive Model ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Life Estimation ◽  
Fatigue Life Estimation ◽  
Free Solder

Failure mechanism of lead-free solder joints in flip chip packages

2002 ◽  
Vol 31 (11) ◽  
pp. 1256-1263 ◽  
Author(s):  
Fan Zhang ◽  
Ming Li ◽  
Bavani Balakrisnan ◽  
William T. Chen
Keyword(s):  
Failure Mechanism ◽  
Flip Chip ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder
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