Specification for Integrated Circuit Lead Frame Material

2020 ◽  
Author(s):  
Keyword(s):  
Integrated Circuit ◽  
Lead Frame

Simulation Analysis of Springback for Lead Frame Copper Alloy

2012 ◽  
Vol 560-561 ◽  
pp. 1048-1051 ◽  
Author(s):  
Juan Hua Su ◽  
Feng Zhang Ren ◽  
Ze Yang
Keyword(s):  
Integrated Circuit ◽  
Copper Alloy ◽  
High Performance ◽  
Simulation Analysis ◽  
Copper Alloys ◽  
Lead Frame ◽  
Bending Performance ◽  
Curvature Variation ◽  
Modeling Software ◽  
Bending Radius

The bending performance of lead frame materials is a very important in improving the quality of lead frame alloys and meeting the needs of high performance integrated circuit. The sringback amount of curvature variation of CuFeP , CuCrZrMg , CuNiSi and CuCrSnZn alloy are researched by numerical simulation. Bending model is built by 3D modeling software, and the necessary post-processing is carried out. The bending springback amount △K of the four kinds of copper alloy materials are calculated out. The results show that the sringback amount of curvature variation of four copper alloys at the same condition from large to small in turn is CuCrZrMg, CuNiSi, CuFeP, CuCrSnZn. Smaller the minimum relatively bending radius of copper alloy used in lead frame, less the springback amount and better the forming performance.

Size Detection System for Integrated Circuit Lead Frame Using Machine Vision

2018 ◽  
Author(s):  
Lu Chen ◽  
Yuying Guo ◽  
Hongyu Chu ◽  
Yanhua Shao ◽  
Zhiyuan Chang ◽  
...  
Keyword(s):  
Machine Vision ◽  
Integrated Circuit ◽  
Detection System ◽  
Lead Frame

scholarly journals MODIFIKASI MESIN TRIM FORM PADA PROSES PENGEMASAN INTEGRATED CIRCUIT UNTUK PENURUNAN DAMAGED LEAD

2020 ◽  
Vol 12 (1) ◽  
pp. 36-40
Author(s):  
Nur Sakinah Asaad ◽  
Purwanto Purwanto
Keyword(s):  
Integrated Circuit ◽  
Lead Frame ◽  
Low Profile ◽  
Quad Flat Package ◽  
Pick And Place

Proses pengemasan Integrated Circuit (IC) pada kemasan Low Profile Quad Flat Package (LQFP) membutuhkan mesin trim form untuk pemotongan dambar dan pembentukan kaki IC sebelum dipisahkan dari lead frame. Salah satu urutan proses pada mesin trim form adalah offload yaitu penempatan IC ke dalam tray dengan modul pick and place termasuk didalamnya turn table dengan pergerakan buka tutup untuk menyesuaikan jarak antar kolom dari leadframe sebelum dipindahkan ke tray. Pergerakan buka tutup dari turn table ini berpengaruh terhadap cacat produksi damaged lead. Modifikasi ditujukan untuk deteksi dini misalignment sehingga mesin dapat berhenti otomatis dan mengurangi cacat produksi melalui penambahan dua sensor proximity pada turn table. Hasil penelitian menunjukkan penurunan error pada turn table sebesar 88% dan assembly yield mencapai 99.985% atau terjadi peningkatan sebesar 0.07%.

Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids

2015 ◽  
Vol 137 (2) ◽  
Author(s):  
Youmin Yu ◽  
Victor Chiriac ◽  
Yingwei Jiang ◽  
Zhijie Wang
Keyword(s):  
Heat Transfer ◽  
Theoretical Prediction ◽  
Integrated Circuit ◽  
Sequential Optimization ◽  
Solder Paste ◽  
Lead Frame ◽  
Reflow Process ◽  
Sequential Method ◽  
Die Attach ◽  
Solder Reflow

Solder voids are detrimental to the thermal, mechanical, and reliability performance of integrated circuit (IC) packages and must be controlled within certain specifications. A sequential method of optimizing solder-reflow process to reduce die-attach solder voids in power quad flat no-lead (QFN) packages is presented. The sequential optimization consists, in turn, of theoretical prediction, heat transfer comparison, and experimental validation. First, the theoretical prediction uses calculations to find the optimal pause location and time for a lead frame strip (with dies bonded to it by solder paste) to receive uniform heat transfer during the solder-reflow stage. Next, reflow profiles at different locations on the lead frame strip are measured. Heat transfer during the reflow stage at these locations is calculated from the measured reflow profiles and is compared to each other to confirm the theoretical prediction. Finally, only a minimal number of actual trials are conducted to verify the predicted and confirmed optimal process. Since the theoretical prediction and heat transfer comparison screens out most of the unnecessary trials which must be conducted in common design of experiment (DoE) and trial-and-error methods, the sequential optimization method saves significant time and cost.

Lead Frame Metal Migration in an Encapsulated IC Package

2008 ◽  
Author(s):  
William Eslinger
Keyword(s):  
Metal Oxide ◽  
Failure Mechanism ◽  
Integrated Circuit ◽  
Lead Frame ◽  
Low Resistance ◽  
Die Attach ◽  
Metal Migration ◽  
Silicon Device ◽  
Ic Package

Abstract This case study details a latent integrated circuit (IC) failure mechanism caused by the migration of silver (Ag) inside the encapsulated package of a CMOS (complementary metal-oxide-silicon) device. The plating of the lead frame was the source of the migrated silver, which was redeposited along the interface between the die attach epoxy and the plastic encapsulate. The resulting metallic ‘stringers’ bridged adjacent lead frame legs over distances greater than 150 μm and created relatively low-resistance paths capable of carrying 100’s of micro-amps.

Identification of Ni3B precipitates in annealed electroless nickel films

1986 ◽  
Vol 44 ◽  
pp. 592-593
Author(s):  
D. R. Kitchen
Keyword(s):  
Electron Microscopy ◽  
Integrated Circuit ◽  
Electroless Nickel ◽  
Boride Phase ◽  
Electroless Nickel Plating ◽  
Nickel Matrix ◽  
Lead Frame ◽  
Nickel Plating ◽  
Transmission Electron ◽  
The Subject

Electroless nickel plating is a process which depends upon the autocatalytic reduction of nickel cations by a suitable reducing agent in an aqueous solution. In this paper electroless nickel is a nickel-boron alloy. Most previous work has involved nickel-phosphorous alloys, however, very little work has been carried out on Ni-B which is the subject of the current work. The microstructure of as-plated and aged electroless nickel-boron thin films, used as the lead frame finish for dual-in-line integrated circuit packages, has been studied by high resolution transmission electron microscopy. In this work the boride phase in the nickel matrix of the annealed plate was identified and characterized.

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