Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic Pb-Sn and Pb-free solders

2003 ◽  
Author(s):  
Xingjia Huang
Keyword(s):  
Shear Strength ◽  
Solder Ball ◽  
Flip Chip ◽  
Ball Grid Array ◽  
Ball Shear ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Ball Shear Strength

The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

1998 ◽  
Author(s):  
C.H. Zhong ◽  
Sung Yi
Keyword(s):  
Failure Mode ◽  
Barrier Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Reliability Test ◽  
Shear Forces ◽  
Ball Shear ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Abstract Ball shear forces of plastic ball grid array (PBGA) packages are found to decrease after reliability test. Packages with different ball pad metallurgy form different intermetallic compounds (IMC) thus ball shear forces and failure modes are different. The characteristic and dynamic process of IMC formed are decided by ball pad metallurgy which includes Ni barrier layer and Au layer thickness. Solder ball composition also affects IMC formation dynamic process. There is basically no difference in ball shear force and failure mode for packages with different under ball pad metallurgy before reliability test. However shear force decreased and failure mode changed after reliability test, especially when packages exposed to high temperature. Major difference in ball shear force and failure mode was found for ball pad metallurgy of Ni barrier layer including Ni-P, pure Ni and Ni-Co. Solder ball composition was found to affect the IMC formation rate.

Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages

2006 ◽  
Vol 306-308 ◽  
pp. 1043-1048
Author(s):  
Yi-Ming Jen ◽  
Hsi Hsin Chien ◽  
Tsung-Shu Lin ◽  
Shih Hsiang Huang
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Ball ◽  
Flip Chip ◽  
Ball Grid Array ◽  
Stress Strain ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Solder Balls

This research studied the thermal fatigue life for eutectic solder balls of thermally enhanced flip-chip plastic ball grid array (FC-PBGA) packages with different lid materials under thermal cycling tests. Three FC-PBGA packages with different lid materials, i.e., Al, AlSiC, and Cu, were utilized to examine the lid material effect on solder ball reliability. The cyclic stress/strain behavior for the packages was estimated by using the nonlinear finite element method. The eutectic solder was assumed to be elastic-plastic-creep. The stable stress/strain results obtained from FEM analysis were utilized to predict the thermal fatigue life of solder balls by using the Coffin-Manson prediction model. Simulation results showed that the fatigue life of the FC-PBGA package with a Cu lid was much shorter than FC-PBGA packages with other lid materials. The relatively shorter fatigue life for the FC-PBGA package with a Cu lid was due to the complex constrained behavior caused by the thermal mismatch between the lid, substrate and the printed circuit board. The difference was insignificant in the fatigue lives between the package with an Al lid and the conventional package.

Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls

2002 ◽  
Author(s):  
S. W. Ricky Lee ◽  
Yat-Kit Tsui ◽  
Xingjia Hunag ◽  
Eric C. C. Yan
Keyword(s):  
Shear Strength ◽  
Room Temperature ◽  
Solder Ball ◽  
Ball Shear ◽  
Plastic Ball ◽  
Room Temperature Aging ◽  
Solder Balls ◽  
Ball Shear Strength ◽  
Temperature Aging ◽  
Temperature Storage

This paper presents an experimental investigation on the solder ball shear strength of plastic ball grid array (PBGA) packages. The emphasis is placed on showing the effect of room temperature aging on the degradation of solder ball shear strength. The specimens under investigation are standard commercial PBGA packages with 63Sn-37Pb eutectic solder balls. The specimens are subject to various lengths (up to 72 hours) of room temperature aging after the reflow. Afterwards, ball shear tests are performed to evaluate the solder ball shear strength. The experimental results show that the solder ball shear strength may drop up to 10% within 3 days of room temperature aging. The outcome of the present study may give a general guideline for the meaningful comparison of solder ball shear strength.

The Study on The Under Bump Metallurgy (Ubm) and 63SN-37PB Solder Bumps Interface for Flip Chip Interconnection

1998 ◽  
Vol 515 ◽  
Author(s):  
Se-Young Jang ◽  
Kyung-Wook Paik
Keyword(s):  
Shear Strength ◽  
Direct Contact ◽  
Flip Chip ◽  
Organic Substrates ◽  
Adhesion Properties ◽  
Ball Shear ◽  
Solder Bumps ◽  
Diffusion Barrier Layer ◽  
Solder Reflow ◽  
Ball Shear Strength

ABSTRACTIn the flip chip interconnection on organic substrates using eutectic Pb/Sn solder bumps, highly reliable Under Bump Metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as l.tm Al/0.2 μm Ti/5 μm Cu, l μm A1/0.2 μm Ti/l μm Cu, 1 μm A1/0.2 μm Ni/1 μm Cu and 1 μm At/10.2μm Pd/l μm Cu, laid under eutectic Pb/Sn solder of low melting point, were investigated with regard to their interfacial reactions and adhesion properties. The effects of numbers of solder reflow and aging time on the growth of intermetallic compounds (IMC) and on the solder ball shear strength were investigated. Good ball shear strength was obtained with 1 μm AI/0.2μm Ti/5μm Cu and 1 μm Al/0.2 μm Ni/l μm Cu even after 4 solder reflows or 7 day aging at 150°C. In contrast, l μm Al/0.2 μm Ti/l μm Cu and l μm A1/0.21μm Pd/μm Cu shows poor ball shear strength. The decrease of the shear strength was mainly due to the direct contact between solder and nonwettable metal such as Ti and Al resulting in a delamination. Thin 1 μm Cu and 0.2 μm Pd diffusion barrier layer were completely consumed by Cu-Sn and Pd-Sn reaction.

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages

2009 ◽  
Vol 32 (4) ◽  
pp. 901-908 ◽  
Author(s):  
Lei Nie ◽  
M. Osterman ◽  
Fubin Song ◽  
J. Lo ◽  
S.W.R. Lee ◽  
...  
Keyword(s):  
Solder Ball ◽  
Ball Grid Array ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Ball Grid Array Packages
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