Technical evaluation of a near chip scale size flip chip/plastic ball grid array package

2002 ◽  
Author(s):  
M. Jimarez ◽  
Li Li ◽  
C. Tytran ◽  
C. Loveland ◽  
J. Obrzut
Keyword(s):  
Flip Chip ◽  
Ball Grid Array ◽  
Scale Size ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Ball Grid Array Package ◽  
Technical Evaluation

Strain Measurements in a Thermally-Cycled Flip-Chip PBGA Solderball

1999 ◽  
Vol 563 ◽  
Author(s):  
E. S. Drexler
Keyword(s):  
Flip Chip ◽  
Ball Grid Array ◽  
Organic Substrates ◽  
Strain Measurements ◽  
Silicon Chips ◽  
Flip Chips ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Ball Grid Array Package ◽  
Solder Fatigue

AbstractThe mismatch between the coefficients of thermal expansion of silicon chips and their organic substrates has been mitigated through the practice of using underfill in flip-chip packages. Yet solder fatigue and package failures still occur. This is particularly true for flip-chips on organic substrates that are thermally cycled between low (−55 °C) and high temperatures (125 °C). In this study, I used electron-beam moir6 to measure displacements and calculate strains in a solderball contained in a flip-chip plastic-ball grid array package. A crossed-line grating with a pitch of 450 nm was used to allow detailed measurements of the local displacements from a cross section of a flip-chip package. Elastic displacements were observed and measured, and the v-field displacements, out of the plane of the chip, were more significant than the shear or u-field, in the plane of the chip, displacements. Larger v-field displacements were measured near the center of the silicon chip than at the edge of the chip.

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