ABSTRACTCluster ion beam processes which employ ions comprised of a few hundred to several thousand atoms are being developed into a new field of ion beam technology. The processes are characterized by low energy surface interaction effects, lateral sputtering phenomena and high-rate chemical reaction effects. This paper reviews the current status of studies of the fundamental cluster ion beam characteristics as they apply to nanoscale processing and present industrial applications. As new prospective applications, techniques are now being developed to employ cluster ions in surface analysis tools such as XPS and SIMS and to modify surfaces of bio-materials. Results related to these new projects will also be reviewed.
Argon Gas Cluster Ion Beam for Practical Surface Analysis