scholarly journals Next-generation on-chip plasmonic tweezer with a built-in light source

OSA Continuum ◽  
2020 ◽  
Vol 3 (8) ◽  
pp. 2044 ◽  
Author(s):  
Ali Asghar Khorami ◽  
Mohammad Kazem Moravvej-Farshi ◽  
Sara Darbari
Keyword(s):  
2019 ◽  
Vol 141 (1) ◽  
Author(s):  
Aastha Uppal ◽  
Jerrod Peterson ◽  
Je-Young Chang ◽  
Xi Guo ◽  
Frank Liang ◽  
...  

The demands for both thinner bare-die ball grid array (BGA) packages and thinner thermal solutions have added complexity for the thermal enabling design and material options associated with system on chip packages in mobile personal computer (PC) platforms. The thermomechanical interactions between the bare-die package and the thermal solution are very critical, creating the needs for: (1) an in-depth thermomechanical characterization to understand their impacts on product quality and performance and (2) a simple and yet robust modeling methodology to analyze design parameters using a commercially available software. In this paper, experimental metrologies and modeling methodology are developed with the details of contents documented. Validation of the newly developed tools and recommendation/guidance are also discussed for detailed assessments of thermomechanical tradeoffs for optimal design spaces for next-generation mobile platforms.


2005 ◽  
pp. 35-89 ◽  
Author(s):  
Theocharis Theocharides ◽  
Gregory M. Link ◽  
Narayanan Vijaykrishnan ◽  
Mary Jane Irwin

2016 ◽  
Vol 9 (2) ◽  
pp. 312-317 ◽  
Author(s):  
Zhicheng Liu ◽  
Hao Sun ◽  
Leijun Yin ◽  
Yongzhuo Li ◽  
Jianxing Zhang ◽  
...  

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