High-speed electroabsorption (EA) modulator modules using the flip-chip bonding (FCB) technique

2001 ◽  
Author(s):  
T. Miyahara ◽  
S. Kaneko ◽  
M. Noda ◽  
M. Ishizaki ◽  
Y. Kitamura ◽  
...  
Keyword(s):  
High Speed ◽  
Flip Chip ◽  
Flip Chip Bonding

High-speed optoelectronic VLSI switching chip with <4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS

1996 ◽  
Vol 2 (1) ◽  
pp. 77-84 ◽  
Author(s):  
A.L. Lentine ◽  
K.W. Goossen ◽  
J.A. Walker ◽  
L.M.F. Chirovsky ◽  
L.A. D'Asaro ◽  
...  
Keyword(s):  
High Speed ◽  
Flip Chip ◽  
Flip Chip Bonding ◽  
Silicon Cmos

Fully integrated low-power flip chip bonding of arrayed optoelectronic devices on SOS

2002 ◽  
Author(s):  
Ronald E. Reedy ◽  
Hal Anthony ◽  
Charles Kuznia ◽  
Mike Pendelton ◽  
Jim Cable ◽  
...  
Keyword(s):  
Low Power ◽  
Flip Chip ◽  
Optoelectronic Devices ◽  
Fully Integrated ◽  
Flip Chip Bonding

High-speed flip-chip InP/InGaAs avalanche photodiodes with ultralow capacitance and large gain-bandwidth products

1991 ◽  
Vol 3 (12) ◽  
pp. 1115-1116 ◽  
Author(s):  
Y. Kito ◽  
H. Kuwatsuka ◽  
T. Kumai ◽  
M. Makiuchi ◽  
T. Uchida ◽  
...  
Keyword(s):  
High Speed ◽  
Flip Chip ◽  
Avalanche Photodiodes ◽  
Gain Bandwidth ◽  
Large Gain
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