Automatic interference method for measuring transparent film thickness

A multi-wavelength light interference method for the measurement of lubricating film thickness was proposed for the improvement of convenience and accuracy of monochromatic light interferometry. Through the successive analysis of the hypothetical curves and the revised curves of three-wavelength light interference, the procedures of this method were discussed in detail. Then three-wavelength light interference method was applied to measure the lubricating film thickness of base oil under a specific condition. In comparison with the numerical results of Hamrock-Dowson formula, it was concluded that the multi-wavelength light interference method is applicable for the measurement of lubricating film thickness. With this method, the only requirement is the images which captured in stationary and purposed conditions, and higher measurement accuracy can be achieved.

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Surface Films on Zircaloy-2 Samples Cracked in Neutral Aqueous NaCl by Stress Corrosion

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100070679 ◽

1973 ◽

Vol 31 ◽

pp. 46-47

Author(s):

R.A. Ploc

Keyword(s):

Electron Microscopy ◽

Transmission Electron Microscopy ◽

Film Thickness ◽

Stress Corrosion ◽

Zirconium Dioxide ◽

Surface Film ◽

Surface Films ◽

Continuous Layer ◽

Transmission Electron ◽

Product Film

Samples of low-nickel Zircaloy-2 (material MLI-788-see(1)), when anodically polarized in neutral 5 wt% NaCl solutions, were found to be susceptible to pitting and stress corrosion cracking. The SEM revealed that pitting of stressed samples was occurring below a 2000Å thick surface film which behaved differently from normal zirconium dioxide in that it did not display interference colours. Since the initial film thickness was approximately 65Å, attempts were made to examine the product film by transmission electron microscopy to deduce composition and how the corrosion environment could penetrate the continuous layer.

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(111) Monocrystalline Nickel Films

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100095819 ◽

1972 ◽

Vol 30 ◽

pp. 512-513

Author(s):

T.E. Pratt ◽

R.W. Vook

Keyword(s):

Film Thickness ◽

Deposition Rate ◽

Room Temperature ◽

Narrow Range ◽

High Vacuum ◽

Residual Pressure ◽

Temperature Dependent ◽

Deposition Parameters ◽

Transmission Electron ◽

Substrate Temperatures

(111) oriented thin monocrystalline Ni films have been prepared by vacuum evaporation and examined by transmission electron microscopy and electron diffraction. In high vacuum, at room temperature, a layer of NaCl was first evaporated onto a freshly air-cleaved muscovite substrate clamped to a copper block with attached heater and thermocouple. Then, at various substrate temperatures, with other parameters held within a narrow range, Ni was evaporated from a tungsten filament. It had been shown previously that similar procedures would yield monocrystalline films of CU, Ag, and Au.For the films examined with respect to temperature dependent effects, typical deposition parameters were: Ni film thickness, 500-800 A; Ni deposition rate, 10 A/sec.; residual pressure, 10-6 torr; NaCl film thickness, 250 A; and NaCl deposition rate, 10 A/sec. Some additional evaporations involved higher deposition rates and lower film thicknesses.Monocrystalline films were obtained with substrate temperatures above 500° C. Below 450° C, the films were polycrystalline with a strong (111) preferred orientation.

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The method of replication affects metal film granularity and resolution

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100155517 ◽

1989 ◽

Vol 47 ◽

pp. 708-709

Author(s):

George C. Ruben

Keyword(s):

Electron Beam ◽

High Resolution ◽

Film Thickness ◽

Single Molecule ◽

Metal Film ◽

Vertical Surface ◽

High Resolution Imaging ◽

Controllable Factors ◽

Resolution Imaging

Single molecule resolution in electron beam sensitive, uncoated, noncrystalline materials has been impossible except in thin Pt-C replicas ≤ 150Å) which are resistant to the electron beam destruction. Previously the granularity of metal film replicas limited their resolution to ≥ 20Å. This paper demonstrates that Pt-C film granularity and resolution are a function of the method of replication and other controllable factors. Low angle 20° rotary , 45° unidirectional and vertical 9.7±1 Å Pt-C films deposited on mica under the same conditions were compared in Fig. 1. Vertical replication had a 5A granularity (Fig. 1c), the highest resolution (table), and coated the whole surface. 45° replication had a 9Å granulartiy (Fig. 1b), a slightly poorer resolution (table) and did not coat the whole surface. 20° rotary replication was unsuitable for high resolution imaging with 20-25Å granularity (Fig. 1a) and resolution 2-3 times poorer (table). Resolution is defined here as the greatest distance for which the metal coat on two opposing faces just grow together, that is, two times the apparent film thickness on a single vertical surface.

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