Bindings of a Secondary Polymer to Monodisperse Colloidal Silica Particles Modified with Poly(maleic anhydride–styrene) for Controlling the Surface Polarity

1996 ◽  
Vol 69 (9) ◽  
pp. 2667-2672 ◽  
Author(s):  
Kohji Yoshinaga ◽  
Makoto Teramoto
Keyword(s):  
Maleic Anhydride ◽  
Colloidal Silica ◽  
Silica Particles ◽  
Surface Polarity ◽  
Monodisperse Colloidal Silica

Preparation and Processing of Monodisperse Colloidal Silica-Cadmium sulfide nanocomposites

1994 ◽  
Vol 346 ◽  
Author(s):  
Song-Yuan Chang ◽  
Lei Liu ◽  
Sanford A. Asher
Keyword(s):  
Cadmium Sulfide ◽  
Surface Area ◽  
Colloidal Silica ◽  
High Surface ◽  
High Surface Area ◽  
Reaction Medium ◽  
Silica Particles ◽  
Linear Optics ◽  
Silica Colloids ◽  
Monodisperse Colloidal Silica

ABSTRACTA novel synthetic methodology has been developed for preparing monodisperse colloidal silica-cadmium sulfide nanocomposite spheres in the 50 – 300 nm size regime. This methodology uses water-in-oil microemulsions as the reaction medium. Monosize silica colloids are first produced by the controlled hydrolysis of tetraethyl orthosilicate in the micro water droplets of the microemulsion. Cadmium sulfide quantum dots are incorporated into the silica colloids during synthesis by the introductions of Cd2+ and S2- microemulsions. Various morphologies of the nanocomposite are fabricated by controlling the heterogeneous coagulation of CdS and SiO2. Unique high surface area silica particles can be prepared when nitric acid etches out the CdS and leaves behind topologically defined voids. The CdS nanocomposites are new materials useful for non-linear optics, while the high surface area silica particles should have novel applications in areas such as catalysis.

Synthesis of Fluorescent, Monodisperse, Colloidal Silica Particles

1993 ◽  
Vol 159 (1) ◽  
pp. 150-157 ◽  
Author(s):  
René Nyffenegger ◽  
Christian Quellet ◽  
Jaroslav Ricka
Keyword(s):  
Colloidal Silica ◽  
Silica Particles ◽  
Monodisperse Colloidal Silica

Ta/low-κ CMP with Colloidal Silica Particles

2003 ◽  
Vol 767 ◽  
Author(s):  
Patrice Beaud ◽  
Didier Bouvet ◽  
Pierre Fazan ◽  
Eric Jacquinot ◽  
Hiroyuki Aoki ◽  
...  
Keyword(s):  
Colloidal Silica ◽  
Dielectric Materials ◽  
Silica Particles ◽  
Integration Scheme ◽  
Force Microscopy ◽  
Atomic Force ◽  
Key Issues ◽  
Cu Interconnect ◽  
The Impact ◽  
Monodisperse Colloidal Silica

AbstractLow-κ/Cu interconnect integration achievement is one of the key issues for the future sub-100 nm technologies. Nowadays, no definitive integration scheme has been reported. Low-κ integration is especially difficult because the trench/via etching and CMP processes can damage its properties. In the present work, we present results on different materials that could be used in such integration. We focused our study on the barrier (Ta/TaN) and on a low-κ material (dense and porous), that is a spin-on-dielectric (SOD) of the methylsilsesquioxane (MSQ) type. CMP slurries were made from monodisperse colloidal silica particles. In a first approach, the slurries compositions mainly differed by their pH and abrasive characteristics. The particle size ranged from 12 to 80 nm, with a pH varying between 2 and 11. The sensitivity of the Ta/TaN and low-κ removal rates will also be reported. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) of the different films were carried out in order to evaluate the impact of CMP on their surface quality. Measurements did not show any surface degradation or/and scratches, and no delamination has been observed. Post-CMP κ value measurements have been carried out to highlight possible damage on the low-ê dielectric materials.

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