Capabilities of polymer-modified monodisperse colloidal silica particles as biomaterial carrier

1997 ◽  
Vol 275 (3) ◽  
pp. 220-226 ◽  
Author(s):  
K. Yoshinaga ◽  
K. Kondo ◽  
A. Kondo
1994 ◽  
Vol 346 ◽  
Author(s):  
Song-Yuan Chang ◽  
Lei Liu ◽  
Sanford A. Asher

ABSTRACTA novel synthetic methodology has been developed for preparing monodisperse colloidal silica-cadmium sulfide nanocomposite spheres in the 50 – 300 nm size regime. This methodology uses water-in-oil microemulsions as the reaction medium. Monosize silica colloids are first produced by the controlled hydrolysis of tetraethyl orthosilicate in the micro water droplets of the microemulsion. Cadmium sulfide quantum dots are incorporated into the silica colloids during synthesis by the introductions of Cd2+ and S2- microemulsions. Various morphologies of the nanocomposite are fabricated by controlling the heterogeneous coagulation of CdS and SiO2. Unique high surface area silica particles can be prepared when nitric acid etches out the CdS and leaves behind topologically defined voids. The CdS nanocomposites are new materials useful for non-linear optics, while the high surface area silica particles should have novel applications in areas such as catalysis.


1993 ◽  
Vol 159 (1) ◽  
pp. 150-157 ◽  
Author(s):  
René Nyffenegger ◽  
Christian Quellet ◽  
Jaroslav Ricka

2003 ◽  
Vol 767 ◽  
Author(s):  
Patrice Beaud ◽  
Didier Bouvet ◽  
Pierre Fazan ◽  
Eric Jacquinot ◽  
Hiroyuki Aoki ◽  
...  

AbstractLow-κ/Cu interconnect integration achievement is one of the key issues for the future sub-100 nm technologies. Nowadays, no definitive integration scheme has been reported. Low-κ integration is especially difficult because the trench/via etching and CMP processes can damage its properties. In the present work, we present results on different materials that could be used in such integration. We focused our study on the barrier (Ta/TaN) and on a low-κ material (dense and porous), that is a spin-on-dielectric (SOD) of the methylsilsesquioxane (MSQ) type. CMP slurries were made from monodisperse colloidal silica particles. In a first approach, the slurries compositions mainly differed by their pH and abrasive characteristics. The particle size ranged from 12 to 80 nm, with a pH varying between 2 and 11. The sensitivity of the Ta/TaN and low-κ removal rates will also be reported. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) of the different films were carried out in order to evaluate the impact of CMP on their surface quality. Measurements did not show any surface degradation or/and scratches, and no delamination has been observed. Post-CMP κ value measurements have been carried out to highlight possible damage on the low-ê dielectric materials.


2014 ◽  
Vol 1663 ◽  
Author(s):  
Dmitry Fomitchev ◽  
Russell Lewis ◽  
Hairuo Tu ◽  
Li Cheng ◽  
Hajime Kambara ◽  
...  

ABSTRACTWe report on a new class of materials for laser printer toner applications. These materials were prepared from methacrysilane-in-water emulsions stabilized with colloidal silica particles. In this elegant system, the colloidal silica particles reside at the water/oil interface helping to emulsify the oil droplet, self-organizing into a raspberry-like morphology. The emulsion formation is followed by free-radical polymerization, hydrophobic treatment, and drying steps. This one pot synthesis in water affords a hydrophobic material with a particle size in the range of 80 to 300 nm. The particle size could be fine-tuned by changing the oil-to-silica mass ratio or by using colloidal silica particles of different sizes. Results of material characterization by solid-state NMR, electron microscopy, and particle size measurements methods will be presented. Examples of possible extensions of the synthesis towards materials with methacrylsilane partially substituted with other methacrylates will be provided. Application of the new material in toners will be described as will the comparison of its performance with the incumbent material - hydrophobic colloidal silica.


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