scholarly journals Reaction Process of Titanium Tetrachloride with Ammonia in the Vapor Phase and Properties of the Titanium Nitride Formed

1982 ◽  
Vol 55 (10) ◽  
pp. 3193-3196 ◽  
Author(s):  
Yuzo Saeki ◽  
Ryoko Matsuzaki ◽  
Akimasa Yajima ◽  
Masayo Akiyama
Keyword(s):  
Titanium Nitride ◽  
Vapor Phase ◽  
Titanium Tetrachloride ◽  
Reaction Process

Downstream Plasma Activated Etching of IIIV Compound Semiconductorsa

1988 ◽  
Vol 144 ◽  
Author(s):  
R. Iyer ◽  
D.L. Lile
Keyword(s):  
Activation Energy ◽  
Apparent Activation Energy ◽  
Mass Spectrometer ◽  
Vapor Phase ◽  
Compound Semiconductors ◽  
Power Input ◽  
Reaction Process ◽  
Rf Power ◽  
Carrier Gas ◽  
Etch Rates

ABSTRACTWe have demonstrated a novel downstream plasma activated vapor phase etching of III-V compound semiconductors using ethylene di bromide as the etchant. Highly reproducible surfaces and etch rates were obtained by monitoring the reaction process with a mass spectrometer. Etch rates on InP of up to 4500Å/min, at temperatures as low as 160°C, at an rf power input of 25 watts were achieved with no evident damage to the surface as indicated by PL measurements. Apparent activation energy measurements seem to suggest that the etch products might be organometallic in nature, in contrast to inorganic etch products seen in most etching studies. Etching is partially anisotropic and resulted in smoother surfaces when H2 was used as the carrier gas for the etchant instead of N2.

Terminal and Bridging Imido Complexes from Titanium Tetrachloride and Primary Amines. Implications for the Chemical Vapor Deposition of Titanium Nitride Films

1994 ◽  
Vol 33 (25) ◽  
pp. 5879-5889 ◽  
Author(s):  
T. Suren Lewkebandara ◽  
Philip H. Sheridan ◽  
Mary Jane Heeg ◽  
Arnold L. Rheingold ◽  
Charles H. Winter
Keyword(s):  
Chemical Vapor Deposition ◽  
Titanium Nitride ◽  
Vapor Deposition ◽  
Titanium Tetrachloride ◽  
Chemical Vapor ◽  
Primary Amines ◽  
Imido Complexes
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