MEMS Packaging

2016 ◽  
pp. 141-162
Keyword(s):  
Mems Packaging

Localized heating/bonding techniques in MEMS packaging

2005 ◽  
Author(s):  
J. R. Mabesa, Jr. ◽  
A. J. Scott ◽  
X. Wu ◽  
G. W. Auner
Keyword(s):  
Mems Packaging ◽  
Localized Heating

MEMS Post-Packaging by Localized Heating

2000 ◽  
Author(s):  
Liwei Lin
Keyword(s):  
Vapor Deposition ◽  
Microelectromechanical Systems ◽  
Chemical Vapor ◽  
Research Subject ◽  
Major Research ◽  
Research Directions ◽  
Mems Packaging ◽  
Fusion Bonding ◽  
Localized Heating ◽  
Pressure Chemical

Abstract This work addresses important post-packaging issues for microelectromechanical systems (MEMS) and introduces specific research directions by means of localized heating and bonding. MEMS packaging has become a major research subject due to the stringent packaging requirements in the emerging filed of MEMS. Establishing a versatile post-packaging process not only advances the field scientifically but also helps product commercialization in industry. An innovative post-packaging approach by localized heating and bonding is proposed and presented in this paper. Various post-packaging processes are demonstrated, including an integrated LPCVD (Low Pressure Chemical Vapor Deposition) sealing process, localized silicon-gold eutectic bonding, localized silicon-glass fusion bonding, localized solder bonding and localized CVD bonding processes.

The IP Landscape for MEMS Packaging

2009 ◽  
Author(s):  
Charles E. Bauer ◽  
Raymond A. Fillion ◽  
Herbert J. Neuhaus ◽  
Marc Papageorge
Keyword(s):  
Citation Analysis ◽  
Strategic Alliance ◽  
Market Development ◽  
Mems Devices ◽  
Strategic Framework ◽  
Mems Packaging ◽  
Thermal Requirements ◽  
Unique Mapping ◽  
Wide Range ◽  
On Line

Early MEMS devices employed packages developed for conventional semiconductor microelectronics. Today, MEMS packages reflect the unique environment, mechanical, chemical and thermal requirements of MEMS devices themselves. A casual search of on-line databases reveals nearly 40,000 patents worldwide containing the words “MEMS” and “package.” While not all relevant, the number of IP documents easily overwhelms researchers, investors and IP practitioners. The authors systematically analyze the relevant IP and organize it by generic technology categories. A unique mapping methodology provides greater understanding of the landscape of IP in the MEMS packaging arena across a wide range of considerations including geography, IP development and ownership trends, infrastructure implications and application concepts. The authors also present a rudimentary valuation of IP within the MEMS packaging field based on citation analysis. Finally, the authors demonstrate a method to develop a strategic framework based on the IP landscape useful for investment, market development and strategic alliance planning.

Sign in / Sign up

Export Citation Format

Share Document