Synthesis and properties of the novel polyimides containing cyano and biphenyl moieties

2017 ◽  
Vol 30 (10) ◽  
pp. 1183-1192 ◽  
Author(s):  
Zhenchao Liu ◽  
Yanchao Shen ◽  
Xiaobai Li ◽  
Qiang Shi ◽  
Baijun Liu ◽  
...  
Keyword(s):  
Coefficient Of Thermal Expansion ◽  
Copper Matrix ◽  
Peel Strength ◽  
Nitrogen Atmosphere ◽  
Dielectric Constants ◽  
Circuit Board ◽  
Strong Interactions ◽  
Good Thermal Stability ◽  
Young’S Moduli ◽  
Diamine Monomer

A series of cyano-functionalized polyimides (CN-PIs) were prepared and derived from a novel diamine monomer having cyano and biphenyl groups. Meanwhile, another series of PIs without cyano groups (H-PIs) were prepared as counterparts for comparison purposes. Both series of PIs exhibited good solvent resistance, good thermal stability, remarkable film-forming ability, and excellent tensile properties. The Tg values of CN-PIs were 260–330°C, which were 10–17°C higher than the corresponding –CN free H-PIs. The CN-PIs exhibited no obvious decomposition below 470°C, and their 5% weight loss temperatures were above 568°C under nitrogen atmosphere. All the CN-PI films had high tensile strength and Young’s moduli, which were related to their rigid backbones and strong interactions between molecular chains. Due to their higher molar polarization, CN-PIs expressed the higher dielectric constants (3.29–3.69 at 1 MHz) in comparison with the corresponding H-PIs. CN-PIs exhibited the improved transparency, and both CN-PIs and H-PIs had better transparency than commercial Kapton® film. Introducing –CN groups could have an effect on the coefficient of thermal expansion and peel strength of the PIs. The peel strength of the PI, which was derived from cyano-functionalized diamine monomer and 4,4′-oxydiphthalic anhydride, could even reach 1.10 N mm-1, suggesting its strong interaction to copper matrix and potential use in flexible circuit board.

New fluorinated aromatic polyamides based on N,N-bis(4-carboxyphenyl)-4-trifluoromethylaniline

2018 ◽  
Vol 31 (6) ◽  
pp. 613-622 ◽  
Author(s):  
Yu-Ting Zhou ◽  
Zhen-Zhong Huang ◽  
Cheng Song ◽  
Chuan-Chao Tang ◽  
Xiao-Ling Liu ◽  
...  
Keyword(s):  
Indium Tin Oxide ◽  
Silver Chloride ◽  
Dielectric Constants ◽  
Acetonitrile Solution ◽  
Cyclic Voltammograms ◽  
Cutoff Wavelength ◽  
Aromatic Diamines ◽  
Visible Absorption ◽  
Good Thermal Stability ◽  
Silver Silver

A new aromatic diacid monomer, N, N-bis(4-carboxyphenyl)-4-trifluoromethylaniline, was synthesized by the substitution reaction of 4-trifluoromethylaniline with 4-fluorobenzonitrile, followed by alkaline hydrolysis of the dinitrile intermediate. Several polyamides with 4-trifluoromethyltriphenylamine moieties were prepared from the diacid and various aromatic diamines via the direct phosphorylation polycondensation. All the polyamides were amorphous and readily soluble in many polar organic solvents such as N, N-dimethylacetamide and N-methyl-2-pyrrolidone, and could be solution-cast into transparent, tough, and flexible films with good mechanical properties. They exhibited good thermal stability with glass transition temperatures of 260–330°C, 10% weight-loss temperatures above 500°C, and char yields higher than 60% at 800°C in nitrogen. These polymers had low dielectric constants of 3.35–3.72 (100 Hz), low water uptake of 1.80–2.60%, and high transparency with an ultraviolet–visible absorption cutoff wavelength in the range of 378–390 nm. Cyclic voltammograms of the polyamide films cast onto an indium-tin oxide–coated glass substrate exhibited a reversible oxidation redox coupled with oxidation half-wave potentials ( E 1/2) of 0.95–1.04 V versus silver/silver chloride in an acetonitrile solution.

Poly(aryl ether ketone/sulfone)s containing ortho-methyl and pendant trifluoromethyl-substituted phenyl groups: Synthesis and properties

2012 ◽  
Vol 24 (8) ◽  
pp. 692-701 ◽  
Author(s):  
Chengyuan Shang ◽  
Xiaojuan Zhao ◽  
Junwei Li ◽  
Jingang Liu ◽  
Wei Huang
Keyword(s):  
Dielectric Constants ◽  
Polymer Chains ◽  
Light Transmittance ◽  
Cutoff Wavelength ◽  
Aryl Ether ◽  
Good Thermal Stability ◽  
Low Dielectric ◽  
Aryl Ether Ketone ◽  
Ether Ketone ◽  
Good Transparency

Two novel bisphenols, 1,1-bis(4′-hydroxy-3′,5′-dimethylphenyl)-1-(3′′-trifluoromethylphenyl)-2,2,2-trifluoroethane (4M6FDO) and 1,1-bis(4′-hydroxy-3′,5′-dimethylphenyl)-1-[3′′,5′′-bis(trifluoromethyl)phenyl]-2,2,2-trifluoroethane (4M9FDO), with methyl groups ortho-substituted to the phenol groups, bulky trifluoromethyl-substituted phenyl groups and trifluoromethyl groups in the structure, were synthesized and characterized. The bisphenols were polymerized with 4,4′-difluorobenzophenone and bis(4-fluorophenyl) sulfone, respectively, via a aromatic nucleophilic substitution polycondensation to afford four poly(aryl ether ketone/sulfone)s (PAEKs/PAESs) with the inherent viscosities of 0.32–0.52 dL g−1. The ortho-methyl and pendant trifluoromethyl-substituted phenyl groups endow the polymers with good solubility, the rigidity of the polymer chains increase the glass transition ( Tg) of the polymers to 197–235 °C. Flexible and tough films cast from N,N-dimethylacetamide showed good thermal stability, low dielectric constants of 2.67–2.73 and low water uptakes of 0.21–0.40%. Moreover, the polymers showed good transparency with light transmittance at 450 nm as high as 96% and cutoff wavelength as low as 285 nm. The PAEKs also exhibited low light-absorption at the optocommunication wavelengths of 1310 and 1550 nm.

Fabrication and Characterization of Cu-Plated Fine Pitch Patterns on Flexible Polyimide

2013 ◽  
Vol 284-287 ◽  
pp. 118-122 ◽  
Author(s):  
Ying Chih Wu ◽  
Yu Jung Huang ◽  
Ming Kun Chen ◽  
Yi Lung Lin ◽  
Ling Sheng Jang
Keyword(s):  
Film Surface ◽  
Dielectric Constants ◽  
Process Window ◽  
Good Thermal Stability ◽  
Low Dielectric ◽  
Microelectronic Devices ◽  
Fine Pitch ◽  
Cu Film ◽  
High Flexibility

The thin flexible Polyimides (PI) films have desirable properties for use in the electrical and electronics industry because their good thermal stability, high flexibility, low dielectric constants, excellent mechanical strength, low loss tangent, low relative permittivity and electrical insulating properties. In order to determine the process window of the surface metallization of PI, the fine traces with 50 micron pitch (25micron line /space) built on a flexible 50 micron thick PI film using wet fabrication process are reported in this paper. The thick copper (Cu) film was obtained from the Cu plating process using evaporated thin film of Cu as the adhesion layer. The fabricated fanout fine patterns are further investigated using scanning electron microscope (SEM), energy-dispersive spectrometry (EDS) and X-ray spectrometry technologies. The experiment is conducted to study the effect of the process parameters on the Cu film surface properties. The results obtained in this work can be applied to the fabrication of flexible microelectronic devices.

Processing and Characterization of Particulate SiC Reinforced Copper Matrix Composites

Volume 1 ◽  
2004 ◽  
Author(s):  
V. V. Bhanu Prasad ◽  
V. Vasudeva Rao ◽  
Aditya Putrevu ◽  
A. S. Vijay ◽  
G. Harini
Keyword(s):  
Coefficient Of Thermal Expansion ◽  
Electrical Contact ◽  
Copper Matrix ◽  
Matrix Composites ◽  
X Ray Diffraction ◽  
Tungsten Alloys ◽  
Copper Matrix Composites ◽  
Particulate Silicon ◽  
Sic Composites ◽  
Microstructure Density

Copper Matrix Composites reinforced with particulate Silicon Carbide were consolidated by Vacuum Hot Pressing and Press-Sinter routes. The reinforcement content was varied from 10% to 30% by volume. The composites were then characterized for their microstructure, density, X-ray diffraction (XRD), Coefficient of Thermal Expansion (CTE), hardness, tensile strength, electrical conductivity and elastic modulus. The properties were compared with those of Copper Tungsten alloys. Cu/SiC composites are found to be potential materials for electrical contact and welding applications. An attempt has also been made to evaluate the suitability of copper matrix composites as a replacement to copper tungsten alloys.

scholarly journals Electrospun Silk-Boron Nitride Nanofibers with Tunable Structure and Properties

Polymers ◽  
2020 ◽  
Vol 12 (5) ◽  
pp. 1093
Author(s):  
Ye Xue ◽  
Xiao Hu
Keyword(s):  
Thermal Stability ◽  
Boron Nitride ◽  
Hexagonal Boron Nitride ◽  
Environmental Research ◽  
Strong Interactions ◽  
Helical Structures ◽  
Scanning Calorimetry ◽  
Modulated Differential Scanning Calorimetry ◽  
Good Thermal Stability ◽  
Thermal Stability Of

In this study, hexagonal boron nitride (h-BN) nanosheets and Bombyx mori silk fibroin (SF) proteins were combined and electrospun into BNSF nanofibers with different ratios. It was found that the surface morphology and crosslinking density of the nanofibers can be tuned through the mixing ratios. Fourier transform infrared spectroscopy study showed that pure SF electrospun fibers were dominated by random coils and they gradually became α-helical structures with increasing h-BN nanosheet content, which indicates that the structure of the nanofiber material is tunable. Thermal stability of electrospun BNSF nanofibers were largely improved by the good thermal stability of BN, and the strong interactions between BN and SF molecules were revealed by temperature modulated differential scanning calorimetry (TMDSC). With the addition of BN, the boundary water content also decreased, which may be due to the high hydrophobicity of BN. These results indicate that silk-based BN composite nanofibers can be potentially used in biomedical fields or green environmental research.

Poly (4‐nonylphenyl methacrylate): synthesis, characterisation and radical polymerisation kinetics study

2008 ◽  
Vol 37 (1) ◽  
pp. 21-27
Author(s):  
H. Satapathy ◽  
A.K. Banthia
Keyword(s):  
Frequency Factor ◽  
Nitrogen Atmosphere ◽  
Kinetics Study ◽  
Scanning Calorimetry ◽  
Easy Method ◽  
Adhesion Properties ◽  
Content Type ◽  
Good Thermal Stability ◽  
Methacrylate Polymers ◽  
Radical Polymerisation

PurposeThe purpose of this paper is to synthesise, characterise and study polymerisation kinetics of novel 4‐nonylphenylmethacrylate (NPMA) polymer.Design/methodology/approachNew methacrylic monomer, 4‐NPMA with a pendant nonylphenyl group was synthesised and characterised using various characterisation techniques. The free radical polymerisation kinetics study was done with the help of differential scanning calorimetry data.FindingsThe average heat of polymerisation (ΔHp) was found to be 685.43 J/g. Activation energy (Ea) of 95.86 kJ mol−1 and frequency factor of (A) 3.4 × 104 min−1 was obtained using Kissinger method. The thermogravimetric analysis of the polymer in nitrogen reveals that it possesses very good thermal stability in comparison to alkyl methacrylates due to presence of pendant nonylphenyl group.Research limitations/implicationsNew methacrylic monomer, 4‐NPMA was synthesised by reacting nonylphenol dissolved in methyl ethyl ketone (MEK) with methacryloyl chloride in the presence of triethylamine as a base. Polymerisation of 4‐NPMA was carried out in MEK using benzoyl peroxide (BPO) as initiator under nitrogen atmosphere. The kinetics study of NPMA monomer with 1.1 wt% BPO was reported for evaluation of kinetic parameters by employing the Kissinger equation.Practical implicationsThis is a simple and easy method of modification of methacrylate ester with phenyl groups to obtain a polymer of enhanced properties.Originality/valueThis is a novel method for enhancing the thermal as well as surface adhesion properties of methacrylate polymers which finds several applications in surface coatings and adhesives.

Novel polyimides based on diamine containing thiazole units with thioether linkage and pyridine as pendent group

2017 ◽  
Vol 30 (7) ◽  
pp. 840-846 ◽  
Author(s):  
Jafar Rezania ◽  
Abbas Shockravi ◽  
Morteza Ehsani ◽  
Vahid Vatanpour
Keyword(s):  
Thermal Stability ◽  
Differential Scanning Calorimetry ◽  
Pyridine Ring ◽  
Polar Solvent ◽  
Nitrogen Atmosphere ◽  
Scanning Calorimetry ◽  
Glass Transition Temperatures ◽  
Good Thermal Stability ◽  
Pendent Group ◽  
High Yields

Three new organic-soluble polyimides (PIs) bearing flexible thioether linkages, thiazole, and pyridine ring units were synthesized from a novel thioether-bridged diamine monomer and commercially available aromatic dianhydrides (1–3) via chemical imidization method. The resulting polymers were obtained in high yields and possessed inherent viscosities in the range of 0.67–0.89. The PIs are characterized by Fourier-transform infrared (FTIR), nuclear magnetic resonance (NMR), differential scanning calorimetry, and thermogravimetric analysis (TGA). All of the PIs exhibited excellent solubility in polar solvent. The polymers showed good thermal stability with glass transition temperatures ( Tgs) in the range of 194–244°C, and decomposition temperatures ( T5%) exceeding 300°C were observed using TGA in nitrogen atmosphere for the current polymers.

Integration Studies of Plasma Deposited Fluorinated Amorphous Carbon

1998 ◽  
Vol 511 ◽  
Author(s):  
Thomas W. Mountsier ◽  
John A. Samuels ◽  
Richard S. Swope
Keyword(s):  
Weight Loss ◽  
Amorphous Carbon ◽  
Inductively Coupled Plasma ◽  
Silicon Oxide ◽  
Dielectric Constants ◽  
Materials Testing ◽  
Good Thermal Stability ◽  
Inductively Coupled ◽  
Low Dielectric ◽  
Materials Used

ABSTRACTRecently, we reported the deposition of fluorinated amorphous carbon (FlAC) from hexafluorobenzene (C6F6) under parallel plate (PP) and inductively coupled plasma (ICP-HDP) conditions. Based on initial materials testing, these two platforms generated comparable materials with low dielectric constants (2.4 – 2.8), low weight loss/shrinkage (< 1.5 %/hr. at 425° C), hardness (2–3 Gpa) and adhesion (4–9 kpsi). Here we attempt to answer a basic integration question: FIAC compatibility with other materials used in the interconnect scheme. Investigations of adhesion of F1AC to, and capped by, silicon oxide, silicon nitride and various metals shows generally greater stability of the ICP generated material vs. PP-FIAC. Failures appeared to occur primarily at the FIAC/film interface at 400 and 300 °C for ICP and PP respectively. Although thickness-loss and weight-loss measurements indicate good thermal stability, TDS spectra show low-level outgassing of fluorine-based molecules and fragments even in samples annealed for 4 hours at 400 °C, resulting in interface failures. Plasma treatments and anneals of the F1AC were found to have a minimal effect but liner/cap composition and processing has a strong influence on the adhesion of other films to the fluorocarbon.

scholarly journals The properties of high-energy milled pre-alloyed copper powders containing 1 wt.% Al

2007 ◽  
Vol 72 (1) ◽  
pp. 45-53 ◽  
Author(s):  
Viseslava Rajkovic ◽  
Dusan Bozic ◽  
Aleksandar Devecerski
Keyword(s):  
Thermal Stability ◽  
Electrical Conductivity ◽  
Grain Size ◽  
Morphological Changes ◽  
Milled Powder ◽  
Copper Matrix ◽  
High Energy ◽  
Lattice Parameter ◽  
Good Thermal Stability ◽  
Before And After

The microstructural and morphological changes of inert gas atomized pre-alloyed Cu-1 wt.% Al powders subjected to hith-energy milling were studied. The microhardness of hot-pressed compacts was measured as a function of milling time. The thermal stability during exposure at 800 ?C and the electrical conductivity of compacts were also examined. During the high-energy milling, severe deformation led to refinement of the powder particle grain size (from 550 nm to about 55 nm) and a decrease in the lattice parameter (0.10 %), indicating precipitation of aluminium from the copper matrix. The microhardness of compacts obtained from 5 h-milled powders was 2160 MPa. After exposure at 800?C for 5 h, these compacts still exhibited a high microhardness value (1325 MPa), indicating good thermal stability. The increase of microhardness and good thermal stability is attributed to the small grain size (270 and 390 nm before and after high temperature exposure, respectively). The room temperature electrical conductivity of compacts processed from 5 h-milled powder was 79% IACS. .

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