Fracture Properties of Glass Filled Polyphenylene Oxide Composites

1968 ◽  
Vol 2 (3) ◽  
pp. 266-283 ◽  
Author(s):  
A. Wambach ◽  
K. Trachte ◽  
A. Dibenedetto
Keyword(s):  
Fracture Properties ◽  
Polyphenylene Oxide ◽  
Oxide Composites

Micromechanics Measurements Applied to Integrated Circuit Microelectronics

1997 ◽  
Vol 473 ◽  
Author(s):  
David R. Clarke
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Fracture Resistance ◽  
Interface Fracture ◽  
New Techniques ◽  
Fracture Properties ◽  
Engineered Structures ◽  
Mechanical And Fracture Properties ◽  
Interconnect Lines ◽  
Metallic Interconnect

ABSTRACTAs in other engineered structures, fracture occasionally occurs in integrated microelectronic circuits. Fracture can take a number of forms including voiding of metallic interconnect lines, decohesion of interfaces, and stress-induced microcracking of thin films. The characteristic feature that distinguishes such fracture phenomena from similar behaviors in other engineered structures is the length scales involved, typically micron and sub-micron. This length scale necessitates new techniques for measuring mechanical and fracture properties. In this work, we describe non-contact optical techniques for probing strains and a microscopic “decohesion” test for measuring interface fracture resistance in integrated circuits.

Synthesis of Polyaniline-Zinc Oxide Composites and Its Usage as Ammonia Gas Sensor

2014 ◽  
Vol 1 (4) ◽  
pp. 16-19
Author(s):  
Vivek Talwar ◽  
◽  
Ravi Chand Singh ◽  
Keyword(s):  
Zinc Oxide ◽  
Gas Sensor ◽  
Ammonia Gas ◽  
Oxide Composites

Comparison of the effects of wet straining and refining on the fracture properties of paper

2002 ◽  
Vol 17 (1) ◽  
pp. 45-49 ◽  
Author(s):  
Gongde Zhang ◽  
Eero Hiltunen ◽  
Jaakko E. Laine ◽  
Hannu Paulapuro ◽  
Heikki Kettunen ◽  
...  
Keyword(s):  
Fracture Properties
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