Reliability Performance of Lead–Free SAC Solder Joints on Electroless Ni/Immersion Au and Electroless Ni/Electroless Pd/Immersion Au Subject to Long–Term Isothermal Aging

2014 ◽  
Vol 2 (2) ◽  
pp. 100-108 ◽  
Author(s):  
Zhou Hai ◽  
Jiawei Zhang ◽  
Chaobo Shen ◽  
E.K. Snipes ◽  
M.J. Bozack ◽  
...  
Keyword(s):  
Isothermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Reliability Performance ◽  
Electroless Ni ◽  
Sac Solder

Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

2018 ◽  
Author(s):  
Abdullah Fahim ◽  
Sudan Ahmed ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
Mechanical Properties ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Bulk Solder ◽  
Lead Free ◽  
Nanoindentation Test ◽  
Lead Free Solder ◽  
Free Solder ◽  
The Individual ◽  
Sac Solder

Exposure of lead free solder joints to high temperature isothermal aging conditions leads to microstructure evolution, which mainly includes coarsening of the intermetallic (IMC) phases. In our previous work, it was found that the coarsening of IMCs led to degradation of the overall mechanical properties of the SAC solder composite consisting of β-Sn matrix and IMC particles. However, it is not known whether the isothermal aging changes properties of the individual β-Sn and IMC phases, which could also be affecting to the overall degradation of properties. In this study, the aging induced variations of the mechanical properties of the β-Sn phase, and of Sn-Cu IMC particles in SAC solder joints have been explored using nanoindentation. SAC solder joints extracted from SuperBGA (SBGA) packages were aged for different time intervals (0, 1, 5, 10 days) at T = 125 °C. Nanoindentation test samples were prepared by cross sectioning the solder joints, and then molding them in epoxy and polishing them to prepare the joint surfaces for nanoindentation. Multiple β-Sn grains were identified in joints using optical polarized microscopy and IMCs were also observed. Individual β-Sn grains and IMC particles were then indented at room temperature to measure their mechanical properties (elastic modulus and hardness) and time dependent creep deformations. Properties measured at different aging time were then compared to explore aging induced degradations of the individual phases. The properties of the individual phases did not show significant degradation. Thus, IMC coarsening is the primary reason for the degradation of bulk solder joint properties, and changes of the properties of the individual phases making up the lead free solder material are negligible.

Effects of Current Stressing and Isothermal Aging on the Tensile Strength of Microscale Lead-Free Solder Joints with Different Joint Volumes

2013 ◽  
Vol 634-638 ◽  
pp. 2800-2803 ◽  
Author(s):  
Li Meng Yin ◽  
Yan Fei Geng ◽  
Zhang Liang Xu ◽  
Song Wei
Keyword(s):  
Tensile Strength ◽  
Current Density ◽  
Isothermal Aging ◽  
Solder Joints ◽  
High Current Density ◽  
Copper Wire ◽  
Lead Free ◽  
Lead Free Solder ◽  
Current Stressing ◽  
Free Solder

Adopting an accurate micro-tensile method based on dynamic mechanical analyzer (DMA) instrument, the tensile strength of three kinds of copper-wire/solder/copper-wire sandwich structured microscale lead-free solder joints that underwent current stressing with a direct current density of 1.0×104 A/cm2 and loading time of 48 hours were investigated, and compared with those solder joints isothermal aged at 100 0C for 48 hours and as-reflowed condition. These three kinds of microscale columnar solder joints have different volumes, i.e., a same diameter of 300 μm but different heights of 100 μm, 200 μm and 300 μm. Experimental results show that both current stressing and isothermal aging degrades the tensile strength of microscale solder joints, and the solder joint with smaller volume obtains higher tensile strength under same test condition. In addition, current stressing induces obvious electromigration (EM) issue under high current density of 1.0×104 A/cm2, resulting in the decreasing of tensile strength and different fracture position, mode and surface morphology of microscale solder joints. The degree of strength degradation increases with the increasing of joint height when keep joint diameter constant, this is mainly due to that electromigration leads to voids form and grow at the interface of cathode, and solder joints with larger volume may contains more soldering defects as well.

Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging

2021 ◽  
pp. 114201 ◽  
Author(s):  
Pierre Roumanille ◽  
Emna Ben Romdhane ◽  
Samuel Pin ◽  
Patrick Nguyen ◽  
Jean-Yves Delétage ◽  
...  
Keyword(s):  
Isothermal Aging ◽  
Solder Joints ◽  
Thermomechanical Fatigue ◽  
Lead Free ◽  
Lead Free Solder ◽  
Fatigue Lifetime ◽  
Free Solder

Isothermal Aging Effects on the Mechanical Shock Performance of Lead-Free Solder Joints

2011 ◽  
Vol 1 (5) ◽  
pp. 714-721 ◽  
Author(s):  
Hongtao Ma ◽  
Tae-Kyu Lee ◽  
Dong Hyun Kim ◽  
H G Park ◽  
Sang Ha Kim ◽  
...  
Keyword(s):  
Isothermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Mechanical Shock ◽  
Aging Effects ◽  
Free Solder

Effect of Nickel Doping on Interfacial Reaction between Lead-Free Solder and Ni-P Substrate

2012 ◽  
Vol 488-489 ◽  
pp. 1375-1379 ◽  
Author(s):  
O. Saliza Azlina ◽  
A. Ourdjini ◽  
I. Siti Rabiatull Aisha
Keyword(s):  
Isothermal Aging ◽  
Environmental Concern ◽  
Aging Treatment ◽  
Electroless Nickel ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Soldering ◽  
Nickel Doping ◽  
Free Solder ◽  
Sac Solder

Due to environmental concern, lead-free solder are taking the place of eutectic Sn-Pb solder in electronic packaging industry. Among various lead free alloys, Sn–Ag–Cu (SAC) alloys are leading lead-free candidate solders for various applications because it is offered better properties. This study investigates the interfacial reactions during reflow soldering and isothermal aging between Sn-3.0Ag-0.5Cu (SAC305) and Sn-3.0Ag-0.5Cu-0.05Ni (SACN30505) on electroless nickel/ immersion palladium/immersion gold (ENEPIG) surface finish. The substrates were subjected to isothermal aging at 125°C for up to 2000 hours with solder size diameter of 500μm. The results indicated that after reflow soldering, (Cu, Ni)6Sn5 IMC is formed between solder and substrate while after aging treatment a new IMC was formed between (Cu, Ni)6Sn5 and substrate known as (Ni, Cu)3Sn4. Moreover, after soldering and isothermal aging, Ni-doped (SACN) solder represents a thicker IMC compared to SAC solder. Aging time of solder joints results in an increase of IMC’s thickness and changes their morphologies to become more spherical, dense and with larger grain size. In addition, the results also revealed that the thickness of intermetallics formed is proportional to the aging duration.

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