Highly Conducting Phosphorous Doped nc-Si:H Thin Films Deposited at High Deposition Rate by Hot-Wire Chemical Vapor Deposition Method

2012 ◽  
Vol 12 (11) ◽  
pp. 8459-8466 ◽  
Author(s):  
V. S. Waman ◽  
M. M. Kamble ◽  
S. S. Ghosh ◽  
Azam Mayabadi ◽  
V. G. Sathe ◽  
...  
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Deposition Rate ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Chemical Vapor Deposition Method ◽  
High Deposition Rate ◽  
Deposition Method ◽  
Hot Wire

Anisotropic Plasma ChemicalVapor Deposition of Copper Films in Trenches

2003 ◽  
Vol 766 ◽  
Author(s):  
Kosuke Takenaka ◽  
Masao Onishi ◽  
Manabu Takenshita ◽  
Toshio Kinoshita ◽  
Kazunori Koga ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Deposition Rate ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Anisotropic Plasma ◽  
Bottom Surface ◽  
Chemical Vapor Deposition Method ◽  
Copper Films ◽  
Deposition Method ◽  
Via Holes

AbstractAn ion-assisted chemical vapor deposition method by which Cu is deposited preferentially from the bottom of trenches (anisotropic CVD) has been proposed in order to fill small via holes and trenches. By using Ar + H2 + C2H5OH[Cu(hfac)2] discharges with a ratio H2 / (H2 + Ar) = 83%, Cu is filled preferentially from the bottom of trenches without deposition on the sidewall and top surfaces. The deposition rate on the bottom surface of trenches is experimentally found to increase with decreasing its width.

Fabrication of PTFE thin films by dual catalytic chemical vapor deposition method

2008 ◽  
Vol 516 (5) ◽  
pp. 687-690 ◽  
Author(s):  
Hiroaki Yasuoka ◽  
Masahiro Yoshida ◽  
Ken Sugita ◽  
Keisuke Ohdaira ◽  
Hideyuki Murata ◽  
...  
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Chemical Vapor Deposition Method ◽  
Deposition Method ◽  
Catalytic Chemical Vapor Deposition
Sign in / Sign up

Export Citation Format

Share Document