Effect of Gold-Ball Bonding Parameters on Ball Shear and Wire Pull for Reducing Gold Consumption

2012 ◽  
Vol 13 (1) ◽  
pp. 40-45
Author(s):  
Ming-Yi Tsai ◽  
Rong-Gui Liu
Keyword(s):  
Ball Shear ◽  
Bonding Parameters ◽  
Gold Ball ◽  
Ball Bonding

Optimal Gold-Ball Bonding Parameters Determined from Ball Shear and Wire Pull Tests

2011 ◽  
Vol 71-78 ◽  
pp. 1761-1764
Author(s):  
M. Y. Tsai ◽  
R. G. Liu
Keyword(s):  
Integrated Circuit ◽  
Gold Wire ◽  
Loop Length ◽  
Ball Bond ◽  
Wire Loop ◽  
Ball Shear ◽  
Bonding Parameters ◽  
Gold Ball ◽  
Ball Bonding

In microelectronic packaging, wire bonding is the preferred method used to form electrical interconnections between integrated circuit chips and a substrate. However, ball lift (i.e., when a ball bond becomes completely detached from the chip) and wire breaking are critical problems that degrade the quality of a wire bond. In this study we considered three parameters of gold-ball bonding—ball bond thickness (7–22μm), gold-wire loop height (180–300μm), and gold-wire loop length (1050–2100μm)—and tried to determine the most suitable bond parameters to realize high-quality gold-ball bonding. For this, we experimented with four different values for each parameter considered. Ball shear and wire pull strength between chip and bond pad were used as parameters to evaluate the quality of the gold-ball bond. Experimental results revealed that the ball shear and wire pull initially increase with an increase in the gold-ball thickness up to 12μm and then starts decreasing gradually with further increases in the gold-ball thickness. Further, ball shear and wire pull between chip and bond pad were found to decrease with increasing gold-wire loop height and loop length. For achieving good-quality gold-ball bonding, a gold-ball thickness of about 12μm, and assuming that the cost of the gold consumed is a major concern, a gold-wire loop height of 180μm and loop length of 1050μm are suggested.

Gold Ball Wire Bonding with Heated Tool for Automotive Microelectronics

2012 ◽  
Vol 2012 (1) ◽  
pp. 000410-000413
Author(s):  
David J Rasmussen
Keyword(s):  
Room Temperature ◽  
High Tech ◽  
Ceramic Substrates ◽  
Precise Control ◽  
Hot Gas ◽  
Gold Ball ◽  
Ball Bonding ◽  
Wire Coil ◽  
Bond Pads ◽  
Heated Capillary

Microelectronics used in automotive applications have grown considerably in the last few years with more high tech electronics controlling more functions in automobiles. In an effort to have more precise control and to reduce vehicle weight manufacturers are integrating more functions into smaller packages. Many of these packages are embedded in molded plastic. This causes challenges when it comes to wirebonding these devices. They often cannot be heated to traditional Gold Ball Thermosonic wirebonding temperatures of 120 – 150C. However, using a heated capillary to bond the parts which remain at room temperature simplifies the process considerably. Alternatives such as pre-heating the parts in an oven and complex hot gas handler systems are not required. With a resistive wire coil heater surrounding a standard (or long capillary for deep access) sufficient heat can be provided to the wire bond site for a strong and reliable interconnect. The bonding surface can be any material used in gold ball bonding: aluminum bond pads on die, plated contacts, ceramic substrates or plated copper traces on PCBs. This paper will show that this heated tool process has been successfully utilized with 1mil Au wire and many of the standard die and substrate materials with little impact on process parameters.

The effect of thin film structure and properties on gold ball bonding

1998 ◽  
Vol 27 (11) ◽  
pp. 1211-1215 ◽  
Author(s):  
J. E. Krzanowski ◽  
E. Razon ◽  
A. F. Hmiel
Keyword(s):  
Thin Film ◽  
Film Structure ◽  
Structure And Properties ◽  
Thin Film Structure ◽  
Gold Ball ◽  
Ball Bonding

Impact of Geometric Parameters of Capillary Design on Quality of Gold Ball Bonding

2006 ◽  
Vol 3 (2) ◽  
pp. 73-85
Author(s):  
Jerry Chih-Tsong Su ◽  
Cheng-Hsiang Yu
Keyword(s):  
Integrated Circuits ◽  
Shear Force ◽  
Process Development ◽  
Cone Angle ◽  
Geometric Parameters ◽  
Bond Quality ◽  
Bonding Quality ◽  
Ball Shear ◽  
Ball Size ◽  
Gold Ball

0.13μm or smaller critical dimension of integrated circuits has driven the bonding pad pitch down to 50μm or even smaller. It has also had quite an impact on the adhesive force between the bonding pad and the gold ball. This study focuses on the correlation between the capillary geometric parameters (i.e. tip diameter, chamfer diameter, inner chamfer angle, and cone angle) and the bonding quality (i.e. ball size, ball thickness, ball shear force, specific ball shear force, and capillary vibration). An experimental design is utilized and the response is analyzed statistically. The results show that as the tip diameter and ball size increase, the ball thickness decreases, and the ball shear force increases first and then decreases afterward. As the cone angle decreases, the ball size increases, the ball thickness decreases, and the ball shear force increases. Therefore, both tip diameter and cone angle are significant factors that affect the bond quality. The empirical model, i.e. the correlation between the capillary geometric parameters and the bonding quality is also derived, and is quite useful in predicting the bonding pad size or bonding pad pitch required during process development. The predicted values and the experimental results are shown to have good agreement.

Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads

2010 ◽  
Vol 210 (8) ◽  
pp. 1035-1042 ◽  
Author(s):  
Hui Xu ◽  
Changqing Liu ◽  
Vadim V. Silberschmidt ◽  
Zhong Chen ◽  
Jun Wei
Keyword(s):  
Bond Formation ◽  
Gold Ball ◽  
Ball Bonding

Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball Bonding

2010 ◽  
Vol 132 (4) ◽  
Author(s):  
M. F. Rosle ◽  
S. Abdullah ◽  
M. A. A. Hamid ◽  
A. R. Daud ◽  
A. Jalar ◽  
...  
Keyword(s):  
Gold Wire ◽  
Growth Patterns ◽  
Surface Measurement ◽  
Coverage Area ◽  
Bonding Parameters ◽  
Additional Information ◽  
3D Surface ◽  
Ball Bonding ◽  
3D Surface Imaging

Relatively little information is available on the growth patterns of gold aluminide compound in accurate 3D measurement as compared with 2D images of the projected surface. A 3D surface imaging technique by using infinite focus microscope (IFM) was proposed in this study to observe and explain the effects of bonding parameters on growth pattern of gold aluminide compound formed between a 25.48 μm 4N gold wire and an aluminum pad metallization. Two bonding factors, which were varied, were ball bonding force and ultrasonic current while bonding time and temperature were kept constant. The 3D surface measurement provides topographical and color information of the bonded region, which indicates that optimum bonding condition has a significant effect on uniform growth and wide coverage area of gold aluminide compound. Results illustrated by this technique were used as additional information to the results produce by the conventional methods such as cross section optical image and scanning electron microscope (SEM) micrographs, to gain a better understanding on the physical behavior of gold aluminide compound.

A Study of the Copper Wire Ball Bonding Processes

1992 ◽  
Vol 260 ◽  
Author(s):  
Fang Hongyuan ◽  
Qian Yiyu ◽  
Jiang Yihong
Keyword(s):  
Copper Wire ◽  
New Technology ◽  
Gold Wire ◽  
Ultrasonic Power ◽  
Maximal Strength ◽  
Ball Bond ◽  
Gold Ball ◽  
Ball Bonding ◽  
Microelectronic Components ◽  
Improve Reliability

ABSTRACTCopper ball bonding is a new technology which is expected to replace the traditional gold ball bonding and paid attention in woled recently, the technology is very important to reduce cost and improve reliability of microelectronic components. In this paper, the copper wire ball bonding processes have been studied by means of the MW-EFO metal wire ball forming device and the JWYH-2 thermosonic ball bonder. The bond strength of the ball bond under varied ultrasonic power and bonding time have been tested. The tested results show that the maximal strength of copper ball bond can be over 20g, it has advantage over the gold wire ball bonding. In this paper, the deformation process of the copper ball bond has been analyzed and viewed by SME.

Gold Ball Shear Stress Analysis on Different Surface Morphology

2012 ◽  
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Norazeani A. Rahman ◽  
Ruhaizi M. Hatta ◽  
Rajendaran Vairavan ◽  
...  
Keyword(s):  
Shear Stress ◽  
Surface Morphology ◽  
Stress Analysis ◽  
Ball Shear ◽  
Gold Ball
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