scholarly journals Surface Mounting of Leadless Chip Carriers on Various Printed Circuit Board Type Substrates

1982 ◽  
Vol 10 (1) ◽  
pp. 13-21 ◽  
Author(s):  
I. G. Lang
Keyword(s):  
Thermal Cycling ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Test Results ◽  
Printed Circuit ◽  
Board Type ◽  
Surface Mounting

The effect of extended thermal cycling on the reliability of joints between ceramic leadless chip carriers and various printed circuit board type substrates is examined. Test results indicate success in using ceramic leadless chip carriers on some styles of PCB.

scholarly journals Research on the calibrated method for MEMS magnetometer arrays

2020 ◽  
Author(s):  
Zetao Guo ◽  
Xiang Xu ◽  
Tao zhang
Keyword(s):  
Printed Circuit Board ◽  
Experimental Tests ◽  
Measurement Model ◽  
General Purpose ◽  
Circuit Board ◽  
Test Results ◽  
Adaptive Kalman Filter ◽  
Unknown Parameters ◽  
Printed Circuit ◽  
Magnetometer Arrays

The MEMS magnetometer determines the orientation for the MEMS inertial system. Because of the large noise of the MEMS magnetometer and the interference of soft and hard iron outside, the measurement error of the MEMS magnetometer is large. To reduce the effects of the random noises, the MEMS magnetometer arrays are designed in this paper. In our design, thirty-two MEMS magnetometers are welding on a printed circuit board (PCB), which area is 5×5 cm2. The forty general-purpose input-output (GPIO) ports, which are thirty-two data ports and eight clock ports, are used to collect the data of MEMS magnetometers. Then, averaging the thirty-two measurements of the MEMS magnetometers, the random noises of the measurements of the MEMS magnetometers can be reduced. Based on the averaging operation for the collected sensors’ data, a unified measurement model for the MEMS magnetometer arrays is constructed. Using the unified measurement model, an adaptive Kalman filter is developed to estimate the unknown parameters. To validate the performance of the MEMS magnetometer arrays, the simulation and experimental tests are designed. The test results show that, comparing with the single MEMS magnetometer, the random noises of the MEMS magnetometer arrays are reduced effectively.

PENGARUH DIMENSI GEOMETRIK LAMPU LED TERHADAP PERSEPSI KECERAHAN

2013 ◽  
Vol 3 (2) ◽  
pp. 41
Author(s):  
Andrea Marisi ◽  
Revantino Revantino
Keyword(s):  
Solid State ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Solid State Lighting ◽  
Light Emitting ◽  
Printed Circuit ◽  
Surface Mounting

Perkembangan teknologi di bidang Solid State Lighting selama dekade terakhir membuat diversifikasi penggunaan Light Emitting Diode untuk pelayanan pencahayaan umum. Balai Besar Bahan dan Barang Teknik sejak tahun 2011 telah melakukan penelitian dan pengembangan lampu LED berbasis Surface Mounting Device (SMD) 5050. Pada perancangan Printed Circuit Board (PCB) untuk memasangkan LED-smd tersebut, dilakukan analisis dimensi geometrik yang optimal sehingga dapat memancarkan cahaya ke segala arah dan memberikan persepsi kecerahan yang lebih baik. Untuk perancangan PCB tersebut, dipilih 2 (dua) model berbentuk silinder dengan memperhatikan rasio antara tinggi dan diameter alas. Dari pendekatan sumber titik dan perhitungan eksitansi luminus, diperoleh bahwa model dengan rasio ≈ 1 menghasilkan persepsi lebih cerah terhadap visual manusia.Kata kunci : dimensi geometrik, pendekatan sumber titik, eksitansi luminus, persepsi kecerahan

Optimization of Component Placement Scheduling for SMT Assemblies

2006 ◽  
Vol 505-507 ◽  
pp. 1123-1128
Author(s):  
Chung Hsien Kuo ◽  
M.D. Jeng ◽  
J.J. Wing ◽  
Tai Hong Wang
Keyword(s):  
Cycle Time ◽  
Heuristic Search ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Component Placement ◽  
Printed Circuit ◽  
Search Approach ◽  
Optical Positioning ◽  
Surface Mounting ◽  
Assembly Models

The surface mounting of electronic component is the major manufacturing technology for the electronic products in the last decade. The surface mounting technology (SMT) is an assembly process that assembles the surface mountable component (SMC) and the printed circuit board (PCB) together. The SMT mounter is an automatic assembly machine that processes the SMT assemblies in terms of the optical positioning and robotic handling. The SMT assembly consists of calibrating printed circuit board (PCB); vacuuming components form feeder stations; compensating the orientation of the vacuumed surface mountable component (SMC); and finally placing SMC chips on the PCB. In order to increase the throughput, the synchronous batch vacuuming of SMC components is designed. In addition, different types of component feeding and mixing in each batch increase the difficulties of finding the best component mounting sequence. In this paper, the optimal component placement scheduler is desired to perform higher assembly performance and to reduce the cycle time. The proposed optimal component placement scheduler is developed based on the rule based heuristic search approach. In addition, to evaluate the cycle time of each heuristic search, the route oriented Petri nets (ROPN) based SMT assembly models are constructed. The optimal component placement scheduler can be further determined in terms of evaluating the ROPN SMT assembly models. Finally, the practical test PCB board data is discussed in this paper.

A Novel Low Cost Package for Radio Frequency Applications

2013 ◽  
Vol 135 (2) ◽  
Author(s):  
Sandeep Chaturvedi ◽  
Shiban K. Koul
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Cost Effective ◽  
Circuit Board ◽  
Test Results ◽  
Printed Circuit ◽  
Pcb Manufacturing ◽  
Manufacturing Techniques ◽  
Commercial Applications

Design, fabrication, and test results of a novel 3-layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6 GHz.

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

2019 ◽  
Vol 141 (4) ◽  
Author(s):  
John H. Lau
Keyword(s):  
Thermal Cycling ◽  
Thermal Performance ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Direct Imaging ◽  
Printed Circuit ◽  
Thermal Cycling Condition ◽  
Recent Advances ◽  
Cycling Condition

The recent advances and trends in fan-out wafer/panel-level packaging (FOW/PLP) are presented in this study. Emphasis is placed on: (A) the package formations such as (a) chip first and die face-up, (b) chip first and die face-down, and (c) chip last or redistribution layer (RDL)-first; (B) the RDL fabrications such as (a) organic RDLs, (b) inorganic RDLs, (c) hybrid RDLs, and (d) laser direct imaging (LDI)/printed circuit board (PCB) Cu platting and etching RDLs; (C) warpage; (D) thermal performance; (E) the temporary wafer versus panel carriers; and (F) the reliability of packages on PCBs subjected to thermal cycling condition. Some opportunities for FOW/PLP will be presented.

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