scholarly journals On the Suppression Band and Bandgap of Planar Electromagnetic Bandgap Structures

2014 ◽  
Vol 2014 ◽  
pp. 1-11 ◽  
Author(s):  
Baharak Mohajer-Iravani ◽  
Omar M. Ramahi
Keyword(s):  
Printed Circuit Boards ◽  
Signal Integrity ◽  
Three Dimensional ◽  
Design Guidelines ◽  
Switching Noise ◽  
Circuit Boards ◽  
Electromagnetic Bandgap ◽  
Full Wave ◽  
Viable Solution ◽  
Simulation Based

Electromagnetic bandgap structures are considered a viable solution for the problem of switching noise in printed circuit boards and packages. Less attention, however, has been given to whether or not the introduction of EBGs affects the EMI potential of the circuit to couple unwanted energy to neighboring layers or interconnects. In this paper, we show that the bandgap of EBG structures, as generated using the Brillouin diagram, does not necessarily correspond to the suppression bandwidth typically generated usingS-parameters. We show that the reactive near fields radiating from openings within the EBG layers can be substantial and are present in the entire frequency band including propagating and nonpropagating mode regions. These fields decay fast with distance; however, they can couple significant energy to adjacent layers and to signal lines. The findings are validated using full-wave three-dimensional numerical simulation. Based on this work, design guidelines for EBG structures can be drawn to insure not only suppression of switching noise but also minimization of EMI and insuring signal integrity.

Analysis of PCB via for Signal Integrity Using ANOVA

2013 ◽  
Vol 446-447 ◽  
pp. 956-960
Author(s):  
Shi Lei Zhou ◽  
Ya Lin Guan ◽  
Xin Kun Tang
Keyword(s):  
Printed Circuit Boards ◽  
Signal Integrity ◽  
Point Of View ◽  
Electromagnetic Simulation ◽  
Physical Aspect ◽  
Circuit Boards ◽  
Anova Analysis ◽  
Printed Circuit ◽  
Full Wave ◽  
Aspect Ratios

This paper based on ANOVA (ANalysis Of VAriance) presents an investigation in the design of signal via in multilayered printed circuit boards (PCB) technology from a signal integrity point of view. Using the concept of the orthogonal array (OA), different vias physical aspect ratios have been set in the analysis. The impacts of these parameters are investigated with the help for a full-wave electromagnetic simulation soft HFSS. This study demonstrates the factors which is the most influence on the signal integrity.

scholarly journals A Dual-Perforation Electromagnetic Bandgap Structure for Parallel-Plate Noise Suppression in Thin and Low-Cost Printed Circuit Boards

Electronics ◽  
2019 ◽  
Vol 8 (6) ◽  
pp. 719
Author(s):  
Myunghoi Kim
Keyword(s):  
Cell Size ◽  
Parallel Plate ◽  
Printed Circuit Boards ◽  
Noise Suppression ◽  
Low Cost ◽  
Unit Cell ◽  
Circuit Boards ◽  
Electromagnetic Bandgap ◽  
Unit Cell Size ◽  
Full Wave

In this study, we propose and analyze a dual-perforation (DP) technique to improve an electromagnetic bandgap (EBG) structure in thin and low-cost printed circuit boards (PCBs). The proposed DP–EBG structure includes a power plane with a square aperture and a patch with an L-shape slot that overcomes efficiently the problems resulting from the low-inductance and the characteristic impedance of the EBG structure developed for parallel-plate noise suppression in thin PCBs. The effects of the proposed dual-perforation technique on the stopband characteristics and unit cell size are analyzed using an analytical dispersion method and full-wave simulations. The closed-form expressions for the main design parameters of the proposed DP–EBG structure are extracted as a design guide. It is verified based on full-wave simulations and measurements that the DP technique is a cost-effective method that can be used to achieve a size reduction and a stopband extension of the EBG structure in thin PCBs. For the same unit cell size and low cut-off frequency, the DP–EBG structure increases the stopband bandwidth by up to 473% compared to an inductance-enhanced EBG structure. In addition, the unit cell size is substantially reduced by up to 94.2% compared to the metallo–dielectric EBG structure. The proposed DP–EBG technique achieves the wideband suppression of parallel plate noise and miniaturization of the EBG structure in thin and low-cost PCBs.

IC Packages’ LC Parameters Definition Using Electromagnetic Modeling

2021 ◽  
Vol 26 (5) ◽  
pp. 363-373
Author(s):  
E.N. Belov ◽  
◽  
Yu.A. Savostin ◽  
◽  
Keyword(s):  
Printed Circuit Boards ◽  
Three Dimensional ◽  
Finite Element Method Simulation ◽  
Electromagnetic Modeling ◽  
Circuit Boards ◽  
Electrical Parameters ◽  
Ic Design ◽  
Full Wave ◽  
Dimensional Finite Element ◽  
Three Dimensional Finite Element

At the IC design phase it is required to consider all possible factors to ensure the produced device’s compliance with specified requirements. For instance, it is necessary to select an optimum package and to lower its impact on IC’s final characteristics. Electromagnetic simula-tion is widely used to calculate electrical parameters of the electric motors, printed circuit boards, and microcircuits. In this work, full-wave three-dimensional finite element method simulation in frequency domain was used to characterize LGA package. S-parameters matrix obtained by modeling was converted to an equivalent RLGC transmission line model to determine the electrical parameters of the package – self-capacitance and inductance of the leads, mutual capa-citance of the adjacent leads, – on which the package bandwidth and crosstalk depend. Correct-ness of the obtained results was confirmed by comparison with the measurements results. It has been found that discrepancy between the results of modeled and measured capacitance was less than 5 %. The inductance modeling results turned out to be less accurate, which, however, is not significant for low and medium frequency applications.

Sign in / Sign up

Export Citation Format

Share Document