Signal Integrity Analysis of the Traces in Electromagnetic-Bandgap Structure in High-Speed Printed Circuit Boards and Packages

Mu-Shui Zhang; Yu-Shan Li; Chen Jia; Li-Ping Li

doi:10.1109/tmtt.2007.895413

Signal Integrity Analysis of the Traces in Electromagnetic-Bandgap Structure in High-Speed Printed Circuit Boards and Packages

IEEE Transactions on Microwave Theory and Techniques ◽

10.1109/tmtt.2007.895413 ◽

2007 ◽

Vol 55 (5) ◽

pp. 1054-1062 ◽

Cited By ~ 16

Author(s):

Mu-Shui Zhang ◽

Yu-Shan Li ◽

Chen Jia ◽

Li-Ping Li

Keyword(s):

High Speed ◽

Printed Circuit Boards ◽

Signal Integrity ◽

Circuit Boards ◽

Electromagnetic Bandgap ◽

Printed Circuit ◽

Integrity Analysis ◽

Electromagnetic Bandgap Structure

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A Novel Electromagnetic Bandgap Structure for Broadband Switching Noise Suppression in High-Speed Printed Circuit Boards

2008 38th European Microwave Conference ◽

10.1109/eumc.2008.4751720 ◽

2008 ◽

Author(s):

Simone Genovesi ◽

Agostino Monorchio

Keyword(s):

High Speed ◽

Printed Circuit Boards ◽

Noise Suppression ◽

Switching Noise ◽

Circuit Boards ◽

Electromagnetic Bandgap ◽

Printed Circuit ◽

Electromagnetic Bandgap Structure

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Impact of planar electromagnetic band-gap structures on IR-DROP and signal integrity in high speed printed circuit boards

International Symposium on Electromagnetic Compatibility - EMC EUROPE ◽

10.1109/emceurope.2012.6396670 ◽

2012 ◽

Cited By ~ 1

Author(s):

Danilo Di Febo ◽

Muhammet Hilmi Nisanci ◽

Francesco de Paulis ◽

Antonio Orlandi

Keyword(s):

Band Gap ◽

High Speed ◽

Printed Circuit Boards ◽

Signal Integrity ◽

Circuit Boards ◽

Electromagnetic Band Gap ◽

Printed Circuit ◽

Ir Drop

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Signal and Power Integrity Analysis of Differential Lines in Multilayer Printed Circuit Boards With Embedded Electromagnetic Bandgap Structures

IEEE Transactions on Electromagnetic Compatibility ◽

10.1109/temc.2009.2027125 ◽

2010 ◽

Vol 52 (2) ◽

pp. 357-364 ◽

Cited By ~ 13

Author(s):

Antonio Ciccomancini Scogna ◽

Antonio Orlandi ◽

Vittorio Ricchiuti

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Power Integrity ◽

Electromagnetic Bandgap ◽

Printed Circuit ◽

Integrity Analysis

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Wideband SSN suppression and EMI reduction from printed circuit boards using novel planar electromagnetic bandgap structure

2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. ◽

10.1109/isemc.2006.1706282 ◽

2006 ◽

Author(s):

Jie Qin ◽

O.M. Ramahi

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Electromagnetic Bandgap ◽

Printed Circuit ◽

Emi Reduction ◽

Electromagnetic Bandgap Structure

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A Compact and Multi-Stack Electromagnetic Bandgap Structure for Gigahertz Noise Suppression in Multilayer Printed Circuit Boards

Applied Sciences ◽

10.3390/app7080804 ◽

2017 ◽

Vol 7 (8) ◽

pp. 804 ◽

Cited By ~ 2

Author(s):

Myunghoi Kim ◽

Seungyoung Ahn

Keyword(s):

Printed Circuit Boards ◽

Noise Suppression ◽

Circuit Boards ◽

Electromagnetic Bandgap ◽

Printed Circuit ◽

Electromagnetic Bandgap Structure

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Electromagnetic modeling and signal integrity simulation of power/ground networks in high speed digital packages and printed circuit boards

Proceedings 1998 Design and Automation Conference. 35th DAC. (Cat. No.98CH36175) ◽

10.1109/dac.1998.724509 ◽

2002 ◽

Cited By ~ 1

Author(s):

F.Y. Yuan

Keyword(s):

High Speed ◽

Printed Circuit Boards ◽

Signal Integrity ◽

Electromagnetic Modeling ◽

Circuit Boards ◽

Printed Circuit

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Design, implementation and testing of miniaturized electromagnetic bandgap structures for broadband switching noise mitigation in high-speed printed circuit boards

Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. ◽

10.1109/spi.2005.1500889 ◽

2005 ◽

Cited By ~ 2

Author(s):

S. Shahparnia ◽

O.M. Ramahi

Keyword(s):

High Speed ◽

Printed Circuit Boards ◽

Switching Noise ◽

Circuit Boards ◽

Electromagnetic Bandgap ◽

Noise Mitigation ◽

Printed Circuit

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Electromagnetic modeling and signal integrity simulation of power/ground networks in high speed digital packages and printed circuit boards

Proceedings 1998 Design and Automation Conference. 35th DAC. (Cat. No.98CH36175) ◽

10.1145/277044.277164 ◽

1998 ◽

Cited By ~ 8

Author(s):

Frank Y. Yuan

Keyword(s):

High Speed ◽

Printed Circuit Boards ◽

Signal Integrity ◽

Electromagnetic Modeling ◽

Circuit Boards ◽

Printed Circuit

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Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2005.850503 ◽

2005 ◽

Vol 28 (4) ◽

pp. 724-735 ◽

Cited By ~ 29

Author(s):

Jingook Kim ◽

Heeseok Lee ◽

Joungho Kim

Keyword(s):

High Speed ◽

Printed Circuit Boards ◽

Signal Integrity ◽

Reference Plane ◽

Circuit Boards ◽

Printed Circuit ◽

Radiated Emission

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Signal Integrity Performance Analysis of Mutual Coupling Reduction Techniques Using DGS in High Speed Printed Circuit Boards

Wireless Personal Communications ◽

10.1007/s11277-016-3774-y ◽

2016 ◽

Vol 94 (4) ◽

pp. 3233-3249 ◽

Cited By ~ 3

Author(s):

Muthuramalingam Sindhadevi ◽

Kanagasabai Malathi ◽

Arun Henridass ◽

Arun Kumar Shrivastav

Keyword(s):

Performance Analysis ◽

High Speed ◽

Mutual Coupling ◽

Printed Circuit Boards ◽

Signal Integrity ◽

Circuit Boards ◽

Printed Circuit ◽

Reduction Techniques ◽

Mutual Coupling Reduction

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