Electrical Performance of Electronic Packaging EPEP-04
Latest Publications

TOTAL DOCUMENTS

118

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780386671

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A comparison of performance potentials of single ended vs. differential signaling

Electrical Performance of Electronic Packaging EPEP-04 ◽

10.1109/epep.2004.1407580 ◽

2005 ◽

Cited By ~ 1

Author(s):

Zhaoqing Chen ◽

G. Katopis

Keyword(s):

Performance Potentials ◽

Differential Signaling

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Can we ever send 25-100 Gb/sec signals over 24" line length of printed circuit board and still have mVolt signal at the receiver?

Electrical Performance of Electronic Packaging EPEP-04 ◽

10.1109/epep.2004.1407531 ◽

2005 ◽

Cited By ~ 3

Author(s):

B.K. Bhattacharyya ◽

M. Runstein

Keyword(s):

Printed Circuit Board ◽

Line Length ◽

Circuit Board ◽

Printed Circuit

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Increased feedback due to package mounting

Electrical Performance of Electronic Packaging EPEP-04 ◽

10.1109/epep.2004.1407543 ◽

2005 ◽

Cited By ~ 3

Author(s):

P.H. Aaen ◽

J.A. Pla ◽

C.A. Balanis

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Electrical validation of source synchronous chip-chip server links at 6.25 Gb/s

Electrical Performance of Electronic Packaging EPEP-04 ◽

10.1109/epep.2004.1407579 ◽

2005 ◽

Author(s):

K.S. Canagasaby ◽

S. Chaudhuri ◽

S. Dabral

Keyword(s):

Chip Chip

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Power distribution analysis for IBM eServer system integration optimization

Electrical Performance of Electronic Packaging EPEP-04 ◽

10.1109/epep.2004.1407581 ◽

2005 ◽

Cited By ~ 2

Author(s):

A. Huber ◽

Tingdong Zhou ◽

W.D. Becker ◽

R. Weekly ◽

E. Klink

Keyword(s):

Power Distribution ◽

System Integration ◽

Distribution Analysis

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Simulation of coupled interconnects using waveform relaxation and transverse partitioning

Electrical Performance of Electronic Packaging EPEP-04 ◽

10.1109/epep.2004.1407535 ◽

2005 ◽

Cited By ~ 5

Author(s):

N. Nakhla ◽

A. Ruehli ◽

M. Nakhla ◽

R. Achar

Keyword(s):

Waveform Relaxation

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Application of the enlarged cell method (ECM) to EMI/EMC problems

Electrical Performance of Electronic Packaging EPEP-04 ◽

10.1109/epep.2004.1407626 ◽

2005 ◽

Author(s):

Tian Xiao ◽

Qing Huo Liu ◽

Jiangqi He

Keyword(s):

Cell Method

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Modeling and mitigating AC common mode conversion in multi-Gb/s differential printed circuit boards

Electrical Performance of Electronic Packaging EPEP-04 ◽

10.1109/epep.2004.1407536 ◽

2005 ◽

Cited By ~ 10

Author(s):

H. Heck ◽

S. Hall ◽

B. Horine ◽

T. Liang

Keyword(s):

Printed Circuit Boards ◽

Mode Conversion ◽

Circuit Boards ◽

Common Mode ◽

Printed Circuit

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Broadband characterization of miniaturized on-chip differential circuits using G-S-G probe

Electrical Performance of Electronic Packaging EPEP-04 ◽

10.1109/epep.2004.1407567 ◽

2005 ◽

Author(s):

Hung-Tat Tso ◽

Chien-Nan Kuo

Keyword(s):

Differential Circuits ◽

On Chip

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Power delivery modeling and design methodology for a programmable logic device package

Electrical Performance of Electronic Packaging EPEP-04 ◽

10.1109/epep.2004.1407561 ◽

2005 ◽

Cited By ~ 4

Author(s):

A. Pannikkat ◽

J. Long ◽

Jin Zhao

Keyword(s):

Design Methodology ◽

Power Delivery ◽

Programmable Logic ◽

Logic Device ◽

Programmable Logic Device

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Electrical Performance of Electronic Packaging EPEP-04Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A comparison of performance potentials of single ended vs. differential signaling

Can we ever send 25-100 Gb/sec signals over 24" line length of printed circuit board and still have mVolt signal at the receiver?

Increased feedback due to package mounting

Electrical validation of source synchronous chip-chip server links at 6.25 Gb/s

Power distribution analysis for IBM eServer system integration optimization

Simulation of coupled interconnects using waveform relaxation and transverse partitioning

Application of the enlarged cell method (ECM) to EMI/EMC problems

Modeling and mitigating AC common mode conversion in multi-Gb/s differential printed circuit boards

Broadband characterization of miniaturized on-chip differential circuits using G-S-G probe

Power delivery modeling and design methodology for a programmable logic device package

Electrical Performance of Electronic Packaging EPEP-04
Latest Publications