Direct-Gap Photoluminescence from a Si-Ge Multilayer Super Unit Cell Grown on Si0.4Ge0.6

2018 ◽  
Author(s):  
David J. Lockwood ◽  
N.L. Rowell ◽  
L. Favre ◽  
A. Ronda ◽  
I. Berbezier
Keyword(s):  
Molecular Beam ◽  
Light Emission ◽  
Solid Phase ◽  
Unit Cell ◽  
Emission Lines ◽  
Solid Phase Epitaxy ◽  
Light Emitters ◽  
Band Gap Engineering ◽  
Optical Fiber Applications ◽  
Weak Peak

Both Si and Ge possess indirect band gaps, which makes them very inefficient light emitters. One way to overcome this limitation is through band gap engineering. In this regard, M. d’Avezac et al. [Phys. Rev. Lett., 108, 027401 (2012)] predicted that a strained SiGe2Si2Ge2SiGen super unit cell on Si0.4Ge0.6 would have a direct and dipole-allowed gap of 0.863 eV, which is ideally suited for optical fiber applications. Here we report on the epitaxial growth of such a structure and its optical properties, for which purpose two similar samples were prepared by molecular beam epitaxy and solid phase epitaxy. Photoluminescence (PL) spectra were obtained at low temperatures (6–25 K) with excitation at wavelengths of 405 and 458 nm, selected to emphasize the light emission from the sample superstructure. A strong low-energy PL quadruplet is seen, with peaks near 727, 758, 792 and 822 meV at 6 K, together with a much weaker peak at 871 MeV. The ratio of intensities of the strong and weak peaks is the same in both samples. The weak peak at 871 meV is assigned to the dipole-allowed direct-gap transition associated with the super unit cell. The four strong peaks are attributed to dislocation related emission lines of the thick relaxed Si0.4Ge0.6 transition layer on Si.

GROWTH AND CHARACTERIZATION OF EPITAXIAL Si/CoSi2 AND Si/CoSi2/Si HETEROSTRUCTURES

1985 ◽  
Vol 56 ◽  
Author(s):  
B.D. HUNT ◽  
N. LEWIS ◽  
E.L. HALL ◽  
L.G. JTURNER ◽  
L.J. SCHOWALTER ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Growth Temperature ◽  
Molecular Beam ◽  
Solid Phase ◽  
Solid Phase Epitaxy ◽  
Cross Sectional ◽  
Reactive Deposition ◽  
Ion Channeling ◽  
Formation Method

AbstractThin (<200Å), epitaxial CoSi2 films have been grown on (111) Siwafers in a UHV system using a variety of growth techniques including solid phase epitaxy (SPE), reactive deposition epitaxy (RDE), and molecular beam epitaxy (MBE). SEN and TEN studies reveal significant variations in the epitaxial silicide surface morphology as a function of the sillciqd formation method. Pinhole densities are generally greater than 107 cm-2, although some reduction can be achieved by utilizing proper growth techniques. Si epilayers were deposited over the CoSi2 films inthe temperature range from 550ºC to 800ºC, and the reesuulttinng structures have been characterized using SEM, cross—sectional TEN, and ion channeling measurements. These measurements show that the Si epitaxial quality increases with growth temperature, although the average Si surface roughness and the CoSi2 pinhole density also increase as the growth temperature is raised.

Segregation and Trapping of Erbium in Silicon at a Crystal-Amorphous or Crystal-Vacuum Interface

1996 ◽  
Vol 422 ◽  
Author(s):  
A. Polman ◽  
R. Serna ◽  
J. S. Custer ◽  
M. Lohmeier
Keyword(s):  
Molecular Beam Epitaxy ◽  
Epitaxial Growth ◽  
Growth Model ◽  
Molecular Beam ◽  
Solid Phase ◽  
Solid Phase Epitaxy ◽  
Kinetic Growth ◽  
Vacuum Interface ◽  
Amorphous Si

AbstractThe incorporation of erbium in silicon is studied during solid phase epitaxy (SPE) of Erimplanted amorphous Si on crystalline Si, and during Si molecular beam epitaxy (MBE). Segregation and trapping of Er is observed on Si(100), both during SPE and MBE. The trapping during SPE shows a discontinuous dependence on Er concentration, attributed to the effect of defect trap sites in the amorphous Si near the interface. Trapping during MBE is described by a continuous kinetic growth model. Above a critical Er density (which is lower for MBE than for SPE), growth instabilities occur, attributed to the formation of silicide precipitates. No segregation occurs during MBE on Si(111), attributed to the epitaxial growth of silicide precipitates.

Novel Approach for Fabrication of Single-Crystalline Insulator/Si/Insulator Nanostructures

2006 ◽  
Vol 928 ◽  
Author(s):  
Andreas Fissel ◽  
Dirk Kuehne ◽  
Eberhard Bugiel ◽  
H. Joerg Osten
Keyword(s):  
Low Temperatures ◽  
Negative Differential Resistance ◽  
Molecular Beam ◽  
Solid Phase ◽  
Differential Resistance ◽  
Solid Phase Epitaxy ◽  
Double Barrier ◽  
Single Crystalline ◽  
Novel Approach ◽  
Sharp Interfaces

ABSTRACTDouble-barrier insulator/Si/insulator nanostructures on Si(111) were prepared using molecular beam epitaxy. Ultrathin single-crystalline Si buried in a single-crystalline insulator matrix with sharp interfaces was obtained by a novel approach based on an epitaxial encapsulated solid-phase epitaxy. As an example, we demonstrate the growth of Si buried in Gd2O3 and the incorporation of epitaxial Si islands into single-crystalline Gd2O3. The I-V characteristic of the obtained nanostructures exhibited negative differential resistance at low temperatures, however, with a strong memory effect.

Synthesis of Dislocation Free Siy(SnxC1−x)1−y Alloys by Molecular Beam Deposition and Solid Phase Epitaxy

1993 ◽  
Vol 298 ◽  
Author(s):  
Gang He ◽  
Mark D. Savellano ◽  
Harry A. Atwater
Keyword(s):  
Molecular Beam ◽  
Solid Phase ◽  
Solid Phase Epitaxy ◽  
X Ray Diffraction ◽  
Time Resolved ◽  
Pure Silicon ◽  
Ion Channeling ◽  
Transmission Electron ◽  
Molecular Beam Deposition ◽  
Beam Deposition

AbstractSynthesis of strain-compensated single-crystal Siy(SnxC1-x)1-y alloy films on silicon (100) substrates has been achieved with compositions of tin and carbon greatly exceeding their normal equilibrium solubility in silicon. Amorphous SiSnC alloys were deposited by molecular beam deposition from solid sources followed by thermal annealing. In situ monitoring of crystallization was done using time-resolved reflectivity. Good solid phase epitaxy was observed for Si0.98Sn0.01C0.01, at a rate about 20 times slower than that of pure silicon. Compositional and structural analysis was done using Rutherford backscattering, electron microprobe, ion channeling, x-ray diffraction, and transmission electron microscopy.

Properties and Applications of Molecular Beam Epitaxial Silicides

1986 ◽  
Vol 67 ◽  
Author(s):  
K. L. Wang ◽  
Y. C. Kao
Keyword(s):  
Integrated Circuits ◽  
Epitaxial Growth ◽  
Molecular Beam ◽  
Solid Phase ◽  
Deep Level ◽  
Solid Phase Epitaxy ◽  
Molecular Beam Epitaxial ◽  
Barrier Heights ◽  
Metal Silicides ◽  
Microelectronics Technology

ABSTRACTTransition metal silicides are now being used as essential and integral elements of microelectronics technology. Epitaxial growth and deposition provide additional flexibility for many device and circuit applications.In this paper, various epitaxial growth techniques, namely solid phase epitaxy and molecular beam epitaxy are reviewed. The resulting morphology, crystallinity, and Schottky barrier heights as well as deep-level defects are contrasted. The parallel and perpendicular strains as a function of film thickness is reported.Application of the epitaxial silicide in improving conventional integrated circuits as well as in fabricating new devices are discussed.

Growth and Characterization of Heteroepitaxial GaAs on Semiconductor-on-Insulator and Insulating Substrates

1989 ◽  
Vol 145 ◽  
Author(s):  
T.P. Humphreys ◽  
K. Das ◽  
N.R. Parikh ◽  
J.B. Posthill ◽  
R.J. Nemanich ◽  
...  
Keyword(s):  
Molecular Beam ◽  
Solid Phase ◽  
Chemical Vapor ◽  
Solid Phase Epitaxy ◽  
Molecular Beam Epitaxial ◽  
Chemical Vapor Deposited ◽  
Gaas Films ◽  
Molecular Beam Epitaxial Growth ◽  
Crystallographic Orientations

AbstractA systematic study pertaining to the molecular beam epitaxial growth and charac- terization of GaAs films on various crystallographic orientations of sapphire is presented. For integration with silicon circuitry, heteroepitaxial GaAs layers have also been grown on commercially-available chemical vapor deposited silicon-on-sapphire (SOS) and SOS substrates that have been upgraded by the double solid-phase epitaxy process.

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