Effect of Polymeric Additive Molecular Weight on Polishing Performance of Silicon Wafer during Final Touch Polishing Process

2011 ◽  
Keyword(s):  
Molecular Weight ◽  
Silicon Wafer ◽  
Polishing Process ◽  
Polymeric Additive

The Performance and Optimization of Slurry on the Double Sided Polishing Process of Silicon Wafer

2007 ◽  
Vol 359-360 ◽  
pp. 324-328
Author(s):  
Wei Li ◽  
Gang Xiang Hu ◽  
Xiao Dong Hu ◽  
Xiao Zhen Hu
Keyword(s):  
Surface Roughness ◽  
Silicon Wafer ◽  
Process Parameters ◽  
Ph Value ◽  
Removal Rate ◽  
Polished Surface ◽  
Polishing Process ◽  
Stock Removal

This study compares the effectiveness of different polishing slurries for Double Sided Polishing process of Silicon wafer in the polished surface roughness and stock removal rate, discusses the mechanism of Double Sided Polishing for silicon wafer with different type slurries, also the influence of the pH value, temperature and concentration of the slurries are discussed in this paper. Furthermore, by the optimization of the process parameters, the ultra-smooth of polished surface of silicon wafer has been got with higher efficient.

A Study of Double Sided Polishing Process for Ultra-Smooth Surface of Silicon Wafer

2006 ◽  
Vol 532-533 ◽  
pp. 472-475 ◽  
Author(s):  
Wei Li ◽  
Xiao Dong Hu ◽  
Yang Fu Jin ◽  
Gang Xiang Hu ◽  
Xiao Zhen Hu
Keyword(s):  
Silicon Wafer ◽  
Smooth Surface ◽  
Rotation Speed ◽  
Computer Control ◽  
Machining Process ◽  
Computer Control System ◽  
Polishing Process ◽  
Surface Machining ◽  
Finishing Process

Double sided polishing process has become a main machining method for silicon wafer finishing process, but it is difficult to get ultra-smooth surface with the very stringent machining conditions. In this paper, the mechanism of ultra-smooth surface machining process was studied, the main parameters affecting the surface quality of silicon wafer, such as the polishing pad and carrier rotation speed, polishing press, polishing slurries etc. , were discussed and optimized, then ultra-smooth surface of silicon wafer with Ra 0.4nm has been obtained based on the above study. A new double sided polishing machine with computer control system equipped with a digital controlled press valve was developed, and the ultra-smooth machining process of silicon wafer was established in this paper.

Investigation on Fine Polishing Technique of Silicon Wafer

2009 ◽  
Vol 60-61 ◽  
pp. 232-235 ◽  
Author(s):  
Quan Cheng Gong ◽  
Jian Zhu ◽  
Shi Xing Jia ◽  
Jing Wu
Keyword(s):  
Surface Roughness ◽  
Optimum Condition ◽  
Silicon Wafer ◽  
Surface Condition ◽  
Polishing Process ◽  
Wafer Polishing

This paper presents a kind of fine polishing technique that adopts three-step polishing procedure and keeping-wafer-wet method. In order to remove the damaged layer created by lapping process or improve surface condition of silicon wafer, polishing process is needed. In this paper, techniques of improving the surface roughness of silicon are studied, three different polishing processes are presented, and optimum condition has been attained. Experiments of Si-Si bonding are also performed, and results show that after polishing ends, keeping surface of wafer wet is necessary to avoid slurry agglomerating.

Research on a New Type of Ultrasonic Polishing Vibrator

2011 ◽  
Vol 299-300 ◽  
pp. 1132-1135
Author(s):  
Qing He ◽  
Ying Hua Li ◽  
Kai Jia ◽  
L. Li
Keyword(s):  
Numerical Analysis ◽  
Silicon Wafer ◽  
Ultrasonic Vibration ◽  
Polishing Process ◽  
Semiconductor Silicon ◽  
New Type

Aiming at the ultrasonic vibration polishing technology of silicon wafer, this paper proposes a disc-shaped ultrasonic piezoelectric polishing vibrator of out-of-plant bending travalling wave. Basing on numerical analysis, the principle prototype of the polishing vibrator has been designed and produced, and then tested. This polishing vibrator can be used in polishing process of semiconductor silicon wafer.

Experimental Trial of Fullerene Wheel Fabrication

2008 ◽  
Vol 389-390 ◽  
pp. 61-66
Author(s):  
Takeshi Tanaka
Keyword(s):  
Silicon Wafer ◽  
Potassium Hydroxide ◽  
Potassium Hydroxide Solution ◽  
Diamond Wheel ◽  
Polishing Process ◽  
Atomic Force ◽  
Finishing Process ◽  
Atomic Force Microscope Observation ◽  
Chemical Mechanical Polishing Process ◽  
Diamond Abrasive

The purpose of this study is to fabricate a wheel using fullerenes with nano-scaled particles, and to investigate the polishing performance of fullerene wheel. A super smooth surface was formed on a silicon wafer by polishing the wafer with metal-bonded diamond wheels using a diamond abrasive grit of 0-0.125 μm and fullerenes with a diameter of 0.7 nm. We used two kinds of metal-bonded diamond wheels for pre-polishing and a metal-bonded fullerene wheel for the finishing process. Though the surface roughness after polishing with the fullerene wheel was almost equal to that obtained by polishing with the metal-bonded diamond wheel using diamond abrasive grit of 0-0.125 μm, the chemical-mechanical polishing process was clarified by AFM (atomic force microscope) observation when we used a metal-bonded fullerene wheel with 5wt% KOH (potassium hydroxide) solution. The greater number of smoothed portions on the surface of the silicon wafer indicated that the fullerenes provided the same polishing ability as that of the abrasive grit.

Effect of Hydroxyethyl Cellulose Concentration on Surface Qualities of Silicon Wafer after Touch Polishing Process

2010 ◽  
Vol 13 (5) ◽  
pp. H147 ◽  
Author(s):  
Hee-Sub Hwang ◽  
Jae-Hyung Lim ◽  
Jin-Hyung Park ◽  
Eun-Suck Choi ◽  
Jin-Woo Ahn ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Hydroxyethyl Cellulose ◽  
Polishing Process ◽  
Cellulose Concentration

Development of Waxless Wafer Mounting System for Silicon Wafer Polishing Process

2013 ◽  
Vol 339 ◽  
pp. 762-765
Author(s):  
Kyoung Jin Kim
Keyword(s):  
Silicon Wafer ◽  
Jet Impingement ◽  
Water Jet ◽  
Silicon Wafers ◽  
Production Yield ◽  
Polishing Process ◽  
Industry Standard ◽  
Wafer Polishing

In the silicon wafer polishing process, the mounting of wafer on the polishing head could be greatly influential in final quality of finished wafers. This paper focuses on the waxless wafer mounting technique which could replace the traditional wax wafer mounting. Mounting of wafers on the carrier block using a wetted porous template provides a simple way of securing wafer on polishing head for precision wafer polishing. Demounting of wafers from the porous pad is carried out by using the water jet impingement which takes only a couple of seconds for wafer demounting. A series of wafer polishing tests of 8 inch silicon wafers using the present wafer mounting system found that the developed waxless wafer mounting could be quite suitable for producing the wafers of the excellent surface qualities by meeting industry standard such as SBIR, LLS, and production yield.

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