Stress and Strain Evolution in Electroless Copper Films Evaluated with X-ray Diffraction and Substrate Curvature

2013 ◽  
Vol 160 (6) ◽  
pp. D226-D232 ◽  
Author(s):  
Tanu Sharma ◽  
Ralf Brüning ◽  
Colby Brown ◽  
Allison Sibley ◽  
Johannes Etzkorn ◽  
...  
Keyword(s):  
Stress And Strain ◽  
Copper Films ◽  
X Ray Diffraction ◽  
X Ray ◽  
Strain Evolution ◽  
Electroless Copper ◽  
Substrate Curvature

Strain in electroless copper films monitored by X-ray diffraction during and after deposition and its dependence on bath chemistry

2011 ◽  
Vol 519 (13) ◽  
pp. 4377-4383 ◽  
Author(s):  
Ralf Brüning ◽  
Bruce Muir ◽  
Eric McCalla ◽  
Émilie Lempereur ◽  
Frank Brüning ◽  
...  
Keyword(s):  
Copper Films ◽  
X Ray Diffraction ◽  
X Ray ◽  
Electroless Copper

Combining X-Ray Diffraction and Substrate Deflection Analysis to Understand Internal Stress in Electroless Copper Films

2012 ◽  
Vol 1529 ◽  
Author(s):  
Tanu Sharma ◽  
Ralf Brüning ◽  
Delilah A. Brown ◽  
Simon Bamberg ◽  
Michael Merschky ◽  
...  
Keyword(s):  
Internal Stress ◽  
Printed Circuit Boards ◽  
Film Surface ◽  
Local Stress ◽  
Conducting Layer ◽  
Copper Films ◽  
X Ray Diffraction ◽  
Plating Bath ◽  
X Ray ◽  
Electroless Copper

ABSTRACTElectroless copper films are usually the first conducting layer on the insulating substrates of printed circuit boards. For this and other emerging applications, the internal stress of the copper layer is an important consideration both for film adhesion and film-substrate interaction. We have combined stress/strain analysis based on X-ray diffraction, which is sensitive to the strain of the copper crystallites, with a conventionally used technique that analyses the bending of the substrate (Deposit Stress Analyzer). Both techniques were implemented in such a way that the stress could be monitored continuously during the deposition of the films from the electroless plating bath as well as afterwards. These tests were carried out for three chemical formulations and the results from both techniques agree qualitatively. For one bath, the substrate bending method detects a 60 nm region of local stress at the film-surface interface.

Strain in Electroless Copper Films: Analysis by in situ X-Ray Diffraction and Curvature Methods

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001358-001388
Author(s):  
Simon Bamberg ◽  
Tobias Bernhard (corresponding author) ◽  
Laurence J. Gregoriades (presenting author) ◽  
Frank Brüning ◽  
Ralf Brüning ◽  
...  
Keyword(s):  
Tensile Stress ◽  
Copper Film ◽  
Film Stress ◽  
Copper Films ◽  
X Ray Diffraction ◽  
X Ray ◽  
Wide Range ◽  
Electroless Copper ◽  
The Difference

Strain in chemically deposited copper films on polymer substrates was determined by means of in situ X-ray diffraction (XRD), deposit stress analyzer (DSA) and spiral contractometer (SC). The strain evolution of the films was studied as a function of copper film thickness and electroless copper bath parameters, during and after deposition. The results are not indicative of a preferred crystallite orientation or texturing in the deposit. The copper film stress is controllable over a wide range of some 100 MPa from compressive to tensile stress by appropriate variation of bath parameters (e.g. temperature, concentration of bath components such as nickel, stabilizer and formaldehyde). A higher tendency of blister generation for relaxed or compressively stressed films is apparent, which implies that a sufficient level of tensile stress throughout the deposition promotes film adhesion. An observable change from tensile to compressive film stress during the cooling of the sample from bath operation to rinse water temperature is discussed in terms of substrate-induced thermal stress to the copper film. In this context, the difference in the substrate materials required for XRD (polymer), DSA (copper) and SC (stainless steel) may be a significant factor contributing to the diverging measured stress behaviors of the methods. Moreover, it is questionable whether SC stress data can be compared with XRD and DSA stress data, due to the low resolution of the SC method (~60 MPa).

The Effect of the Microstructure of Diffusion Barriers on the Palladium Activation for Electroless Copper Deposition

2002 ◽  
Vol 716 ◽  
Author(s):  
Seok Woo Hong ◽  
Yong Sun Lee ◽  
Ki-Chul Park ◽  
Jong-Wan Park
Keyword(s):  
Electron Microscopy ◽  
Diffusion Barriers ◽  
Copper Deposition ◽  
X Ray Diffraction ◽  
Plan View ◽  
X Ray ◽  
Transmission Electron ◽  
Electroless Copper ◽  
Sheet Resistance Measurement ◽  
Scanning Electron

AbstractThe effect of microstructure of dc magnetron sputtered TiN and TaN diffusion barriers on the palladium activation for autocatalytic electroless copper deposition has been investigated by using X-ray diffraction, sheet resistance measurement, field emission scanning electron microscopy (FE-SEM) and plan view transmission electron microscopy (TEM). The density of palladium nuclei on TaN diffusion barrier increases as the grain size of TaN films decreases, which was caused by increasing nitrogen content in TaN films. Plan view TEM results of TiN and TaN diffusiton barriers showed that palladium nuclei formed mainly on the grain boundaries of the diffusion barriers.

Strain, Stress, and Magnetic Surfaceanisotropy of Epitaxial FE(110)/MO (110) Multilayers

1993 ◽  
Vol 317 ◽  
Author(s):  
R.M. Osgood ◽  
B.M. Clemens ◽  
R.L. White ◽  
S. Brennan
Keyword(s):  
Strain State ◽  
Single Layer ◽  
Grazing Incidence ◽  
Magnetic Surface ◽  
Stress And Strain ◽  
Surface Anisotropy ◽  
X Ray Diffraction ◽  
X Ray ◽  
Plane Direction ◽  
Strain Stress

ABSTRACTGrazing incidence and asymmetric X-ray diffraction were used to measure the stress and strain state of Fe(110)/Mo(110) Multilayers. The highest stress in the Fe constituent of the multilayer was along the [110] in-plane direction and was due to interaction with the substrate. The Magnetic anisotropy of the Fe Multilayer constituent was measured and the magnetic surface anisotropy, which favored in-plane [001] magnetization, was deduced. In contrast, the magnetic surface anisotropy of a single layer of Fe on W preferred in-plane [110] magnetization, in agreement with the Néel Model.

Strain Measurement by X-ray Diffraction Methods

1949 ◽  
Vol 1 (3) ◽  
pp. 211-224
Author(s):  
G. B. Greenough
Keyword(s):  
Strain Measurement ◽  
Plastic Anisotropy ◽  
Stress And Strain ◽  
Routine Method ◽  
X Ray Diffraction ◽  
Strain Measurements ◽  
X Ray ◽  
The Past ◽  
Polycrystalline Metals ◽  
The Individual

SummaryMany papers have been written on the measurement of strain by X-ray diffraction methods and on the interpretation of these strains in terms of stresses. Whereas, during the past few years, the experimental methods of determining the strains have. remained largely unchanged, research has shown that the older techniques for calculating stresses from strains are not always valid.In this paper an attempt is made to describe some of the principles of strain measurement by X-ray diffraction methods to those who are unfamiliar with the methods. The types of stress and strain systems which may exist in polycrystalline metals are then considered, particular attention being paid to the effect of the elastic and plastic anisotropy of the individual crystals. Some indication is given as to how the earlier methods of interpreting X-ray strain measurements should be modified, but no rigid routine method is proposed for use in a general case.

scholarly journals Microscopic Stress and Strain Evolved in a Twinning-Induced Plasticity Fe-Mn-C Steel

2014 ◽  
Vol 996 ◽  
pp. 135-140
Author(s):  
Shigeru Suzuki ◽  
Shigeo Sato ◽  
Koji Hotta ◽  
Eui Pyo Kwon ◽  
Shun Fujieda ◽  
...  
Keyword(s):  
Strain Distribution ◽  
Crystal Orientation ◽  
Fem Simulation ◽  
Tensile Loading ◽  
Stress And Strain ◽  
X Ray Diffraction ◽  
Principal Stresses ◽  
Orientation Data ◽  
Tensile Direction ◽  
X Ray

White X-ray diffraction with micro-beam synchrotron radiation was used to analyze microscopic stress evolved in coarse grains of a twinning-induced plasticity Fe-Mn-C steel under tensile loading. In addition, electron backscatter diffraction (EBSD) was used to determine the crystal orientation of grains in the polycrystalline Fe-Mn-C steel. Based on these orientation data, the stress and strain distribution in the microstructure of the steel under tensile loading was estimated using FEM simulation where the elastic anisotropy or the crystal orientation dependence of the elasticity was taken into account. The FEM simulation showed that the strain distribution in the microstructure depends on the crystal orientation of each grain. The stress analysis by the white X-ray diffraction indicated that the direction of the maximum principal stresses at measured points in the steel under tensile loading are mostly oriented toward the tensile direction. This is qualitatively consistent with the results of by the FEM simulation, although absolute values of the principal stresses may contain the effect of heterogeneous plastic deformation on the stress distribution.

scholarly journals Determining intrinsic stress and strain state of fibre-textured thin films by X-ray diffraction measurements using combined asymmetrical and Bragg-Brentano configurations

2019 ◽  
Vol 181 ◽  
pp. 108063 ◽  
Author(s):  
Fakhrodin Motazedian ◽  
Zhigang Wu ◽  
Junsong Zhang ◽  
Bashir Samsam Shariat ◽  
Daqiang Jiang ◽  
...  
Keyword(s):  
Thin Films ◽  
Strain State ◽  
Intrinsic Stress ◽  
Stress And Strain ◽  
X Ray Diffraction ◽  
X Ray

Coherent strain evolution at the initial growth stage of AlN on SiC(0001) proved by in situ synchrotron X-ray diffraction

2020 ◽  
Vol 13 (5) ◽  
pp. 055501 ◽  
Author(s):  
Hidetoshi Suzuki ◽  
Fumitaro Ishikawa ◽  
Takuo Sasaki ◽  
Masamitu Takahasi
Keyword(s):  
Growth Stage ◽  
Initial Growth ◽  
X Ray Diffraction ◽  
X Ray ◽  
Initial Growth Stage ◽  
Strain Evolution

scholarly journals Effect of glyphosate on X-ray diffraction of copper films prepared by electrochemical deposition

RSC Advances ◽  
2019 ◽  
Vol 9 (25) ◽  
pp. 14016-14023 ◽  
Author(s):  
Gaomin Zhang ◽  
Bin Xu ◽  
Hui Chong ◽  
Wenxian Wei ◽  
Chengyin Wang ◽  
...  
Keyword(s):  
Electrochemical Deposition ◽  
Copper Films ◽  
X Ray Diffraction ◽  
X Ray

Quantitative probing of glyphosate by combining electrochemical deposition and X-ray diffraction methods.

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