scholarly journals Effect of glyphosate on X-ray diffraction of copper films prepared by electrochemical deposition

RSC Advances ◽  
2019 ◽  
Vol 9 (25) ◽  
pp. 14016-14023 ◽  
Author(s):  
Gaomin Zhang ◽  
Bin Xu ◽  
Hui Chong ◽  
Wenxian Wei ◽  
Chengyin Wang ◽  
...  
Keyword(s):  
Electrochemical Deposition ◽  
Copper Films ◽  
X Ray Diffraction ◽  
X Ray

Quantitative probing of glyphosate by combining electrochemical deposition and X-ray diffraction methods.

Room Temperature Self-Annealing of Electroplated and Sputtered Copper Films

1999 ◽  
Vol 562 ◽  
Author(s):  
Michelle Chen ◽  
Suraj Rengarajan ◽  
Peter Hey ◽  
Yezdi Dordi ◽  
Hong Zhang ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Room Temperature ◽  
Copper Film ◽  
Copper Films ◽  
Organic Additives ◽  
X Ray Diffraction ◽  
X Ray ◽  
Transmission Electron ◽  
Electroplated Copper ◽  
Effect Of Copper

ABSTRACTSelf-annealing properties of electroplated and sputtered copper films at room temperature were investigated in this study, in particular, the effect of copper film thickness, electrolyte systems used, as well as their level of organic additives for electroplating. Real-time grain growth was observed by transmission electron microscopy. Sheet resistance and X-ray diffraction measurements further confirmed the recrystallization of the electroplated copper film with time. The recrystallization of electroplated films was then compared with that of sputtered copper films.

scholarly journals Electrochemical deposition of coatings of highly entropic alloys from non-aqueous solutions

2016 ◽  
Vol 60 (1) ◽  
pp. 6-12 ◽  
Author(s):  
V. Jeníček ◽  
L. Diblíková ◽  
M. Bláhová
Keyword(s):  
Aqueous Solutions ◽  
Electrochemical Deposition ◽  
Absorption Spectrometry ◽  
New Materials ◽  
X Ray Diffraction ◽  
Scanning Calorimetry ◽  
X Ray ◽  
Electrochemical Coating ◽  
First Results ◽  
Combination Of Methods

Abstract The paper deals with electrochemical deposition of coatings of highly entropic alloys. These relatively new materials have been recently intensively studied. The paper describes the first results of electrochemical coating with highly entropic alloys by deposition from non-aqueous solutions. An electrochemical device was designed and coatings were deposited. The coatings were characterised with electronic microscopy scanning, atomic absorption spectrometry and X-ray diffraction methods and the combination of methods of thermic analysis of differential scanning calorimetry and thermogravimetry.

Room Temperature Self-Annealing of Electroplated and Sputtered Copper Films

1999 ◽  
Vol 564 ◽  
Author(s):  
Michelle Chen ◽  
Suraj Rengarajan ◽  
Peter Hey ◽  
Yezdi Dordi ◽  
Hong Zhang ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Room Temperature ◽  
Copper Film ◽  
Copper Films ◽  
Organic Additives ◽  
X Ray Diffraction ◽  
X Ray ◽  
Transmission Electron ◽  
Electroplated Copper ◽  
Effect Of Copper

AbstractSelf-annealing properties of electroplated and sputtered copper films at room temperature were investigated in this study, in particular, the effect of copper film thickness, electrolyte systems used, as well as their level of organic additives for electroplating. Real-time grain growth was observed by transmission electron microscopy. Sheet resistance and X-ray diffraction measurements further confirmed the recrystallization of the electroplated copper film with time. The recrystallization of electroplated films was then compared with that of sputtered copper films.

Characterizations of ZnS/CuInS2 Film Fabricated by Electrochemical Deposition Process for Solar Cell Devices

2012 ◽  
Vol 15 (2) ◽  
pp. 103-106 ◽  
Author(s):  
Yih-Min Yeh ◽  
Hsiang Chen ◽  
Chuan Hao Liao ◽  
Ching Bang Chen ◽  
Bin Yi Chen
Keyword(s):  
Electrochemical Deposition ◽  
Low Cost ◽  
Deposition Process ◽  
Thin Film Solar Cells ◽  
Constant Current ◽  
X Ray Diffraction ◽  
X Ray ◽  
Sulfur Atmosphere ◽  
Surface Morphologies ◽  
Zns Films

In this study, CuInS2 (CIS) films were fabricated by a two-step, non-vacuum process. Electrochemical deposition (ECD) was first used to prepare Cu-In precursors on Mo substrate under constant current. Then, CuInS2 films were prepared by sulfurization of the Cu-In precursors in sulfur atmosphere. The surface morphologies, compositions, and transmittance of the CuInS2 and ZnS films were characterized by X-ray diffraction (XRD), scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and UV-VIS, respectively. The results show that a high-quality CIS thin film solar cells by low-cost, non-vacuum process could be obtained.

Micro-Tensile and Fatigue Testing of Copper Thin Films on Substrates

1998 ◽  
Vol 546 ◽  
Author(s):  
M. Hommel ◽  
O. Kraft ◽  
S. P. Baker ◽  
E. Arzt
Keyword(s):  
Elastic Strain ◽  
Fatigue Testing ◽  
Tensile Tests ◽  
Copper Films ◽  
X Ray Diffraction ◽  
X Ray ◽  
Tensile Tester ◽  
Elastic Strains ◽  
External Strain

AbstractA special micro-tensile tester was used to carry out tensile tests of thin copper films on substrates. The elastic strain in the film was measured in-situ using x-ray diffraction and the total strain with an external strain gage. From the elastic strains the stresses in the films were calculated and stress-strain curves were obtained. It was observed that the flow stress increases with decreasing film thickness. The method was also applied to investigate the mechanical behavior of films under cyclic loading.

In Situ X-ray Diffraction and Spectro-Microscopic Study of ALD Protected Copper Films

2020 ◽  
Vol 12 (29) ◽  
pp. 33377-33385
Author(s):  
Gül Dogan ◽  
Umut T. Sanli ◽  
Kersten Hahn ◽  
Lutz Müller ◽  
Herbert Gruhn ◽  
...  
Keyword(s):  
Microscopic Study ◽  
Copper Films ◽  
X Ray Diffraction ◽  
X Ray

Fabrication and Characterization of Nanoscale Porous Copper Film

2012 ◽  
Vol 433-440 ◽  
pp. 683-688
Author(s):  
Liu Wei Ding ◽  
Hao Ran Geng ◽  
Jing Hua Xu
Keyword(s):  
Copper Film ◽  
Selective Dissolution ◽  
Amorphous Structure ◽  
Nanometer Scale ◽  
Copper Films ◽  
Nanocrystalline Films ◽  
X Ray Diffraction ◽  
X Ray ◽  
Porous Copper

Cu-38Zn thin film (wt %) was deposited on the unheated microscope glass at the nanometer scale by DC magnetron sputtering. Subsequently, the nanocrystalline films were dealloyed in H2SO4 aqueous solution etching of zinc component, resulting in the formation of nanoscale porous copper film with average porous diameter of approximately 94 nm. The films microstructure and element composition were characterized by X-ray diffraction and scanning electron microscopy. The experimental results show that Cu-38Zn films are quasi-amorphous structure, porous copper film with different porous sizes is prepared by selective dissolution of zinc atoms from a nanocrystalline dual-phase film under free corrosion conditions, the grain size of the Cu-Zn films has an important effect on the dealloying process and the microstructures of the nanoscale copper films.

Textures of thin copper films

1998 ◽  
Vol 13 (10) ◽  
pp. 2962-2968 ◽  
Author(s):  
W-M. Kuschke ◽  
A. Kretschmann ◽  
R-M. Keller ◽  
R. P. Vinci ◽  
C. Kaufmann ◽  
...  
Keyword(s):  
Copper Film ◽  
Annealing Treatment ◽  
Copper Films ◽  
Deposition Method ◽  
Deposition Technique ◽  
X Ray Diffraction ◽  
Barrier Material ◽  
X Ray ◽  
Pole Figures ◽  
Cap Layer

The textures of thin copper films were determined quantitatively by measuring (111) pole figures with x-ray diffraction. Measurements were performed on a variety of samples, differing in copper film thickness and deposition technique, diffusion barrier material, and the presence or absence of a cap layer. Texture changes due to an annealing treatment were also recorded and correlated with stress measurements by the wafer-curvature technique. It is found that the deposition method (PVD vs CVD) has a strong effect on texture, barrier layer effects range from negligible to significant depending on the barrier material, and the effect of a cap layer is insignificant.

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