Thermal Stress Reduction of Copper Through Silicon Via (TSV) with Annealing

2018 ◽  
Vol 7 (11) ◽  
pp. P689-P692 ◽  
Author(s):  
Van Quy Dinh ◽  
Kazuo Kondo ◽  
Van Ha Hoang ◽  
Tetsuji Hirato
Keyword(s):  
Thermal Stress ◽  
Stress Reduction ◽  
Through Silicon Via

scholarly journals IGBT Thermal Stress Reduction Using Advance Control Strategy

Procedia CIRP ◽  
2017 ◽  
Vol 59 ◽  
pp. 274-279 ◽  
Author(s):  
Payam Soulatiantork ◽  
Alireza Alghassi ◽  
Marco Faifer ◽  
Suresh Perinpanayagam
Keyword(s):  
Thermal Stress ◽  
Stress Reduction ◽  
Control Strategy

scholarly journals Impact of the disconnection of cable shields on the thermal stress reduction in case of cross-country faults

2017 ◽  
Vol 2017 (1) ◽  
pp. 1188-1192
Author(s):  
Maurizio Della Corte ◽  
Luigi D'orazio ◽  
Andrea Malerba ◽  
Federico Marmeggi
Keyword(s):  
Thermal Stress ◽  
Stress Reduction ◽  
Cross Country

602 Thermal Stress of 3D SiP with Through Silicon Via Structures

2010 ◽  
Vol 2010 (0) ◽  
pp. 311-313
Author(s):  
Tatsuhiro HORI ◽  
Takahiro KINOSHITA ◽  
Takashi KAWAKAMI
Keyword(s):  
Thermal Stress ◽  
Through Silicon Via

ACTIVE COOLING AND THERMAL STRESS REDUCTION IN A POROELASTIC HOLLOW SPHERE

1997 ◽  
Vol 20 (3-4) ◽  
pp. 389-405 ◽  
Author(s):  
Tsuyoshi Kodashima ◽  
Michio Kurasbige
Keyword(s):  
Thermal Stress ◽  
Stress Reduction ◽  
Hollow Sphere ◽  
Active Cooling

Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps

2009 ◽  
Vol 32 (4) ◽  
pp. 720-728 ◽  
Author(s):  
C.S. Selvanayagam ◽  
J.H. Lau ◽  
Xiaowu Zhang ◽  
S. Seah ◽  
K. Vaidyanathan ◽  
...  
Keyword(s):  
Thermal Stress ◽  
Flip Chip ◽  
Stress Strain ◽  
Through Silicon Via
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