Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects

2012 ◽  
Vol 159 (10) ◽  
pp. D563-D569 ◽  
Author(s):  
J. Kelly ◽  
T. Nogami ◽  
O. van der Straten ◽  
J. Demarest ◽  
J. Li ◽  
...  
Keyword(s):  
Impurity Incorporation ◽  
Feature Size ◽  
Electrolyte Additive ◽  
Cu Interconnects ◽  
Size Dependent

Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects

2019 ◽  
Vol 41 (43) ◽  
pp. 23-33 ◽  
Author(s):  
James Kelly ◽  
Takeshi Nogami ◽  
O. Van der Straten ◽  
James Demarest ◽  
Juntao Li ◽  
...  
Keyword(s):  
Impurity Incorporation ◽  
Feature Size ◽  
Electrolyte Additive ◽  
Cu Interconnects ◽  
Size Dependent

Modeling and simulation of feature-size-dependent etching of metal stacks

2001 ◽  
Vol 19 (1) ◽  
pp. 179 ◽  
Author(s):  
Shahram Abdollahi-Alibeik ◽  
Jie Zheng ◽  
James P. McVittie ◽  
Krishna C. Saraswat ◽  
Calvin T. Gabriel ◽  
...  
Keyword(s):  
Modeling And Simulation ◽  
Feature Size ◽  
Size Dependent

Impact of feature-size dependent etching on the optical properties of photonic crystal devices

2008 ◽  
Vol 103 (9) ◽  
pp. 096106 ◽  
Author(s):  
A. Berrier ◽  
R. Ferrini ◽  
A. Talneau ◽  
R. Houdré ◽  
S. Anand
Keyword(s):  
Optical Properties ◽  
Photonic Crystal ◽  
Feature Size ◽  
Size Dependent

Kinetics and Mechanism of the Copper-Catalyzed Etching of Silicon by F2

1987 ◽  
Vol 111 ◽  
Author(s):  
N. Selamoglu ◽  
J. A. Mucha ◽  
D. L. Flamm ◽  
D. E. Ibbotson
Keyword(s):  
Etch Rate ◽  
Reaction Rate ◽  
Active Species ◽  
Zero Order ◽  
Feature Size ◽  
First Order ◽  
Size Dependent ◽  
Copper Compounds ◽  
Catalytically Active ◽  
Active Intermediates

AbstractThe copper catalyzed fluorination of silicon is first-order in [F2] and in [Cu]s until the coverage reaches ∼4 monolayers. Above ∼4 monolayers the reaction rate is zero order in copper, suggesting a limited number of catalytically active Cu/Si sites. Surface diffusion of copper leads to decrease in the etch rate as a function of time as well as feature size-dependent etch depths. The copper compounds CuF2, CuO, and copper silicides, Cu5 Si and Cu3 Si all catalyzed the F2-Si reaction which suggests that they are all converted to the same active species. The results can be explained by mechanisms involving copper fluorides or copper silicides as active intermediates.

Model predictions of feature-size-dependent step coverages by PVD aluminum: surface diffusion

1991 ◽  
Vol 206 (1-2) ◽  
pp. 54-58 ◽  
Author(s):  
T.S. Cale ◽  
T.H. Gandy ◽  
G.B. Raupp ◽  
M. Ramaswami
Keyword(s):  
Surface Diffusion ◽  
Aluminum Surface ◽  
Feature Size ◽  
Size Dependent ◽  
Model Predictions

Ultracompact directional couplers realized in InP by utilizing feature size dependent etching

2008 ◽  
Vol 33 (17) ◽  
pp. 1927 ◽  
Author(s):  
Yaocheng Shi ◽  
Sailing He ◽  
Srinivasan Anand
Keyword(s):  
Feature Size ◽  
Directional Couplers ◽  
Size Dependent
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