Characterizing Transport Limitations during Copper Electrodeposition of High Aspect Ratio Through-Silicon Vias

2012 ◽  
Vol 2 (2) ◽  
pp. D5-D8 ◽  
Author(s):  
R. Akolkar
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Copper Electrodeposition ◽  
Through Silicon Vias ◽  
Silicon Vias

scholarly journals Copper Electrodeposition in High Aspect Ratio Mesoscale Through-Silicon Vias: Scaling from Die Level to Wafer Level Plating

2020 ◽  
Vol MA2020-02 (25) ◽  
pp. 1787-1787
Author(s):  
Rebecca Pauline Schmitt ◽  
Lyle Alexander Menk ◽  
Matthew Jordan ◽  
Jason Christopher ◽  
Ehren Donel Baca ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Copper Electrodeposition ◽  
Wafer Level ◽  
Through Silicon Vias ◽  
Silicon Vias

Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias

2012 ◽  
Vol 22 (5) ◽  
pp. 055021 ◽  
Author(s):  
Pradeep Dixit ◽  
Tapani Vehmas ◽  
Sami Vähänen ◽  
Philippe Monnoyer ◽  
Kimmo Henttinen
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Electrical Characterization ◽  
Through Silicon Vias ◽  
Poly Silicon ◽  
Silicon Vias

scholarly journals Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias

2017 ◽  
Vol 7 (1) ◽  
Author(s):  
Fei He ◽  
Junjie Yu ◽  
Yuanxin Tan ◽  
Wei Chu ◽  
Changhe Zhou ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Bessel Beams ◽  
Through Silicon Vias ◽  
Silicon Vias

Bottom-up Copper Electrodeposition in 20:1 Aspect Ratio, 20 Μm Pitch through Silicon Vias

2020 ◽  
Vol MA2020-02 (25) ◽  
pp. 1791-1791
Author(s):  
Lyle Alexander Menk ◽  
Rebecca Pauline Schmitt ◽  
William Moyer Mook ◽  
Kate Musick ◽  
Jaime McClain ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Copper Electrodeposition ◽  
Bottom Up ◽  
Through Silicon Vias ◽  
Silicon Vias
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