Large-Scale Preparation of Uniform Nanopatterned Silicon Substrates by Inductively Coupled Plasma Etching Using Self-Assembled Anodic Alumina Masks

2016 ◽  
Vol 5 (6) ◽  
pp. P320-P323 ◽  
Author(s):  
Ji-Li Tian ◽  
Gui-Gen Wang ◽  
Hua-Yu Zhang ◽  
Jie-Cai Han
Micromachines ◽  
2020 ◽  
Vol 11 (7) ◽  
pp. 638
Author(s):  
Lihao Wang ◽  
Meijie Liu ◽  
Junyuan Zhao ◽  
Jicong Zhao ◽  
Yinfang Zhu ◽  
...  

This work reports a batch fabrication process for silicon nanometer tip based on isotropic inductively coupled plasma (ICP) etching technology. The silicon tips with nanometer apex and small surface roughness are produced at wafer-level with good etching homogeneity and repeatability. An ICP etching routine is developed to make silicon tips with apex radius less than 5 nm, aspect ratio greater than 5 at a tip height of 200 nm, and tip height more than 10 μm, and high fabrication yield is achieved by mask compensation and precisely controlling lateral etch depth, which is significant for large-scale manufacturing.


2012 ◽  
Author(s):  
Jean Nguyen ◽  
John Gill ◽  
Sir B. Rafol ◽  
Alexander Soibel ◽  
Arezou Khoshakhlagh ◽  
...  

2005 ◽  
Vol 34 (6) ◽  
pp. 740-745 ◽  
Author(s):  
E. Laffosse ◽  
J. Baylet ◽  
J. P. Chamonal ◽  
G. Destefanis ◽  
G. Cartry ◽  
...  

2009 ◽  
Vol 517 (14) ◽  
pp. 3859-3861 ◽  
Author(s):  
Byung-Jae Kim ◽  
Hyunjung Jung ◽  
Hong-Yeol Kim ◽  
Joona Bang ◽  
Jihyun Kim

2015 ◽  
Vol 32 (5) ◽  
pp. 058102 ◽  
Author(s):  
Ying Cheng ◽  
Ji-Jun Zou ◽  
Ming Wan ◽  
Wei-Lu Wang ◽  
Xin-Cun Peng ◽  
...  

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