Cu Corrosion during Post-CMP Clean - Cause and Prevention

2019 ◽  
Vol 44 (1) ◽  
pp. 573-577 ◽  
Author(s):  
Sen-Hua (Samuel) Li ◽  
Jun Liu ◽  
Cuong Tran ◽  
EngHoe Tan ◽  
Qiang Li ◽  
...  
Keyword(s):  
2009 ◽  
Vol 48 (4) ◽  
pp. 04C023 ◽  
Author(s):  
Masayoshi Imai ◽  
Yukinari Yamashita ◽  
Takashi Futatsuki ◽  
Morio Shiohara ◽  
Seiichi Kondo ◽  
...  

2014 ◽  
Vol 556-562 ◽  
pp. 141-144
Author(s):  
Zhi Hua Tao ◽  
Bin Leng ◽  
Chong Wang ◽  
Ding Jun Xiao ◽  
Ze Tan ◽  
...  

The eleetronic material, or even the whole equipments may be destroyed by very slight corrosion, so it is important to study the corrosion mechanism and corrosion protections. The Cyproconazole as a Cu corrosion inhibitor for Electronic Circuit Board in the base electrolyte (containing 70 ppm chloride ions, 0.54 mol/L H2SO4and 0.8 mol/L CuSO4) was investigated using polarization curves and AC impedance. The results showed that the inhibition performance of the Cyproconazole depended on the concentration of the inhibitor and the highest inhibition efficiency of the Cyproconazole reached 99.9% at 1×10-3mol/L in the base electrolyte. The results obtained from EIS measurements are in good agreement with that obtained from potentiodynamic polarization. Potentiodynamic polarization studies clearly revealed that Cyproconazole adsorption acted essentially as the mixed-type inhibitor.


2010 ◽  
Vol 49 (5) ◽  
pp. 05FF04 ◽  
Author(s):  
Kentaro Tokuri ◽  
Yukinari Yamashita ◽  
Morio Shiohara ◽  
Noriaki Oda ◽  
Seiichi Kondo ◽  
...  

2019 ◽  
Vol 8 (8) ◽  
pp. P437-P447 ◽  
Author(s):  
Lianjun Hu ◽  
Guofeng Pan ◽  
Xinbo Zhang ◽  
Ping He ◽  
Chenwei Wang

2004 ◽  
Vol 76 (3) ◽  
pp. 604-609 ◽  
Author(s):  
Zachary D. Schultz ◽  
Mary Ellen Biggin ◽  
Jeffrey O. White ◽  
Andrew A. Gewirth

2017 ◽  
Vol 77 (11) ◽  
pp. 767-775
Author(s):  
Bo Yuan ◽  
Debbie A Flemming ◽  
John Franey ◽  
Robert L. Opila ◽  
Chen Xu

2014 ◽  
Vol 219 ◽  
pp. 85-88 ◽  
Author(s):  
Yukifumi Yoshida ◽  
Masayuki Otsuji ◽  
Hiroaki Takahashi ◽  
Jim Snow ◽  
Farid Sebaai ◽  
...  

of these new materials have necessitated the evaluation of new chemicals and processing methods. The control of the Dissolved Oxygen (DO) concentration to suppress Cu corrosion is well established in BEOL processing and likewise in order to achieve a hydrophobic surface after pre-epi cleaning in FEOL surface preparation [2].


2017 ◽  
Vol 35 (3) ◽  
pp. 21-27
Author(s):  
Mi-Song Kim ◽  
Won Sik Hong ◽  
Chul Min Oh ◽  
Keun-Soo Kim

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