Inhibition Effect of TT-LYK on Cu Corrosion and Galvanic Corrosion between Cu and Co during CMP in Alkaline Slurry

2019 ◽  
Vol 8 (8) ◽  
pp. P437-P447 ◽  
Author(s):  
Lianjun Hu ◽  
Guofeng Pan ◽  
Xinbo Zhang ◽  
Ping He ◽  
Chenwei Wang
Keyword(s):  
Galvanic Corrosion ◽  
Inhibition Effect ◽  
Cu Corrosion

Corrosion of Electronic and Magnetic Devices and Materials

1996 ◽  
Vol 451 ◽  
Author(s):  
Gerald S. Frankel
Keyword(s):  
Thin Film ◽  
Failure Modes ◽  
Galvanic Corrosion ◽  
Potential Drop ◽  
Magnetic Devices ◽  
Disk Structure ◽  
Magnetic Layers ◽  
Ohmic Potential Drop ◽  
Corrosion Problem ◽  
Corrosion Susceptibility

ABSTRACTCorrosion of thin film structures commonly used in electronic and magnetic devices is discussed. Typical failure modes are presented, and galvanic corrosion is discussed in some detail since it is one common problem with such devices. A graphical explanation for the determination of the ohmic potential drop during galvanic corrosion is presented. The corrosion problem of thin film disks is shown to have changed during the past ten years owing to changes in disk structure. The corrosion susceptibility of two antiferromagnetic alloys used for exchange coupling to soft magnetic layers is discussed.

Development of corrosion flaws for the production of realistic test specimens

2020 ◽  
Vol 64 (1) ◽  
pp. 23-28
Author(s):  
J. Hodač ◽  
Z. Fulín ◽  
P. Mareš ◽  
J. Veselá ◽  
O. Chocholatý
Keyword(s):  
Power Plants ◽  
Galvanic Corrosion ◽  
Water Solution ◽  
Erosive Wear ◽  
Corrosion Damage ◽  
Water Mist ◽  
Carbon Steels ◽  
Bending Stress ◽  
Solution Flow ◽  
Mechanical Bending

AbstractTo produce realistic test specimens with realistic flaws, it is necessary to develop appropriate procedure for corrosion flaw production. Tested specimens are made from steels commonly used in power plants, such as carbon steels, stainless steels and their dissimilar weldments. In this study, corrosion damage from NaCl water solution and NaCl water mist are compared. Specimens were tested with and without mechanical bending stress. The corrosion processes produced plane, pitting and galvanic corrosion. On dissimilar weldments galvanic corrosion was observed and resulted to the deepest corrosion damage. Deepest corrosion flaws were formed on welded samples. The corrosion rate was also affected by the solution flow in a contact with the specimens, which results in a corrosion-erosive wear. Produced flaws are suitable as natural crack initiators or as realistic corrosion flaws in test specimens.

Inter-individual variability in clopidogrel inhibition effect on platelet aggregation

2018 ◽  
Vol 9 (SPL1) ◽  
Author(s):  
Hussein Ali Sahib ◽  
Bassim Irhiem Mohammed ◽  
Ban A. Abdul Majid
Keyword(s):  
Cardiovascular Disease ◽  
Platelet Aggregation ◽  
Coronary Care Unit ◽  
Light Transmission ◽  
Individual Variability ◽  
Study Group ◽  
Inhibition Effect ◽  
Light Transmission Aggregometry ◽  
Coronary Care ◽  
Skewness And Kurtosis

Despite the unmistakable beneficial effect of clopidogrel on platelet aggregation,still there are some patient poorly responds to clopidogrel that may lead to worse cardiovascular clinical events.One hundred and twenty seven patients with cardiovascular disease (ACS,stroke,or TIA) were enrolled as a study group. Patients were recruited at coronary care unit (CCU) of Al-Yarmouk Teaching Hospital. Paletlet assessment was done by using light transmission aggregometry. between the patients that enrolled in this study there are significant inter-individual variability both skewness and Kurtosis were negative (-0.450,-0.130) respectively. 24% of patient enrolled in this study were hyporesponder.

Inhibition Effect Extract Stolephorus insularis as a Antimicroba in Staphylococcus aereus Bacteria

DENTA ◽  
2018 ◽  
Vol 12 (1) ◽  
pp. 22
Author(s):  
Ayu Listya ◽  
Yulie Emilda Akhwan
Keyword(s):  
Staphylococcus Aureus ◽  
Root Canal ◽  
Quantitative Research ◽  
Media Culture ◽  
Root Canal Treatment ◽  
Research Needs ◽  
Dmso Solution ◽  
Entire Surface ◽  
Inhibition Effect ◽  
Inhibitory Power

<pre><em><strong>Background :</strong> U</em><em>ntreated caries will continue and microorganisms enter the pulp resulting in an inflammatory response and pulp necrosis. Sterilization is one part of root canal treatment and is important for the success of root canal treatment. Stolephorus insularis contains antibacterial substances such as fluor. Previous research showed that extract Stolephorus insularis has antibacterial activity in Streptococcus mutans bacteria.</em><em></em></pre><pre><em>Purpose : T</em><em>his study aims to determine the antibacterial power of Stolephorus insularis extract on the growth of Staphylococcus aereus bacteria by using 3 concentrations of 18%, 24% and 30%.</em></pre><pre><em>Material and Method :</em><em>This resesarch use culture of Staphylococcus aereus bacteria in MH blood agar, Stolephorus insularis extract with various concentrations (18%, 24%, 30%), 7% Na CMC, 1% DMSO solution, agar BHI media. Culture of Staphylococcus aereus was taken from liquid BHI media, then rubbed on the entire surface of BHI media using a sterile cotton stick. The antibacterial zone formed is measured.</em></pre><pre> </pre><pre><em>Result : B</em><em>ased on the results of the Mann-Whitney test there were significant differences in the inhibitory power of Staphylococcus aureus bacteria (p &lt;0.05) in the K + group with groups K-, P1, P2 and P3. Whereas between groups P1 with K-, group P2 with K- and P1, and group P3 with K-, P1 and P2 there were no significant differences because the significant value was greater than 0.05</em><em></em></pre><pre><em>Conclusion : T</em><em>here is no antimicrobial power at concentrations of 18%, 24%, and 30%. Quantitative research needs to be done to determine the decrease in the number of bacterial colonies.</em><em></em></pre><p><em><br /></em></p><p><em><strong>Keywords :</strong> Inhibition effect, Stolephorus insularis, Staphylococcus aereus</em></p><p><em><br /></em></p><p><em><strong>Correspondence :</strong> </em><em>Ayulistya Paramita, Paediatric Departemen. FKG UHT, Jl Arief Rahman Hakim no 150 Surabaya. email : [email protected]</em></p>

Studies on a Failure Analysis Flow of Surface Contamination, Corrosion, and Underetch on Microchip Al Bondpads in Wafer Fabrication

2005 ◽  
Author(s):  
Hua Younan
Keyword(s):  
Failure Analysis ◽  
Galvanic Corrosion ◽  
Surface Contamination ◽  
Wafer Fabrication ◽  
Tof Sims ◽  
Corrosion Passivation

Abstract A failure analysis flow is developed for surface contamination, corrosion and underetch on microchip Al bondpads and it is applied in wafer fabrication. SEM, EDX, Auger, FTIR, XPS and TOF-SIMS are used to identify the root causes. The results from carbon related contamination, galvanic corrosion, fluorine-induced corrosion, passivation underetch and Auger bondpad monitoring will be presented. The failure analysis flow will definitely help us to select suitable methods and tools for failure analysis of Al bondpad-related issues, identify rapidly possible root causes of the failures and find the eliminating solutions at both wafer fabrication and assembly houses.

PCB Related Field Failures with ImAg Surface Finishes

2007 ◽  
Author(s):  
Anil Kurella ◽  
Aravind Munukutla ◽  
J.S. Lewis
Keyword(s):  
Emerging Markets ◽  
Galvanic Corrosion ◽  
Electrochemical Migration ◽  
Copper Sulphide ◽  
Electronic Components ◽  
Related Field ◽  
Surface Finishes ◽  
Immersion Silver ◽  
Manufacturing Environments

Abstract PCB surface finishes like Immersion silver (ImAg) are commonly used in Pb-free manufacturing environments following RoHS legislation. With this transition, however the numbers of field failures associated with electrochemical migration, copper sulphide corrosion, via barrel galvanic corrosion are on a steady rise. More often than not ImAg surfaces seem to assist these failing signatures. As computers penetrate into emerging markets with humid and industrialized environments there is a greater concern on the reliability and functionality of these electronic components.

Analysis of Al-over-Cu Bond Pad Hillock and Pit Hole Defects

2005 ◽  
Author(s):  
Daniel Cavasin ◽  
Abdullah Yassine
Keyword(s):  
Focused Ion Beam ◽  
Galvanic Corrosion ◽  
Process Analysis ◽  
Ion Beam ◽  
Metal Corrosion ◽  
Process Characterization ◽  
Nucleation Sites ◽  
Hole Defects ◽  
Bond Pads ◽  
Sawing Process

Abstract Bond pad metal corrosion was observed during assembly process characterization of a 0.13um Cu microprocessor device. The bond pad consisted of 12kÅ of Al-0.5%Cu atop 9kÅ of Cu, separated by a thin Ta diffusion barrier. The corrosion was first noted after the wafer dicing process. Analysis of the pad surface revealed pitting-type corrosion, consistent with published reports of classic galvanic cell reactions between Al2Cu (theta phase) particles and the surrounding Al pad metal. Analysis of the bond pads on samelot wafers which had not been diced showed higher-thanexpected incidence of hillock and pit hole defects on the Al surface. Statistically designed experiments were formulated to investigate the possibility that the observed pre-saw pad metal defects act as nucleation sites for galvanic corrosion during the sawing process. Analyses of the experimental samples were conducted using optical and scanning electron microscopy, along with focused ion beam deprocessing and energy dispersive X-ray. This paper explores the relationship between the presence of these pre-existing defects and the propensity for the bond pads to corrode during the dicing process, and reviews the conditions under which pit hole defects are formed during the final stages of the Cu-metallized wafer fabrication process. Indications are that strict control of wafer fab backend processes can reduce or eliminate the incidence of such defects, resulting in elimination of bond pad corrosion in the wafer dicing process.

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