Surface and Interface Characterization of Sequentially Plasma Activated Silicon, Silicon dioxide and Germanium Wafers for Low Temperature Bonding Applications
2012 ◽
Vol 52
(7)
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pp. 1367-1372
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Keyword(s):
Keyword(s):
2018 ◽
Vol 32
(12)
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pp. 12174-12186
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1993 ◽
pp. 165-174
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2005 ◽
Vol 2
(5)
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pp. 407-416
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1996 ◽
Vol 24
(13)
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pp. 841-855
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Keyword(s):
2002 ◽
Vol 20
(3)
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pp. 1234
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1999 ◽
Vol 115
(2-3)
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pp. 256-265
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