New SOI Substrate with High Thermal Conductivity for High Performance Mixed-Signal Applications

2019 ◽  
Vol 33 (4) ◽  
pp. 145-151 ◽  
Author(s):  
Taehun Lee ◽  
Mihai Burzo ◽  
Peter Raad ◽  
Ali Aliev ◽  
Pavel Komarov ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
High Thermal Conductivity ◽  
Mixed Signal

Challenges in Package Cooling of High Performance Servers

2007 ◽  
Author(s):  
Jie Wei
Keyword(s):  
Thermal Conductivity ◽  
Power Dissipation ◽  
High Performance ◽  
Heat Pipes ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Heat Spreader ◽  
Asymmetric Power ◽  
Heat Spreading ◽  
Silver Composite

Cooling technologies for dealing with high-density and asymmetric power dissipation are discussed, arising from thermal management of high performance server CPU-packages. In this paper, investigation and development of associated technologies are introduced from a viewpoint of industrial application, and attention is focused on heat conduction and removal at the package and heatsink module level. Based on analyses of power dissipation and package cooling characteristics, properties of a new metallic thermal interface material are presented where the Indium-Silver composite was evaluated for integrating the chip and its heat-spreader, effects of heat spreading materials on package thermal performance are investigated including high thermal conductivity diamond composites, and evaluations of enhanced heatsink cooling capability are illustrated where high thermal conductivity devices of heat pipes or vapor chambers were applied for improving heat spreading in the heatsink base.

Investigation of Micro-Drilling for Printed Circuit Boards Containing High-Hardness Fillers

2012 ◽  
Vol 565 ◽  
pp. 442-447 ◽  
Author(s):  
Taiji Funabiki ◽  
Toshiki Hirogaki ◽  
Eiichi Aoyama ◽  
Keiji Ogawa ◽  
Hiroyuki Kodama
Keyword(s):  
Thermal Conductivity ◽  
Cutting Force ◽  
High Performance ◽  
Printed Circuit Boards ◽  
High Hardness ◽  
High Thermal Conductivity ◽  
Digital Cameras ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Micro Drilling

This paper describes micro-drilling processes for printed circuit boards (PCBs) containing fillers with high hardness and high thermal conductivity. Inspired primarily by devices such as digital cameras, laptop computers, and wireless communications devices, the electronics field today is continuously demanding smaller, lighter, and more technologically advanced high performance devices. However, that the increase in semiconductor-generated heat tends to affect such devices negatively. Additionally, from the viewpoint of environmental problems, electric vehicles and LEDs are being developed actively. PCBs are one of the principal components for building such devices. In recent years, PCBs containing alumina fillers with high thermal conductivity have been developed and begun to be widely used. However, when processing these PCBs, the drill tools become severely worn because of the filler’s high hardness. We therefore examined the drill wear characteristics. The results show the filler is the main factor that causes drill wear, while the increase in cutting force does not affect it. The cutting force increases with the drill wear linearly. Moreover, the characteristic of PCBs with higher filler content rates is close to that of inorganic material like ceramics.

Advanced Conductive Composite Materials for Spacecraft Application

2010 ◽  
Vol 123-125 ◽  
pp. 7-10
Author(s):  
Ho Sung Lee
Keyword(s):  
Thermal Conductivity ◽  
Composite Material ◽  
Composite Materials ◽  
Carbon Fiber ◽  
High Performance ◽  
Thermal Stresses ◽  
Thermal Design ◽  
High Thermal Conductivity ◽  
Carbon Fiber Composites ◽  
Advanced Composite

In this study, thermal responses of advanced fiber/epoxy matrix composite materials are considered for spacecraft thermal design. These thermal responses are important, because the localized thermal behavior from applied heat loads can induce thermal stresses, which can lead to functional failure of the spacecraft system. Since most of polymer matrices exhibit relatively poor thermal conductivity, the composite materials have been widely considered only for structural application and little for thermal application. However, recently pitch-based high performance carbon fiber becomes available and this fiber shows high thermal conductivity. Because of this combination of low CTE and high thermal conductivity, continuous carbon fiber composites make them suitable for thermal management of spacecraft. The advanced composite material is composed of a continuous high modulus pitch based fiber (YS90A) and DGEBA epoxy resin(RS3232). It was demonstrated that advanced composite material satisfied thermal requirement for a lightweight thermal radiator for heat rejection of communication satellite.

scholarly journals An Integrated Approach to Design and Develop High-Performance Polymer-Composite Thermal Interface Material

Polymers ◽  
2021 ◽  
Vol 13 (5) ◽  
pp. 807
Author(s):  
Syed Sohail Akhtar
Keyword(s):  
Thermal Conductivity ◽  
Aspect Ratio ◽  
High Performance ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Design Stage ◽  
Filler Concentration ◽  
Melt Mixing ◽  
Thermal Interface ◽  
Wide Range

A computational framework based on novel differential effective medium approximation and mean-field homogenization is used to design high-performance filler-laden polymer thermal interface materials (TIMs). The proposed design strategy has the capability to handle non-dilute filler concentration in the polymer matrix. The effective thermal conductivity of intended thermal interface composites can be tailored in a wide range by varying filler attributes such as size, aspect ratio, orientation, as well as filler–matrix interface with an upper limit imposed by the shear modulus. Serval potential polymers and fillers are considered at the design stage. High-density polyethylene (HDPE) and thermoplastic polyurethane (TPU) with a non-dilute concentration (~60 vol%) of ceramic fillers exhibit high thermal conductivity (4–5 W m−1 K−1) without compromising the high compliance of TIMs. The predicted thermal conductivity and coefficient of thermal expansion are in excellent agreement with measured data of various binary composite systems considering HDPE, TPU, and polypropylene (PP) loaded with Al2O3 and AlN fillers in varying sizes, shapes, and concentrations, prepared via the melt-mixing and compression-molding route. The model also validates that manipulating filler alignment and aspect ratio can significantly contribute to making heat-conducting networks in composites, which results in ultra-high thermal conductivity.

Practical Formula for Predicting Drill Wear in Micro-Drilling of Printed Circuit Boards Containing High Hardness Fillers

2012 ◽  
Author(s):  
Taiji Funabiki ◽  
Toshiki Hirogaki ◽  
Eiichi Aoyama ◽  
Keiji Ogawa ◽  
Hiroyuki Kodama
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Printed Circuit Boards ◽  
High Hardness ◽  
Drill Hole ◽  
High Thermal Conductivity ◽  
Digital Cameras ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Micro Drilling

This paper describes micro-drilling processes for Printed Circuit Boards (PCBs) containing fillers with high hardness and high thermal conductivity. Powered primarily by devices such as digital cameras, laptop computers, and wireless communications devices, current the electronics field today is continuously demanding smaller, lighter, and more technologically advanced high performance devices. It has been a problem from such a tendency that the increase in amount of semiconductor-generated heat has a undesirable influence on such devices. Additionally, from a viewpoint of environmental problems, electric vehicles and LEDs are developed actively. One of the principal components for building such devices is Printed Circuit Boards (PCBs). In recent years, PCBs containing alumina fillers with high thermal conductivity have been developed and begun to be widely used. However, when processing these PCBs, the drill tools severely wear because of the filler’s high hardness. We therefore examined the drill wear characteristics and derived the practical drill wear formulas from the results to develop a suitable CAM system. It can be seen that these equations are similar to Taylor’s tool life equation. We also investigated the thermal conductivity effect on temperature during drilling processes. The temperature around the drill hole was shown to be a complex phenomenon according to increasing filler content to PCBs.

scholarly journals A Novel Method to Prepare Transparent, Flexible and Thermally Conductive Polyethylene/Boron Nitride Films

Nanomaterials ◽  
2021 ◽  
Vol 12 (1) ◽  
pp. 111
Author(s):  
Mingming Yi ◽  
Meng Han ◽  
Junlin Chen ◽  
Zhifeng Hao ◽  
Yuanzhou Chen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Self Assembly ◽  
High Performance ◽  
High Thermal Conductivity ◽  
Polyethylene Film ◽  
High Concentration ◽  
Thermally Conductive ◽  
Novel Method

The high thermal conductivity and good insulating properties of boron nitride (BN) make it a promising filler for high-performance polymer-based thermal management materials. An easy way to prepare BN-polymer composites is to directly mix BN particles with polymer matrix. However, a high concentration of fillers usually leads to a huge reduction of mechanical strength and optical transmission. Here, we propose a novel method to prepare polyethylene/boron nitride nanoplates (PE/BNNPs) composites through the combination of electrostatic self-assembly and hot pressing. Through this method, the thermal conductivity of the PE/BNNPs composites reach 0.47 W/mK, which gets a 14.6% improvement compared to pure polyethylene film. Thanks to the tight bonding of polyethylene with BNNPs, the tensile strength of the composite film reaches 1.82 MPa, an increase of 173.58% compared to that of pure polyethylene film (0.66 MPa). The fracture stress was also highly enhanced, with an increase of 148.44% compared to pure polyethylene film. Moreover, the addition of BNNPs in PE does not highly reduce its good transmittance, which is preferred for thermal management in devices like light-emitting diodes. This work gives an insight into the preparation strategy of transparent and flexible thermal management materials with high thermal conductivity.

Sign in / Sign up

Export Citation Format

Share Document