High-performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity, low coefficient of thermal expansion, and low dielectric loss

2011 ◽  
Vol 23 (5) ◽  
pp. 919-928 ◽  
Author(s):  
Yuwen Gao ◽  
Aijuan Gu ◽  
Yicheng Jiao ◽  
Yulu Yang ◽  
Guozheng Liang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Dielectric Loss ◽  
Boron Nitride ◽  
High Performance ◽  
Coefficient Of Thermal Expansion ◽  
Hexagonal Boron Nitride ◽  
High Thermal Conductivity ◽  
Low Dielectric

scholarly journals Dielectric dispersion and superior thermal characteristics in isotope-enriched hexagonal boron nitride thin films: evaluation as thermally self-dissipating dielectrics for GaN transistors

2020 ◽  
Vol 8 (28) ◽  
pp. 9558-9568
Author(s):  
Soon Siang Chng ◽  
Minmin Zhu ◽  
Zehui Du ◽  
Xizu Wang ◽  
Matthew Whiteside ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Conductivity ◽  
Dielectric Loss ◽  
Boron Nitride ◽  
Hexagonal Boron Nitride ◽  
Thermal Characteristics ◽  
Dielectric Dispersion ◽  
Band Gaps ◽  
Optical Band Gaps ◽  
Low Dielectric

The isotope-enriched h-BN films exhibited a dielectrics dispersion with low dielectric loss, below 1.3%. Their optical band gaps depend on isotopic composition (5.54 to 5.79 eV). Thermal conductivity of pure B10/11N are enhanced by around 231%.

scholarly journals High thermal conductivity of high-quality monolayer boron nitride and its thermal expansion

2019 ◽  
Vol 5 (6) ◽  
pp. eaav0129 ◽  
Author(s):  
Qiran Cai ◽  
Declan Scullion ◽  
Wei Gan ◽  
Alexey Falin ◽  
Shunying Zhang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Boron Nitride ◽  
Density Functional ◽  
Heat Dissipation ◽  
Hexagonal Boron Nitride ◽  
High Thermal Conductivity ◽  
Unit Weight ◽  
High Quality ◽  
Dynamic Simulations

Heat management has become more and more critical, especially in miniaturized modern devices, so the exploration of highly thermally conductive materials with electrical insulation is of great importance. Here, we report that high-quality one-atom-thin hexagonal boron nitride (BN) has a thermal conductivity (κ) of 751 W/mK at room temperature, the second largest κ per unit weight among all semiconductors and insulators. The κ of atomically thin BN decreases with increased thickness. Our molecular dynamic simulations accurately reproduce this trend, and the density functional theory (DFT) calculations reveal the main scattering mechanism. The thermal expansion coefficients of monolayer to trilayer BN at 300 to 400 K are also experimentally measured for the first time. Owing to its wide bandgap, high thermal conductivity, outstanding strength, good flexibility, and excellent thermal and chemical stability, atomically thin BN is a strong candidate for heat dissipation applications, especially in the next generation of flexible electronic devices.

scholarly journals Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

2020 ◽  
Vol 4 (3) ◽  
pp. 116
Author(s):  
Maryam Khalaj ◽  
Sanaz Zarabi Golkhatmi ◽  
Sayed Ali Ahmad Alem ◽  
Kahila Baghchesaraee ◽  
Mahdi Hasanzadeh Azar ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Recent Progress ◽  
Phonon Scattering ◽  
Hexagonal Boron Nitride ◽  
High Thermal Conductivity ◽  
Promising Candidate ◽  
Reinforced Composite ◽  
Low Thermal Expansion ◽  
Wide Range

Ever-increasing significance of composite materials with high thermal conductivity, low thermal expansion coefficient and high optical bandgap over the last decade, have proved their indispensable roles in a wide range of applications. Hexagonal boron nitride (h-BN), a layered material having a high thermal conductivity along the planes and the band gap of 5.9 eV, has always been a promising candidate to provide superior heat transfer with minimal phonon scattering through the system. Hence, extensive researches have been devoted to improving the thermal conductivity of different matrices by using h-BN fillers. Apart from that, lubrication property of h-BN has also been extensively researched, demonstrating the effectivity of this layered structure in reduction of friction coefficient, increasing wear resistance and cost-effectivity of the process. Herein, an in-depth discussion of thermal and tribological properties of the reinforced composite by h-BN will be provided, focusing on the recent progress and future trends.

scholarly journals Preparation and properties of MWCNTs-BNNSs/epoxy composites with high thermal conductivity and low dielectric loss

2020 ◽  
Vol 24 ◽  
pp. 100985 ◽  
Author(s):  
Rui Wang ◽  
Congzhen Xie ◽  
Shoukang Luo ◽  
Huasong Xu ◽  
Bin Gou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Loss ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Low Dielectric

Enhanced thermal conductivity and flame retardancy of polyamide 6/flame retardant composites with hexagonal boron nitride

2018 ◽  
Vol 38 (8) ◽  
pp. 767-774 ◽  
Author(s):  
Liang Wang ◽  
Luchong Zhang ◽  
Andreas Fischer ◽  
Yuhua Zhong ◽  
Dietmar Drummer ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Flame Retardant ◽  
Flame Retardancy ◽  
High Performance ◽  
Heat Dissipation ◽  
Hexagonal Boron Nitride ◽  
Light Emitting Diode ◽  
Polyamide 6 ◽  
Twin Screw

Abstract High performance composite of polyamide 6 (PA6)/flame retardant (FR)/hexagonal boron nitride (hBN) was prepared via twin screw extrusion, followed by injection molding. The heat dissipation of the composite was significantly improved by incorporating 40 vol% of hBN, and the corresponding thermal conductivity was up to 5.701 W/(m·K), nearly 17 times that of the PA6/FR composites. In addition, the combination effect of hBN and FR to the flame retardancy of the composites was observed, and the addition of hBN could dramatically enhance the flame retardancy of composites, achieving a UL94 V-0 rating with a limited oxygen index (LOI) value of 37%. This multifunctional modification would broaden the application field of PA6 composites in light-emitting diode (LED) lamps, electronic products, and so on.

scholarly journals Synergistic Effects of Boron Nitride (BN) Nanosheets and Silver (Ag) Nanoparticles on Thermal Conductivity and Electrical Properties of Epoxy Nanocomposites

Polymers ◽  
2020 ◽  
Vol 12 (2) ◽  
pp. 426 ◽  
Author(s):  
Yunjian Wu ◽  
Xiaoxing Zhang ◽  
Ankit Negi ◽  
Jixiong He ◽  
Guoxiong Hu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Properties ◽  
Boron Nitride ◽  
Polymer Composites ◽  
Synergistic Effects ◽  
High Thermal Conductivity ◽  
Epoxy Nanocomposites ◽  
Transfer Path ◽  
Low Dielectric ◽  
Low Permittivity

Polymer composites, with both high thermal conductivity and high electrical insulation strength, are desirable for power equipment and electronic devices, to sustain increasingly high power density and heat flux. However, conventional methods to synthesize polymer composites with high thermal conductivity often degrade their insulation strength, or cause a significant increase in dielectric properties. In this work, we demonstrate epoxy nanocomposites embedded with silver nanoparticles (AgNPs), and modified boron nitride nanosheets (BNNSs), which have high thermal conductivity, high insulation strength, low permittivity, and low dielectric loss. Compared with neat epoxy, the composite with 25 vol% of binary nanofillers has a significant enhancement (~10x) in thermal conductivity, which is twice of that filled with BNNSs only (~5x), owing to the continuous heat transfer path among BNNSs enabled by AgNPs. An increase in the breakdown voltage is observed, which is attributed to BNNSs-restricted formation of AgNPs conducting channels that result in a lengthening of the breakdown path. Moreover, the effects of nanofillers on dielectric properties, and thermal simulated current of nanocomposites, are discussed.

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