Polycrystalline Diamond (PCD) Shaving Dresser: The Ultimate Diamond Disk (UDD) for CMP Pad Conditioning

2019 ◽  
Vol 18 (1) ◽  
pp. 523-528 ◽  
Author(s):  
James C. Sung ◽  
Cheng-Shiang Chou ◽  
Ying-Tung Chen ◽  
Chih-Chung Chou ◽  
Yang-Liang Pai ◽  
...  
Keyword(s):  
Polycrystalline Diamond ◽  
Diamond Disk ◽  
Pad Conditioning

A Truing Technique of Flattening Diamond Grains for Fabricating Microstructures with Fine Surfaces

2008 ◽  
Vol 389-390 ◽  
pp. 350-355
Author(s):  
Takeshi Harada ◽  
Takuya Semba
Keyword(s):  
Surface Roughness ◽  
Electrical Discharge ◽  
Diamond Tool ◽  
Electrical Discharge Machining ◽  
Polycrystalline Diamond ◽  
Mesh Size ◽  
Diamond Disk ◽  
Working Surface ◽  
Work Material ◽  
Tool Profile

A truing technique that can be used to shape the tip of an electroformed diamond tool into a hemisphere and flatten diamond grains on the tool working surface at the same level as the bond face was developed. A polycrystalline diamond disk whose top surface roughened by electrical discharge machining was partially flattened by grinding was used as a truer. Diamond grains on the tool working surface were successfully flattened along the hemispherical tool profile when the grains mesh size of #1000 was employed. In addition, a grinding test using glasslike carbon as a work material revealed that a surface roughness of less than 50 nm Rz could be obtained in both cases when moving the tool on contour and scanning paths.

Blade Diamond Disk for Conditioning CMP Polishing Pad

2010 ◽  
Vol 97-101 ◽  
pp. 3-6 ◽  
Author(s):  
Ming Yi Tsai
Keyword(s):  
Surface Roughness ◽  
Epoxy Resin ◽  
Chemical Mechanical Polishing ◽  
Polycrystalline Diamond ◽  
Mechanical Polishing ◽  
Height Variation ◽  
Surface Textures ◽  
Diamond Disk ◽  
Diamond Conditioner ◽  
The Cost

A diamond conditioner or dresser is needed to regenerate the asperity structure of the pad and recover its designed ability in chemical mechanical polishing (CMP) process. In this paper a new design of diamond conditioner is made by shaping a sintered matrix of polycrystalline diamond (PCD) to form teethed blades. These blades are arranged and embedded in epoxy resin to make a designed penetration angle, called the blade diamond disk. The dressing characteristics of pad surface textures are studied by comparison with conventional diamond conditioner. It is found that the height variation of the diamond tip of blade diamond disk is significantly smaller than the conventional diamond disk. The dressing rate of blade diamond disk is lower than that of the conventional diamond disk, and hence the pad life is prolonged. As a result, reduction of the cost CMP is expected. In addition the pad surface roughness Ra of about 3.79μm is less than Ra of about 4.15μm obtained after dressing using a conventional diamond disk.

Study on Wafer Thinning Characteristics of Ultimate Diamond Disk

2012 ◽  
Vol 591-593 ◽  
pp. 476-479
Author(s):  
Xu Xing Jin
Keyword(s):  
Cutting Tool ◽  
Cutting Tools ◽  
Polycrystalline Diamond ◽  
Depth Of Cut ◽  
Machining Parameters ◽  
Workpiece Material ◽  
Diamond Disk ◽  
Diamond Cutting Tools ◽  
Wafer Thinning ◽  
Wafer Surfaces

Silicon wafer is machined by diamond cutting tools to certain extent, the cutting tool currently used is polycrystalline diamond (PCD). However, as its cutting edges are not leveled to the same height, it will produce different depth of cut and the stress distribution is uneven on wafer surfaces, in the process of wafer thinning, both the workpiece and the cutting tool are probably damaged, this will increase the production cost accordingly. In this paper, a strategy is described to improve the ability of cutting tool for wafer thinning, a cutting tool named Ultimate Diamond Disk (UDD) designed by Taiwan Wheel Company is recommended, which can reduce both the crack of workpiece and the wear speed of cutting tool. Moreover, an experiment on base of different machining parameters including rotation speed of spindle, feed rate and depth of cut was tested and discussed. As a result, the removal mode of workpiece material and the wafer thinning characteristics of UDD are obtained.

Friction Phenomenon in Chemical Mechanical Polishing of Oxide Film

2010 ◽  
Vol 126-128 ◽  
pp. 320-325
Author(s):  
Ming Yi Tsai ◽  
W.Z. Yang
Keyword(s):  
Oxide Film ◽  
Friction Force ◽  
Chemical Mechanical Polishing ◽  
Removal Rate ◽  
Polycrystalline Diamond ◽  
Mechanical Polishing ◽  
Interface Temperature ◽  
Diamond Disk ◽  
The Coefficient Of Friction ◽  
Diamond Conditioner

The friction phenomenon was investigated to explore the relationship between the diamond conditioner, polishing pad and wafer of oxide film in the chemical mechanical polishing (CMP) process. Two kinds of diamond conditioners (disk-A and disk-B) were used. Diamond disk-A used was traditional diamond conditioner containing random shaped diamond grits. Diamond disk-B used was made by sculpturing a sintered polycrystalline diamond to form identically shaped cutting tips. Experimental results reveal that friction force between disk and pad increases with dressing load. But friction force decreases with sliding speed due to increase of sliding speeds resulting in an increase of interface temperature. The coefficient of friction between wafer and pad initially increases with the dressing load, and then it starts to drop slowly with further increases of the dressing load. It was found that removal rate of the oxide film correlates well with the variation of the coefficient of force. In addition disk-B can produce a higher wafer removal rate under a low dressing load.

Effect of Dressing Load and Speed on Removal Rate in the Chemical Mechanical Polishing Process

2011 ◽  
Vol 55-57 ◽  
pp. 832-837
Author(s):  
Ming Yi Tsai ◽  
W.K. Chen ◽  
Hung Jung Tsai
Keyword(s):  
Chemical Mechanical Polishing ◽  
Removal Rate ◽  
Polycrystalline Diamond ◽  
Mechanical Polishing ◽  
Experimental Results ◽  
Polishing Process ◽  
Random Orientation ◽  
Diamond Disk ◽  
Maximum Value ◽  
Chemical Mechanical Polishing Process

A pad conditioner or diamond disk is needed to regenerate the asperity structure of the pad and recover its designated role in the chemical mechanical polishing process. In this paper, the effect of dressing load and speed on removal rate of oxidized wafers were investigated using a polycrystalline diamond disk and brazed diamond disk. It was found that polycrystalline diamond disk enable the manufacturer to tightly control diamond leveling and the cutter’s shape by comparison with a brazed diamond disk that contains discrete diamond grits of random orientation. Experimental results revealed that for polycrystalline diamond disk, the removal rate of oxidized wafer displayed an almost unchanged curve when the load was less than 4kg, but the removal rate of oxidized wafer for brazed diamond disk initially increased with the dressing load, reaching a maximum value at a dressing load of approximately 4 kg. Then, it decreased slowly with further increases of the dressing load. The removal rate of oxidized wafer remains unchanged with dressing speed.

Characterization of homoepitaxial diamond films by Electron microscopy

1991 ◽  
Vol 49 ◽  
pp. 880-881
Author(s):  
D.P. Malta ◽  
S.A. Willard ◽  
R.A. Rudder ◽  
G.C. Hudson ◽  
J.B. Posthill ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Surface Defects ◽  
Substrate Surface ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Polycrystalline Diamond ◽  
Large Degree ◽  
Rf Plasma ◽  
Semiconducting Diamond

Semiconducting diamond films have the potential for use as a material in which to build active electronic devices capable of operating at high temperatures or in high radiation environments. A major goal of current device-related diamond research is to achieve a high quality epitaxial film on an inexpensive, readily available, non-native substrate. One step in the process of achieving this goal is understanding the nucleation and growth processes of diamond films on diamond substrates. Electron microscopy has already proven invaluable for assessing polycrystalline diamond films grown on nonnative surfaces.The quality of the grown diamond film depends on several factors, one of which is the quality of the diamond substrate. Substrates commercially available today have often been found to have scratched surfaces resulting from the polishing process (Fig. 1a). Electron beam-induced current (EBIC) imaging shows that electrically active sub-surface defects can be present to a large degree (Fig. 1c). Growth of homoepitaxial diamond films by rf plasma-enhanced chemical vapor deposition (PECVD) has been found to planarize the scratched substrate surface (Fig. 1b).

Microstructural Study of Diamond Deformed Under High Pressure and Temperature

1985 ◽  
Vol 43 ◽  
pp. 230-231
Author(s):  
E. F. Koch
Keyword(s):  
High Pressure ◽  
High Temperature ◽  
Lattice Structure ◽  
Diamond Particle ◽  
Polycrystalline Diamond ◽  
Sintering Process ◽  
Ion Milling ◽  
Sintered Compact ◽  
Transmission Electron ◽  
High Pressure Sintering

Because of the extremely rigid lattice structure of diamond, generating new dislocations or moving existing dislocations in diamond by applying mechanical stress at ambient temperature is very difficult. Analysis of portions of diamonds deformed under bending stress at elevated temperature has shown that diamond deforms plastically under suitable conditions and that its primary slip systems are on the ﹛111﹜ planes. Plastic deformation in diamond is more commonly observed during the high temperature - high pressure sintering process used to make diamond compacts. The pressure and temperature conditions in the sintering presses are sufficiently high that many diamond grains in the sintered compact show deformed microtructures.In this report commercially available polycrystalline diamond discs for rock cutting applications were analyzed to study the deformation substructures in the diamond grains using transmission electron microscopy. An individual diamond particle can be plastically deformed in a high pressure apparatus at high temperature, but it is nearly impossible to prepare such a particle for TEM observation, since any medium in which the diamond is mounted wears away faster than the diamond during ion milling and the diamond is lost.

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